• Journal of the Korean Wood Science and Technology
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• v.36 no.3
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• pp.24-29
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• 2008

Numerical analysis model was used to analyse the behaviors of multiple bolted connections. Axial-bending element was supposed as basic model, and the effects of frame members and steel fasteners were classified for the behavior analysis. In the condition only two bolts were used, the traditional analytical methods, which show somewhat accuracy, have some advantages more than numerical analysis that need many time consuming, However, more many bolts were used in practical field condition. Also, it is impossible to analyse the behaviors of various bolts layouts and arrangements conditions by traditional analytical methods. Therefore, there is only numerical analysis method for the accurate behavioranalysis on the practical bolted connection condition. Therefore, numerical analysis method was applied on the various multiple bolted connections. On the result exactness and the reflection of connection condition, numerical analysis method showed the superiority more than widely used traditional empirical analysis methods as yield model.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.5
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• pp.1083-1091
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• 1988

Vacuum brazing is the most modern brazing process and is at present, far from being completely understood. By brazing under high vacuum, in an atmosphere free of oxidizing gases, a superior product with greater strength, ductility and uniformity can be obtained. In this study, the influence of brazing parameters such as base metal characteristics, joint clearance and brazing time were described in relation to the metallurgical phenomena and shear strength of vacuum-brazed joints between carbon steels and 304 stainless steel (SUS 304) brazed by copper filler metal. In copper brazing of SUS 304 to a medium carbon steel(M.C.S) the columnar Fe-Cr-Ni-Cu-C alloy structure was formed and grew from the M.C.S side and at the same time, the surface of M.C.S. was decarbonized. The driving force for the formation and growth of columnar structure was the difference of carbon content between base metals. As the joint clearance is narrower and brazing time is longer, the formation and growth of columnar phase and decarburization of carbon steels were more noticeable. Because of decarburization of carbon steels, the shear strength of brazed joints were reduced as the formation of columnar structure was increased.

• Proceedings of the KAIS Fall Conference
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• 2007.05a
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• pp.242-244
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• 2007

본 논문에서는 바다나 강을 가로지르는 대교건설에 있어서 교각의 시공을 돕는 지그설치를 3차원으로 설계하여 시뮬레이션 해봄으로서 대교건설에 소요되는 시간 및 예산을 줄이는데 목적이 있다. 또한 지그의 간섭부위를 미리 예측함으로서 건설엔지니어링의 기술노하우를 강화하고자 한다.

• Journal of Welding and Joining
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• v.5 no.4
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• pp.1-11
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• 1987

라멜라 균열은 복잡한 현상이며 1960년대부터 연구가 되어 왔지만 국내에서는 그 중요성을 인정하면서도 연구가 되지 않았기 때문에 본 해설에서는 라멜라 균열에 대한 전반적인 이해를 돕기 위해, 라멜라 균열에 미치는 인자 및 비금속개재물, 형성기조, 개시온도 및 시간 그리고 방지책과 재료의 라멜라 균열에 대한 민감성을 평가하는 시험 방법과 용접구조물에서 라멜라 균열의 중요성 등을 기술하고저 한다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.26.2-26.2
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• 2006

• Korean Journal of Remote Sensing
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• v.30 no.2
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• pp.251-258
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• 2014

We upgraded to utilize a novel method for combining the analog to digital converter and photon-counting measurements for backscatter photon signal of lidar. We have and improve the standard combining method for determination of those conversion factors between analog to digital converter data and photon-counting data measurement which is conducted dead time correction. The combining method and dead time correction method presented here has been successfully applied to experimental data obtained in Gwangju, Korea.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.1
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• pp.48-57
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• 2007

The fatigue crack growth behavior of a cracked and patch-repaired Ah2024-T3 panel has been monitored by acoustic emission(AE). The overall crack growth rate was reduced The crack propagation into the adjacent hole was also retarded by introducing the patch repair. AE signals due to crack growth after the patch repair and those due to debonding of the plate-patch interface were discriminated by usiag the principal component analysis. The former showed high center frequency and low amplitude, whereas the latter showed long rise tine, low frequency and high amplitude. This type of AE signal recognition method could be effective for the prediction of fatigue crack growth behavior in the patch-repaired structures with the aid of AE source location.

• Journal of the Korean Institute of Intelligent Systems
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• v.17 no.3
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• pp.285-290
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• 2007

In this paper, we presents robust digital redesign (DR) method for observer-based linear time-invariant (LTI) system. The term of DR involves converting an analog controller into an equivalent digital one by considering two condition: state-matching and stability. The design problems viewed as a convex optimization problem that we minimize the error of the norm bounds between interpolated linear operators to be matched. Also, by using the bilinear and inverse bilinear approximation method, we analyzed the uncertain parts of given observer-based system more precisely, When a sampling period is sufficiently small, the conversion of a analog structured uncertain system to an equivalent discrete-time system have proper reason. Sufficiently conditions for the state-matching of the digitally controlled system are formulated in terms of linear matrix inequalities (LMIs).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.5
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• pp.467-471
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• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.