• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.88-93
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• 2008

The bulk-heterojunction polymer solar cell based on regioregular P3HT (poly(3-hexylthiophene)) and PCBM (methanofullerene [6,6]-phenyl $C_{61}$-butyric acid methyl ester) was fabricated. Annealing effects on the crystal structure of polymer-fullerene blends as well as the UV-VIS electronic absorption spectroscopy were investigated. The correlation between the crystal organization of bulk-heterojunction film and the power conversion efficiency of solar cell was studied. Resultantly, the polymer solar cell annealed on $150^{\circ}C$ for 30 min, showed both the enhanced molecular interactions and the optimized crystal structure and displayed the power conversion efficiency of 3.2 %.

• Composites Research
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• v.17 no.6
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• pp.14-21
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• 2004

Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.

• Journal of Adhesion and Interface
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• v.8 no.1
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• pp.15-27
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• 2007

Polyimide (PI) surface modification was carried out by ion-beam treatment and silane-imidazole coupling agent to improve the adhesion between polyimide film and copper. Silane-imidazole coupling agent contains imidazole functional groups for the formation of a complex with copper metal through a coordination bonding and methoxy silane groups for the formation of siloxane polymers. The PI film surface was first treated by argon (Ar)/oxygen ($O_2$) ion-beam, followed by dipping it into a modified silane-imidazole coupling agent solution. The results of X-ray photoelectron spectroscopy (XPS) spectra revealed that the $Ar/O_2$ plasma treatment formed oxygen functional groups such as hydroxyl and carbonyl groups on the polyimide film surface and confirmed that the PI surface was modified by a coupling reaction with imidazole-silane coupling agent. Adhesion between copper and the treated PI film by ion-beam and coupling agent was superior to that with untreated PI film. In addition, adhesion of PI film treated by an $Ar/O_2$ plasma to copper was better than that of PI film treated by a coupling agent. The peeled-off layers from the copper-PI film joint were completely different in chemical composition each other. The layer of PI film side showed similar C1s, N1s, O1s spectra to the original Upilex-S and no Si and Cu atoms appeared. On the other hand the layer of copper side showed different C1s and N1s spectra from the original PI film and many Si and Cu atoms appeared. This indicates that the failure occurs at an interface between the imidazole-silane and PI film layers rather than within the PI layers.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.73-73
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• 2010

합금원소가 다량 첨가된 고합금강, 스테인리스강, Ni기 초내열합금 등은 용접시 혹은 후열처리 동안 열영향부 (HAZ: heat-affected-zone)에서 결정립계를 따라서 액화균열이 종종 발생한다. 이러한 액화균열은 급속한 가열시 HAZ의 결정립계가 국부적으로 용융되어 액상필름을 형성하고, 냉각시 수축으로 인한 인장구속응력에 의해 필름을 따라서 균열이 발생하여 생성된다. HAZ 결정립계 액화는 탄화물, 황화물, 인화물, 보론계 화합물 등이 급가열시 기지와의 반응에 의해 표피 액상을 형성하는 조성적 액화 (constitutional liquation)에 의한 액상의 결정립계 침투로 설명되거나, 결정립계 자체의 용융점을 상당량 낮추는 보론(B), 인(P), 황(S)등의 편석에 의한 국부적 입계 용융으로 주로 연관 지어 해석한다. HAZ 액화균열은 고온 입계균열 현상이므로, 결정립계의 특성에 따라 크게 영향을 받으며 결정립계 character 설계에 의해 액화균열 저항성을 개선시킬 수 있음을 유추할 수 있다. 한편, 본 연구자들은 최근 Ni기 초내열합금에 있어 입계 serration 현상을 새롭게 발견하였으며, 이론적 접근법을 통해 serration을 위한 특별한 열처리 방법을 개발하였다. 형성된 파형입계는 결정학적인 관점에서 조밀 {111} 입계면을 갖도록 분해 (dissociation)되어 낮은 계면에너지를 갖게 됨을 확인하였으며, 입계형상 변화뿐만 아니라 탄화물 특성변화까지 유도하여 크리프 수명을 기존대비 약 40% 정도 향상시킴을 확인하였다. 본 연구에서는 이러한 직선형 입계 대비 'special boundary'로 간주되는 파형입계가 도입될 경우, 보론 편석 및 HAZ 액화거동에 미치는 영향을 고찰하고자 하였다. SIMS (secondary ion mass spectrometry)를 이용하여 열처리 직후 결정립계 보론편석 정도를 비교하였다. 파형입계 시편의 경우, 일반직선형 시편에 비해 결정립계에 보론편석 저항성이 우수함을 확인할 수 있었다. 재현 HAZ 열사이클 시험을 통해 미세조직을 정량적으로 분석하였다. 파형입계 시편 및 일반직선형 시편 모두 최고온도 $1060^{\circ}C$이상부터 입계 탄화물이 기지내로 완전 용해되고 입계가 액화되기 시작하였다. 최고온도별로 입계액화비율을 정량적으로 비교한 결과, 파형입계가 직선입계 대비 훨씬 낮음을 확인할 수 있었으며, 때때로 액화된 필름이 입계를 따라 전파되지 않고 부분적으로 단락되어 있음이 관찰되었다. 액화시험 후 투과전자현미경을 이용한 EDS (energy dispersive spectrometry) 분석을 통해 결정립계 액화의 주요원인은 입계 $M_{23}C_6$의 조성적 액화반응 보다는 보론 편석 (원자 및 $M_{23}(CB)_6$)으로 인한 결정립계 국부용융이 더 유력함을 유추할 수 있었다. 따라서 상기 결과로부터 입계구조가 안정되어 계면에너지가 낮은 파형입계가 보론편석에 대한 저항성이 우수하였으며, 이러한 결과는 액화 저항성에 대응되어 영향을 미침을 알 수 있었다. 게다가 파형입계에 액상 필름이 생성되더라도 낮은 계면에너지에 의해 비롯된 상대적으로 낮은 적심성 (wettability)에 의해 필름이 쉽게 전파되지 않음을 'Smith 입계 wetting 이론'을 이용하여 해석할 수 있었다.

• Journal of Adhesion and Interface
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• v.22 no.2
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• pp.69-77
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• 2021

A variety of efforts are attempted to make the world sustainable in fabrication industries worldwide. To achieve the goals, a new design concept for products is one of crucial factors to be able to dismantle them after use in easy and simple ways. New debonding technologies have been developed in recent years for the recycle and/or repair of bonded structures, where the bonds are broken without the damage of the components and make recycling easier. Some representative technologies of controlled delamination materials (CDM) are reviewed with an emphasis on light induced debonding of adhesives. We also describe current applications of light induced CDMs as temporary bondable films in semiconductor and display industries.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.93-99
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• 2016

In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Membrane Journal
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• v.25 no.6
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• pp.530-537
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• 2015

Photovoltaic (PV) modules are environmentally energy conversion devices to generate electricity via photovoltaic effect of semiconductors from solar energy. One of key elements in PV modules is "Backsheet," a multilayered barrier film, which determines their lifetime and energy conversion efficiency. The representative Backsheet is composed of chemically resistant poly(vinyl fluoride) (PVF) and cheap poly(ethylene terephthalate) (PET) films used as core and skin materials, respectively. PVF film is too expensive to satisfy the market requirements to Backsheet materials with production cost as low as possible. The promising alternatives to PVF-based Backsheet are hydrocarbon Backsheets employing semi-crystalline PET films instead of PVF film. It is, however, necessary to provide improved barrier property to water vapor to the PET films, since PET films are suffering from hydrolytic decomposition. In this study, a polyurethane adhesive with reduced water vapor permeation behavior is developed via a homogeneous distribution of hydrophobic silica nanoparticles. The modified adhesive is expected to retard the hydrolysis of PET films located in the core and inner skin. To clarify the efficacy of the proposed concept, the mechanical properties and electrochemical PV performances of the Backsheet are compared with those of a Backsheet employing the polyurethane adhesive without the silica nanoparticles, after the exposure under standard temperature and humidity conditions.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.21-27
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• 2010

The effect of COG bonding parameters, especially the bonding temperature, on the bonding quality and reliability was investigated in this paper. We measured the bubble area formed in the ACF resin during the bonding process and tried to investigate the relationship between bubble area and bonding peel strength. 85/85 test which exposes a sample to a 85% humidity and $85^{\circ}C$ temperature condition was also carried out. The bubble area was dramatically increased under ~$10^{\circ}C$ lower than recommended bonding temperature. The bubble area formed at the edge of IC chip was larger than the other parts of IC chip. But the peel strength was not associated with the bubble area. High temperature and humid condition made the bubble area larger, but we could not find clear trend of change in the peel strength.

• Polymer(Korea)
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• v.31 no.4
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• pp.308-314
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• 2007

A composite film of polyurethane(PU)-graft-poly(acrylic acid) (PAAc)/polyaniline (PU-g-AAc/PANI) was successfully fabricated for the purpose of adding conductivity on the surface of a general purpose polymer and improving adhesive property between the general purpose polymer and conducting polymer layer. The results from ATR-FTIR and XPS analyses also supported the successful synthesis of the composite film by showing characteristic peaks for every step. A low surface resistivity of $2{\times}10^3\;ohm/sq$ proved the surface conductivity of synthesized PU-g-AAc/PANI film and the surface resistance decreased with increasing the amount of grafted AAc, which acted as a dopant for PANI film.