• Journal of the Korean Society of Propulsion Engineers
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• v.7 no.4
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• pp.73-79
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• 2003

The tensile strength test and the analysis for the section of brazing were performed in the cases of materials used for combustion chamber of regeneratively cooled liquid rocket engine. BNi-2 and BNi-7 based on nickel were used for brazing as filler metal. The properties of material and filler metal were analyzed by tensile strength test and metal microscope for 12 specimens. The tensile-strength of brazing for chrome-copper alloy and other kinds of alloy was higher than that of chrome-zirconium-copper alloy and other kinds of alloy The tensile strength in the case of BNi-2 as filler metal was higher than that of BNi-7 because the wetting property of BNi-2 was better than that of BNi-7.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.314-316
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• 2000

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.102-110
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• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

• Computational Structural Engineering
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• v.7 no.2
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• pp.139-146
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• 1994

In this study, the finite element analysis using joint elements, bolt elements, and shell elements is presented to investigate the behavior of bolted connections. The contact of plates and the high-strength, pretensioned bolts are simply idealized by joint elements and bolt elements, respectively. The initial stiffness is determined through the presented method and the non-linear analysis is archived by a constant-arc-length method based on Newton-Raphson method. The analysis results of a semi-rigid connection(web & flange angles) and a moment connection (shear & moment plates) demonstrate the exactness and applicability of the presented method. And the results indicates that the consideration of slip and 3-dimensional deformation is needed for an accurate prediction of bolted connections.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.5
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• pp.114-122
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• 2007

In high strength bolted joints, the corrosion of base material causes the reduction of slip resistance of the joints. In this study, tensile tests on slip-critical joints utilizing Zn/Al metal spraying corrosion resistance method were carried out in order to prevent the corrosion and meet the required mechanical characteristics of joints. In addition, slip coefficient and surface roughness were calculated. The key parameters were surface finishing condition and thickness of coating with the identical geometry in all specimens. From the results, it is found that the slip coefficient of the joints with coated finish after sand blast treatment as well as those of non-coated joints with only sand blast treatment were similar or superior to 0.45, which is a specification criteria of slip coefficient in friction-typed joints.

• Journal of the Korea Concrete Institute
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• v.27 no.5
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• pp.541-549
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• 2015

This study was conducted to experimentally investigate the seismic retrofitting performance of non-ductile reinforced concrete (RC) frames by introducing engineered cementitious composite (ECC) wing panel elements. Non-ductile RC frame tested in this study were designed and detailed for gravity loads with insufficient or no consideration to lateral loads. Therefore, Non-ductile RC frame were not satisfied on present seismic code requirements. The precast ECC wing panels were used to improve the seismic structural performance of existing non-ductile RC frame. A series of experiments were carried out to evaluate the structural performance of ECC wing panel elements alone a non-ductile RC frame strengthened by adding ECC panel elements. Failure pattern, strength, stiffness and energy dissipation characteristics of specimens were evaluated based on the test results. The test results show that both lateral strength and stiffness were significantly improved in specimen strengthened than non-ductile RC frame. It is noted that ECC wing wall elements application on non-ductile RC frame can be effective alternative on seismic retrofit of non-ductile building.

• Journal of the Korean Institute of Telematics and Electronics
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• v.20 no.3
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• pp.33-39
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• 1983

New Schottky devices with thin stepped oxide layer (about 1000 ${\AA}$) along the edge of metal-semiconductor junction have been designed and fabricated. The breakdown voltages of these diodes have been compared with those of conventional metal overlap and P guard ring Schottky diode structures. Thin stepped oxide layer has been grown by the process of T.C.E. oxidation. In order to compare and demonstrate the improved down phenomena of these devices, conventional metal overlap diode and P guard ring which have the same dimension with new devices have also been integrated in a same New Schottty devices structured with thin stepped oxide layer have shown significant improvement in breakdown phenomena compared with conventional diodes.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.391-396
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• 2010

The pn junction for solar cell was prepared on p-type Si wafer by the furnace using the $POCl_3$ and oxygen mixed precursor to research the characteristic of interface at pn junction. The sheet resistance was decreased in accordance with the increasing the diffusion process time for n-type doping on p-type Si wafer. The electron affinity at the interface in the pn junction was decreased with increasing the amount of n-type doping and the sheet resistance also decreased. Consequently, the drift current due to the generation of EHP increased because of low potential barrier. The efficiency and fill factor were increased at the solar cell with increasing the diffusion process time.

• Journal of the Earthquake Engineering Society of Korea
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• v.2 no.1
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• pp.79-93
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• 1998

The eigenvalue problem is presented for the building with added viscoelastic dampers by using component mode method. The Lagrange multiplier formulation is used to derive the eigenvalue problem which is expressed with the natural frequencies of the building, the mode components at which the dampers are added, and the viscoelastic property of the damper. The derived eigenvalue problem has a nonstandard form for determining the eigenvalues. Therefore, the problem is examined by the graphical depiction to give new insight into the eigenvalues for the building with added viscoelastic dampers. Using the present approach the exact eigenvalues can be found and also upper and lower bounds of the eigenvalues can be obtained.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.7
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• pp.1255-1265
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• 1992

Under uniform heat flow, the thermal stress intensity factors for the interfacial crack on a rigid cusp-type inclusion are determined by Hilbert problem expressed with complex variable. The thermal stress intensity factors are expressed in terms of the periodic function of heat flow angle. When the tip of the interfacial crack meets that of the cusp crack, the thermal stress intensity factors have singularities. The thermal stress intensity factors at the interfacial crack tip located in the distance from the cusp crack tip vary with the location of the interfacial crack tip. From the results of the analysis, the complex potential functions and the thermal stress intensity factors for the cusp-type inclusion without the interfacial crack are derived under the cusp surface boundary conditions insulated or fixed to zero relative temperature.