• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.370-370
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• 2009

이종접합태양전지는 구조적 대칭성 때문에 웨이퍼 두께가 감소하여도 보우잉이 일어나지 않는 특징이 있으며, 산요에서 개발한 이종접합태양전지의 효율이 22% 이상을 보이고 있다. 이종접합태양전지에서 비정질 실리콘과 실리콘 웨이퍼의 계면에 따라 이종접합태양전지의 특성이 크게 변화한다. 본 연구에서는 패시베이션 층으로 사용되는 비정질 실리콘을 hot wire chemical vapor deposition(HWCVD)을 사용하여 이종접합태양전지에 적용하였으며 기존의 plasma-enhanced chemical vapor deposition을 이용한 비정질 실리콘을 적용한 이종접합태양전지와 비교하였다. 패시베이션 특성을 확인하기 위해 quasi-steady state photoconductance로 minority carrier lifetime을 측정하였고, 태양전지 특성평가로는 암전류특성 및 광전류특성을 사용하였다. HWCVD를 사용하여 패시베이션한 태양전지의 경우 16.1%의 효율을 보였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.23-24
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• 1995

기존의 웨이퍼 박막속에 절연박막이 삽입된 SOI(Silicon On Insulator) 웨이퍼 구조와 관련한 반도체 기판 재료가 커다른 관심을 끌어 왔으나, SOI 평가기술은 아직까지 체계적으로 확립된 것이 없으며, DLTS(Deep Level Transient Spectroscopy) 등을 이용한 전기적 평가는 거의 이루어지지 않은 상태이다. 본 연구에서는 직접접합된 웨이퍼를 약 10um내외의 활성화층을 형성시킨 6인치 P-형 SOI 웨이퍼를 제작하여 DLTS로 측정, 평가를 하였고, DLTS 측정후 관찰될 수 있는 에어지 트랩(Energy Trap)과 후속 열처리에서의 트랩의 변화등을 관찰하여, 후속 열처리조건에 따른 접합된 SOI 웨이퍼 계면의 안정화된 조건을 확보하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.81-81
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• 2010

태양광 또는 자연의 힘을 이용한 에너지의 생산은 가까운 미래에 화석연료의 고갈과 이들의 소모로 인해 발행하는 이산화탄소로 인한 지구 온난화등의 문제로 인하여 그 중요성이 점증되고 있는 실정이다. 특히 태양광으로부터 전기에너지를 얻는 발전 방식은 오래전부터 연구되어 왔고 또한 상용화되어 국부적으로 보조 에너지원으로 이용되어 지고 있다. 동작 원리에 따라 이종접합에서 오는 전위차를 이용하는 방법, 동종 물질의 pn접합을 이용하여 기전력을 얻은 방법 및 연료 감응형 종류가 있다. 이 중에서 물질의 이종접합을 이용하는 방법은 아주 오래된 태양전력을 얻는 방식이나 그 동안 연구가 미비하였던 것이 사실이다. 이에 우리는 새로운 재료인 그래핀을 이용하여 산화구리와의 이종접합 태양전지의 제작및 특성을 분석 하였다. 화학기상증착법 (CVD)을 이용해 그래핀을 구리 박편 표면에 성장하였다. 적절한 온도(섭씨 약 1000도)에서 아주 적은 양의 수소 및 메탄을 흘려 주었을때 손쉽게 단일 원자층의 그래핀이 코팅된 구리박편을 얻을 수 있으며, 이 박편을 고온에서 산화 시키면 그래핀은 산화되지 않고 구리만 산화되어 손쉽게 쇼트키타입 태양전지를 얻을 수 있다. 이때 그래핀은 다른 공정 없이 투명전극의 역할을 한다. 간단한 전극을 부착하여 태양전지를 성능을 평가 하였고 그래핀 및 산화구리의 계면효과를 분석하였다. 효율면에서 III-V족 및 실리콘계의 태양전지에 비해 떨어지나 산화구리의 결정화 순도및 산화구리와 금속간의 계면개선 연구를 통해 극복가능 할 것으로 생각된다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Composites Research
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• v.35 no.2
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• pp.86-92
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• 2022

This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2277-2286
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• 2002

The application of bonded dissimilar materials to industries as automobiles, aircraft, rolling stocks, electronic devices and engineering structures is increasing gradually because these materials, compared to the homogeneous materials, have many advantages for material properties. In spite of such wide applications of bonded dissimilar materials, the evaluation method of quantitative strength considering the stress singularities for its bonded interface has not been established clearly. In this paper, the stress singularity for Bctors and the stress intensity factors were analyzed by boundary element method(BEM) for the scarf joints of Al/Epoxy with and without a crack, respectively. From static fracture experiments of the bonded scarf joints, a fracture criterion and a evaluation method of interface strength in bonded dissimilar materials were proposed and discussed.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.4
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• pp.110-116
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.5
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• pp.508-515
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• 2002

The characterization of adhesive property in multi-layer materials has been hot issue for a long time. In order to evaluate adhesive properties, we constructed fully automated system for the backward radiation of leaky Lamb wave. The backward radiation profiles were obtained for the bare steel plate and plates with rubber-loading. The rf waveforms and frequency spectra of backward radiation show the characteristics of involved leaky Lamb wave modes. As the thickness of rubber-loading increased, the amplitude of profile at the incident angle of $13.4^{\circ}$ exponentially decreased. Scanning the incident position over the partially rubber-loaded specimen shows good agreement with the actual rubber-loading. The backward radiation of leaky Lamb wave has great potential to evaluate the adhesive condition as well as material properties of plates.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.