• Title/Summary/Keyword: 접착제 접합

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Failure Mode and Strength of Unidirectional Composite Single Lap Bonded Joints I. Experiments (일방향 복합재료 Single Lap접합 조인트의 파손 모드 및 강도 I. 실험)

  • Kim Kwang-Soo;Yoo Jae-Seok;An Jae-Mo;Jang Young-Soon
    • Composites Research
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    • v.17 no.6
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    • pp.14-21
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    • 2004
  • Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.

A Study on Bonding Process for Improvement of Adhesion Properties Between CFRP-Metal Dual Materials (CFRP/금속간 접합력 강화를 위한 접합공정 연구)

  • Kwon, Dong-Jun;Park, Sung-Min;Park, Joung-Man;Kwon, Il-Jun
    • Composites Research
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    • v.30 no.6
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    • pp.416-421
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    • 2017
  • The structural adhesive have been manufactured for improvement of bonding process between CFRP and metal. The optimal condition for bonding process were investigated by evaluating the lap shear strength with amount of adhesive and curing time and the surface treatment of the CFRP. To confirm proper adhesion conditions, the fracture sections between CFRP and metal was observed using reflection microscope. Not only the improvement of the adhesion condition was important, but surface treatment on CFRP was also important. The optimal curing temperature was at $180^{\circ}C$ for 20 minutes. The improvement for adhesive property was confirmed After surface treatment on CFRP. The optimal amount of structural adhesive for bonding between CFRP and metal was $1.5{\times}10^{-3}g/mm^2$. Through the optimization of bonding process, the improvement of mechanical property over 10% is confirmed in comparison with existing adhesive.

SPRC 강판의 표면전처리 공정에 따른 에폭시 접착부 특성 평가

  • Kim, Hae-Yeon;Kim, Min-Su;Kim, Jong-Hun;Kim, Mok-Sun;Kim, Jun-Gi
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.56.2-56.2
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    • 2011
  • 최근 철강, 알루미늄, 이종재료의 접합 등 용접이 어려운 부분에 구조용 접착제의 적용이 증가하고 있는 추세이다. 이를 위해 변성 에폭시레진을 활용한 고접합 강도, 고인성의 구조용 접착제가 연구되어 지고 있다. 피착제의 표면처리는 접합부의 접합강도를 향상시키는 방법으로 알려져 있으나 최근의 구조용 접착제는 표면 전처리 없이도 우수한 접착 특성을 보이는 것으로 기대되고 있다. 본 연구에서는 변성레진에 대해서 각종 표면처리가 접합부 특성에 미치는 영향을 조사하였다. 피착제로는 자동차용 냉연강판인 SPRC440을 사용하였고, 전처리로는 무처리 상태, SiC연마지를 이용한 연마, 아르곤 및 산소가스를 이용한 마이크로웨이브 플라즈마 표면처리, 산세 등의 표면처리를 실시하였다. 에폭시 접착제는 변성 에폭시 레진과 경화제 및 촉매제를 이용하여 직접 포뮬레이션하였다. 단일 겹치기 전단강도 시험과 T-Peel 시험은 각각 ASTM D 1002 규격에 따라 준비하였으며 인장 시험 후 파면은 SEM으로 관찰하였다.

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Failure Mode and Strength of Unidirectional Composite Single Lap Bonded Joints II. Failure Prediction (일방향 복합재료 Single Lap 접합 조인트의 파손 모드 및 파손 강도 II. 파손 예측)

  • Yi Young-Moo;Kim Chun-Gon;Kim Kwang-Soo
    • Composites Research
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    • v.18 no.1
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    • pp.1-9
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    • 2005
  • A methodology is presented for the failure prediction of composite single-lap bonded joints considering both of composite adherend failure and bondline failure. An elastic-perfectly plastic model of adhesive and a delamination failure criterion are used in the methodology. The failure predictions have been performed using finite element method and the proposed methodology. The failure prediction results such as failure mode and strength have very good agreements with the test results of joint specimens with various bonding methods and parameters. The influence of variations in the effective strength (that is, adhesion performance) and plastic behavior of adhesive on the failure characteristics of composite bonded Joints are investigated numerically. The numerical results show that optimal joint strength is archived when adhesive and delamination failure occur in the same time.

Evaluations of lap shear and peel strength for epoxy and polyurethane adhesive bonded Triplex sheets at cryogenic temperatures (극저온에서 우레탄과 에폭시 접착제로 접착된 트리플엑스의 전단강도과 박리 강도 평가)

  • Shon, Min-Young
    • Composites Research
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    • v.24 no.3
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    • pp.39-45
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    • 2011
  • Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane (PU) and Epoxy adhesives are now being used for liquefied natural gas (LNG) carriers at cryogenic temperatures. This paper presents a comprehensive evaluation of epoxy and PU adhesive bonds between Triplex sheets at normal and cryogenic temperatures. The most significant result of this study is that for all adhesives tested, there is a significant decrease in peel strength at cryogenic temperatures. However, the reasons for the decrease in peel strength for epoxy and PU adhesives differ. Consequently, PU adhesives can be considered better suited for use in applications requiring high bonding performance at cryogenic conditions, such as in LNG carriers.

Effect of Cl Content on Interface Characteristics of Isotropic Conductive Adhesives/Sn Plating Interface (도전성접착제/Sn도금의 계면특성에 미치는 Cl의 영향)

  • Kim, Keun-Soo;Lee, Ki-Ju;Suganuma, Katsuaki;Huh, Seok-Hwan
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.3
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    • pp.33-37
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    • 2011
  • In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging (마이크로시스템 패키징에서의 도전성 접착제 접속 기술)

  • Kim Jong-Min;Lee Seung-Mock;Shin Young-Eui
    • Journal of Welding and Joining
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    • v.23 no.2
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    • pp.18-22
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    • 2005
  • 전자패키징을 포함한 마이크로시스템 패키징의 재료 및 어셈블리 기술에 관련한 도전성 접착제 및 접속 기술을 개략적으로 소개하였다. 이와 같은 도전성 접착제 및 접속 기술은 종래 사용되어 왔던 Pb 솔더의 환경, 인체에의 악영향 등으로 인한 무연(Pb-free) 솔더의 개발과 함께 차세대 솔더의 대체 재료 및 접속 기술로서 주목받고 있다. 도전성 접착제는 이미 반도체 집적회로를 기판에 접합하는 등 널리 사용되고 있지만 최근 도전성 접착제에 대한 수요와 시장 규모가 증가하는 추세이며 더 나아가 그 응용 범위가 점차로 확대되어 가고 있다. 특히 국제적 규약에 의한 무연 솔더의 사용이 의무화됨에 따라 전기적 접속성, 열 도전성, 접합성 등 기본 솔더에 버금가는 특성을 확보하기 위한 새로운 재료의 개발 및 공정에 대한 연구가 필요하다. 선진국에서는 이러한 기술의 필요성을 인식하고 많은 연구 인력, 시설 및 정보 공유 등을 통해 활발한 투자와 연구개발이 진행되고 있다. 이에 한국에서도 국제 경쟁력을 향상시키고 차세대 첨단 산업 분야의 신기술 확보를 위해 체계적인 연구 활동을 위한 노력이 절실히 요구된다.

Adhesive Strength and Interface Characterization of CF/PEKK Composites with PEEK, PEI Adhesives Using High Temperature oven Welding Process (고온 오븐 접합을 적용한 PEEK, PEI 기반 CF/PEKK 복합재의 접착 강도 및 계면 특성 평가)

  • Park, Seong-Jae;Lee, Kyo-Moon;Park, Soo-Jeong;Kim, Yun-Hae
    • Composites Research
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    • v.35 no.2
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    • pp.86-92
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    • 2022
  • This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

Experimental Study on Pull-out Strength of Glued-in Rods Connection according to Adhesive (접착제에 따른 Glued-in Rod 접합부 인발성능에 관한 실험 연구)

  • Park, Keum-Sung;Oh, Keunyeong
    • Journal of the Korea Institute of Building Construction
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    • v.22 no.2
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    • pp.149-160
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    • 2022
  • In this study, a pull-out test considering the adhesive type, embedded length, and direction of re-bar was conducted to evaluate the pull-out performance of glued-in rod joints using timber and adhesive produced in Korea. In the test, the specimens using liquid adhesive showed better pull-out performance, and the longer the embedded length of the re-bar, the higher the maximum tensile load by inducing the yield of the re-bar first. Through the test results, a glued-in rod joints design, which is advantageous to design the adhesive strength stronger than the yield strength of re-bar, was proposed, and a correction factor of 0.75 for the adhesive strength considering construction error was also suggested.

Properties of Semi-Solid Epoxy Adhesives (반고체헝 에폭시 접착제의 특성)

  • 조석형;안태광;홍영호;김영준;전용진
    • Proceedings of the KAIS Fall Conference
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    • 2000.10a
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    • pp.237-240
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    • 2000
  • 본 연구에서는 비스페놀 A, 에피크로로히트린을 반응시킨 에폭시 기본주제를 중심으로 경화제, 희석제, 충진제, 촉매 등을 배합하여 토목, 건축용 반고체형 에폭시 접착제를 개발하였다. 여기서 특히 에폭시 주제와 희석제의 종류 및 배합비율에 따른 기본 물성, 접착성능 등을 측정하였다. 상온 경화 특성을 측정하기 위하여 경화시 간을 측정한 결과 희석제의 종류와 관계없이 희석제의 양이 증가할수록 경화시간이 증가하고 경화온도도 증가하는 경향을 알 수 있었으며 촉매의 양이 적을 경우가 경화시간이 빠른 것을 알 수 있었다. 또한 경화 시간은 30분 내지 40분 정도로 상온에서 사용할 수 있을 것으로 기대한다. 접착력 시험 결과는 촉매의 양이 적당한 때 가장 좋은 접착력을 나타내고 희석제 중에서 HDGE의 경우가 가장 좋은 접착력을 나타내었고 희식제의 양이 증가할수록 접착력은 증가하였다. 실리카와 철분을 섞어 반고체형 에폭시 접착제를 제조한 경우 기존의 제품보다 우수한 접착력을 나타내었다. 따라서 본 연구에서 개발한 반고체형 접착제는 제조공정 코스트 등에 대한 검토와 함께 제품화하여 토목, 건축 분야의 콘크리트 균열 접착, 볼트와 콘크리트의 접합, 목재의 접합 등에 간편하게 사용될 수 있으며, 배합물질과 비율에 따라 전기전자. 토목건축, 자동차산업 등의 산업용 접착제로서 응용될 수 있을 것으로 기대된다.