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Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging  

Kim Jong-Min (중앙대학교 기계공학부)
Lee Seung-Mock (오사카부립 산업기술총합연구소)
Shin Young-Eui (중앙대학교 기계공학부)
Publication Information
Journal of Welding and Joining / v.23, no.2, 2005 , pp. 18-22 More about this Journal
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