• Title/Summary/Keyword: 접착제의 두께

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The effect of adhesive thickness on microtensile bond strength to the cavity wall (와동벽에서 접착제의 두께가 미세인장 결합강도에 미치는 영향)

  • Lee, Hwa-Eon;Kim, Hyeon-Cheol;Hur, Bock;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.32 no.1
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    • pp.9-18
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    • 2007
  • The purposes of this study were to examine the variability of adhesive thickness on the different site of the cavity wall when used total-etch system without filler and simplified self-etch system with filler and to evaluate the relationship between variable adhesive thickness and microtensile bond strength to the cavity wall. A class I cavity in six human molars was prepared to expose all dentinal walls. Three teeth were bonded with a filled adhesive, $Clearfil^{TM}$ SE bond ana the other three teeth were bonded with unfilled adhesives, $Scotchbond^{TM}$ Multi Purpose. Morphology and thickness of adhesive layer were examined using fluorescence microscope. Bonding agent thickness was measured at three points along the axial cavity wall edge of cavity margin (rim). halfway down each cavity wall (h1f), internal angle of the cavity (ang). After reproducing the adhesive thickness at rim, h1f and ang, micro-tensile bond strength were evaluated. For both bonding agents, adhesive thickness of ang was significantly thicker than that of rim and h1f (P <0.05). As reproduced the adhesive thickness, microtensile bond strength was increased as adhesive thickness was increased in two bonding agents. Adhesive thickness of internal angle of the cavity was significantly thicker than that of the cavity margin and the halfway cavity wall for both bonding agents. Microtensile bond strength of the thick adhesive layer at the internal angle of the cavity was higher than that of the thin adhesive layer at 1,he cavity margin and the halfway cavity in the two bonding systems.

A study on the Conversion Loss by the Thickness of the Bonding Medium in the Elastic Delay Lines. (탄성파지연선에서 접착제의 두께에 의한 변환손실에 관하여)

  • 김종상;이전영
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.13 no.6
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    • pp.1-6
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    • 1976
  • In this paper, the methode of calculating conversion loss is proposed by considering the thickness of bonding medium between electrode and delay material in the vibrator of Elastic delay lines. As the result of computations using digital computer, it is shown that the thickness of bonding medium must be less than about 1/100 of the thickness of vibrator and when the thickness of electrode is about 1110 of vibrator, the center fnequency is shifted. When the thickness of bonding medium is equal to or more than the thickness of vibrator, the 리uctuations in frequency Bandwidth become larger and larger.

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Effects of the Adhesive Thickness and Residual Thermal Stress on the Torque Capacity of Turbular Single Lap Joints (접착제의 두께와 열 응력에 따른 조인트의 토크 특성)

  • 최진호;이대길
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.10
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    • pp.1841-1852
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    • 1992
  • With the wide application of fiber-reinforced composite material in aircraft, space structures and robot arms, the design and manufacture of composite joints have become a very important research area because they are often the weakest areas in composite structures. In this study, the effects of the adhesive thickness, residual thermal stress on the torque capacity of the tubular single lap joints were studied. The torque capacity of the adhesive joints were experimentally determined and found to be inversely proprotional to the adhesive thickness. In order to match the experimental results to the theoretical analyses, the elastic-perfectly plastic material properties of the adhesive were used in the closed form solution. Also, the residual thermal stress of the joints were calculated by the finite element method and it was proved that the residual thermal stress could play an important role in the thick adhesive joints.

Strength of sandwich-to-laminate single-lap bonded joints in elevated temperature and wet condition (샌드위치와 적층판을 접착한 단일겹침 체결부의 고온습도 강도특성 연구)

  • Choi, Bae-Hyun;Kweon, Jin-Hwe;Choi, Jin-Ho;Shin, Sang-Jun;Song, Min-Hwan
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.38 no.11
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    • pp.1115-1122
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    • 2010
  • The main objective of this study is to experimentally investigate the effect of adhesive thickness and environmental conditions on the failure and strength of sandwich-to-laminate bonded joints. Three different adhesive thicknesses (t=0.2, 2 and 4 mm) and two different environmental conditions were considered. Environmental conditions include the RTD(room temperature and dry condition) and ETW(elevated temperature and wet condition). Test results show as the adhesive thickness increases from 0.2 mm to 2 and 4 mm, the joint strength decreases 16 and 30%, respectively. Regarding the effect of environmental conditions, except for one case, the joint strength in the ETW conditions turned out to be 12% higher than those in the RTD conditions. In the joints with adhesive thickness of 0.2 mm, remarkable difference from RTD condition was not found.

THE EFFECTS OF DENTIN BONDING AGENT THICKNESS ON STRESS DISTRIBUTION OF COMPOSITE-TOOTH INTERFACE : FINITE ELEMENT METHOD (상아질 접착제의 두께가 치아와 복합레진 경계의 응력발생에 미치는 영향에 관한 유한요소법 연구)

  • Park, Sang-Il;Kim, Ye-Mi;Roh, Byoung-Duk
    • Restorative Dentistry and Endodontics
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    • v.34 no.5
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    • pp.442-449
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    • 2009
  • The aim of this study was to examine that thick dentin bonding agent application or low modulus composite restoration could reduce stresses on dentin bonding agent layer. A mandibular first premolar with abfraction lesion was modeled by finite element method. The lesion was restored by different composite resins with variable dentin bonding agent thickness ($50{\mu}m$, $100{\mu}m$, $150{\mu}m$). 170N of occlusal loading was applied buccally or lingually. Von Mises stress on dentin bonding agent layer were measured. When thickness of dentin bonding agent was increased von Mises stresses at dentin bonding agent were decreased in both composites. Lower elastic modulus composite restoration showed decreased von Mises stresses. On root dentin margin more stresses were generated than enamel margin. For occlusal stress relief at dentin boning agent layer to applicate thick dentin bonding agent or to choose low elastic modulus composite is recommended.

The effect of denture adhesives on the retention of complete denture (의치 접착제가 총의치의 유지력에 미치는 영향에 관한 연구)

  • Yoon, Yu-Mi;Choi, Yu-Sung;Lee, Joon-Seok
    • The Journal of Korean Academy of Prosthodontics
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    • v.48 no.2
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    • pp.87-93
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    • 2010
  • Purpose: The purpose of this study was to compare the retention of the two denture adhesives with a silicone edentulous model and a resin denture base in vitro study. Material and methods: The experimental groups were used two denture adhesives and classified into 5 subgroups each. Subgroups were divided by the number of times the saliva sprayed. The control group was used synthetic saliva only. Dislodging tensile strengths were applied to the resin denture base using Instron in 3 directions ; vertical, lateral, and anterior-posterior. Results: The retention of two denture adhesives was increased significantly than saliva alone (P <.05). In each denture adhesives, the retention of saliva sprayed first was decreased than denture adhesive alone, but it didn't have significant differences. Whenever saliva sprayed repeated, the retention was decreased significantly than saliva sprayed first (P <.05). In each denture adhesives, vertical retentive force was highest than lateral and anterior-posterior retentive forces, and anterior-posterior retentive force was higher than lateral retentive force. This results were significantly different (P < .05). Significant differences of the retentive ability among two denture adhesives were not observed. Conclusion: From the results, use of the denture adhesives resulted in improved retentive ability of denture. Especially retentive force was highest in vertical direction.

Study on the Scap-cure Behavior of Adhesive for Flip-chip Bonding (플립칩 본딩용 접착제의 속경화 거동 연구)

  • Lee, Jun-Sik;Min, Kyung-Eun;Kim, Mok-Sun;Lee, Chang-Woo;Kim, Jun-Ki
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.78-78
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    • 2010
  • 모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

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Heating Behavior and Adhesion Property of Epoxy Adhesive with Nano and Micro Sized Fe3O4 Particles (Nano 및 Micro 크기의 Fe3O4 분말이 첨가된 열경화성 에폭시 접착제의 유도가열 및 접착 특성)

  • Hwang, Ji-Won;Im, Tae-Gyu;Choi, Seung-Yong;Lee, Nam-Kyu;Shon, Min-Young
    • Composites Research
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    • v.33 no.2
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    • pp.55-60
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    • 2020
  • A study on the heating behavior and adhesion property of structural epoxy adhesive through induction heating have been conducted. An adhesive for induction heating was manufactured through mixing with nano and micro sized Fe3O4. From the results, it was observed that induction heating is less affected by adherend (GFRP) thickness than oven heating. The heating rate of Fe3O4 embedded epoxy adhesive using induction heating much higher than that of oven curing process and it is more appreciable when the contents of Fe3O4 increased. Furthermore, adhesion strength increased with increase of Fe3O4 particle contents.

EFFECT OF AN INTERMEDIATE BONDING RESIN AND FLOWABLE RESIN ON THE COMPATIBILITY OF TWO-STEP TOTAL ETCHING ADHESIVES WITH A SELF-CURING COMPOSITE RESIN (자가 중합 복합 레진과 두 단계 산 부식 접착제의 친화성에 대한 중간 접착제와 흐름성 레진의 효과)

  • Choi, Sook-Kyung;Yum, Ji-Wan;Kim, Hyeon-Cheol;Hur, Bock;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.34 no.5
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    • pp.397-405
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    • 2009
  • This study compared the effect of an activator, intermediate bonding resin and low-viscosity flowable resin on the microtensile bond strength of a self-curing composite resin used with two-step total etching adhesives. Twenty extracted permanent molars were used. The teeth were assigned randomly to nine groups (n=10) according to the adhesive system and application of additional methods (activator, intermediate adhesive, flowable resin). The bonding agents and additional applications of each group were applied to the dentin surfaces. Self-curing composite resin buildups were made for each tooth to form a core, 5mm in height. The restored teeth were then stored in distilled water at room temperature for 24h before sectioning. The microtensile bond strength of all specimens was examined. The data was analyzed statistically by one-way ANOVA and a Scheffe's test. The application of an intermediate bonding resin (Optibond FL adhesive) and low-viscosity flowable resin (Tetric N-flow) produced higher bond strength than that with the activator in all groups. Regardless of the method selected, Optibond solo plus produced the lowest ${\mu}TBS$ to dentin. The failure modes of the tested dentin bonding agents were mostly adhesive failure but there were some cases showed cohesive failure in the resin.