• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.1
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• pp.1-5
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• 2019

In this paper, the experimental study and finite elements analysis were conducted on homogeneous and dissimilar metals single lap-shear bonded joints to investigate the factor that affect the joint failure load. It was found that factors which have the significant effects on the failure load of the joint was stiffness of the adherends. And from experimental results, it can be confirmed that the failure load increases linearly with overlap length increases. And the failure load of dissimilar metal joints is approximately 1KN(10~17%) larger than homogeneous metal joints. In order to confirm this phenomenon, the stress distribution and strain distribution of the specimens were analyzed through the finite element analysis. The difference between homogeneous metals joints and dissimilar metals joints is that stress and strain in adhesive are concentrated at the end of the overlap zone close to aluminium which has lower rigidity than aluminium in case of dissimilar metals joints. From high rigidity of steel, the stress concentration in bonds are decreased and it cause increase of the failure strength at dissimilar metal joints.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.1-8
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• 2019

The demand and importance of adhesives and paint coatings applied to solid surfaces such as metals, ceramics, and plastics are increasing. In this study, the influencing factors on the adhesive strength between the polymer coating and the metal adherend were investigated by Dolly test when the adhesive or the paint coating was applied on the metal adherend. Two-component epoxy adhesive was used as the adhesive, and EH2350, a two-component epoxy paint for anti-corrosion, was used as the paint. Especially, the effect of adherend metals(Al, Fe, STS, Cu, Zn), surface roughness and surface contamination(tap water, salt water) on adhesive strength was studied as influencing factors. The adhesive strength between adhesive and adherend was different when the type of metal adherend was different even when the same adhesive was used. It was found that spray water cleaning was necessary before the paint coating process on the surface of the oxide contaminated adherend with tap water or salt water. As a result of this study, it was confirmed that Dolly test can be widely used in the future to measure adhesive strength between paint coating and adherend.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.23-28
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• 2019

In this study, the micro- and nano-particles were used and their shapes were transferred into the polydimethylsiloxane (PDMS) film to fabricate the dry adhesives and their properties were investigated. The Cu nanoparticles of the sizes of 20 nm, 40 nm and 70 nm and the polymethylmethacrylate (PMMA) beads of the size of $5{\mu}m$ were used to transfer their images and the resultant properties of the dry adhesives were compared. The effects of particle size and materials on the mechanical property, tensile adhesion strength, light transmittance, surface morphology, water contact angle were studied. The dry adhesives obtained from the transfer process of Cu nanoparticles with the size of 20 nm resulted in the enhancement of tensile adhesion strength more than 300% compared to that of the bare PDMS. The formation of nanostructure of large surface area on the surface of the PDMS film by the Cu nanoparticles may responsible for the improvement. This study suggests that the use of nanoparticles during the fabrication of PDMS dry adhesives is easy and effective and could be applied to the fabrication of the medical patch.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• The korean journal of orthodontics
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• v.32 no.4 s.93
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• pp.293-300
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• 2002

The purpose of this study was to evaluate the clinical effectiveness of hydrophilic primer, which claim to retain adequate bond strength on moistened enamel resulting from moisture or saliva contamination, by comparing the shear bond strength and adhesive failure patterns of brackets bonded using hydrophilic primer and conventional hydrophobic primer. Brackets were bonded to human premolars embedded in metal cylinders utilizing light cured adhesive, primed with either a hydrophilic primer(Transbond fm primer) or a conventional hydrophobic primer(Transbond XT primer). Each sample was exposed to varying degrees of artificial saliva contamination during the priming process. The shear bond strength was measured using a universal testing machine, and the adhesive failure patterns after debonding were visually examined by strereomicroscope and assessed using the adhesive remnant index(ARI). The results were as follows 1. In dry conditions, no significant differences in shear bond strength between Transbond W and Transbond XT primers were found. 2. Transbond MIP primer exhibited a significantly higher shear bond strength than Transbond XT primer in saliva-contaminated conditions, regardless of the degree of contamination. 3. When contaminated with one coat of saliva, Transbond MIP primer did not exhibit significant differences in shear bond strength compared to the dry condition. When contaminated with two coats of saliva, Transbond MIP primer exhibited a singnificantly lower shear bond strength compared to the dry condition. 4. The adhesive remnant index of the adhesive failure pattern had a tendency to decrease, as the degree of saliva contamination increased. Bracket-adhesive interface failure was observed in more than half of the saliva contaminated samples utilizing Transbond MIP primer, whereas the bond failure sites of the Transbond XT primer samples occurred almost exclusively at the adhesive-enamel interface in saliva-contaminated conditions. The results of this study suggest that in cases where moisture control is difficult, Transbond MIP primer is an effective alternative to conventional hydrophobic primers.

• The korean journal of orthodontics
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• v.33 no.1 s.96
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• pp.51-61
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• 2003

The purpose of this study was to evaluate the effects of a self-etching primer on the shear bond strength of orthodontic brackets and on the failure pattern of bracket-adhesive interfaces in dry or wet condition. Brackets were bonded to extracted human teeth according to one of three experimental protocols. In the Group P, teeth were etched with $37\%$ phosphoric acid. After the Transbond XT Primer was applied onto the etched surfaces, the brackets were bonded with Transbond XT(3M, Unitek, Monrovia, Calif) and light cured for 40 seconds. In the Group SD, a self-etching primer(3M, Unitek, Monrovia, Calif) was placed on the enamel for 3 seconds and gently evaporated with air, as suggested by the manufacturer. The brackets were then bonded with Transbond XT as in the Group P In the Group SW, artificial saliva was applied to the enamel surface for 10 seconds to allow complete hydration of the surface before application self-etching primer The brackets were then bonded following the procedures of Group SD. Each group was divided into 2 sub-groups(0.5h, 24h) according to debonding time. Shear bond strengths were measured by Instron universal testing machine. After debonding, the teeth and brackets were examined under scanning electron microscope and assessed with the adhesive remnant index. The result obtained were summarized as follows ; 1. The shear bond strengths were high enough to use clinically in all testing groups, but the shear bond strengths of Group SD and SW were significantly lower than Group P(p<0.05). 2. With respect to comparison of debonding time, 24h debonding samples exhibited heigher shear bond strength than 0.5h debonding samples in Group P, SD and SW(p<0.05). 3. In the self etching primer groups(Group SD and Group SW), there was no significant difference in mean shear bond strength between under dry and wet state(p>0.05). 4. There was a greater frequency of ARI score of 0 and 1 with the Group P. On the other hand, there was a higher frequency of ARI scores of 2 and 3 with Group SD and Group SW(p<0.05).

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.3
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• pp.527-533
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• 2004

One clinical technique recommended for improving marginal integrity is "rebonding" or application of unfilled resins to the surface of composite restoration. But continuously the restorations are affected with occlusal load. There is room for doubt that the rebonding agent has the positive effect on microleakage in spite of the stress generated by the occlusal load. This study determined the effect of rebonding on microleakage of Class V resin composite restorations under load cycling. Class V cavities were prepared on the buccal surface of 40 sound extracted premolars and restored with a hybrid light-cured resin composite according to manufacturers' directions. They were randomly divided into two groups consisting of 20 samples: a control(group I), without surface sealing, and the other group(group II) in which margins were etched and rebonded. After thermocycling, each of groups was divided into subgroups(group A, B), and load cycling(total 100,000 cycles with 4-100N load at a rate of 1 Hz) were applied on the group B. Assessment of microleakage utilized methylene blue dye penetration. The following results were obtained: 1. In the occlusal region, no significant difference was noted in the scores regardless of whether or not the rebonding agent was used(group TA-IIA, IB-IIB)(p>0.05). 2. In the cervical region, the control group with rebonding(group IIA) showed the better result than the group without rebonding(group IA)(p<0.05). 3. In the cervical region, the rebonded group with load cycling(group IIB) showed similar results to the group without rebonding(group IB) and no significant difference was noted(p>0.05).