• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.4
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• pp.496-503
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• 2003

An experimental study has been performed on thermal transport from an aluminum foam heat sink under a confined impinging air jet. Three kinds of aluminum foam heat sinks with 10, 20 and 40 PPI and a conventional pin-fin heat sink are tested in the present study. The jet Reynolds number is varied in the range of Re=667～5672 The effect of the confinement disk diameter and the distance between the confinement disk and the heater surface on the averaged Nusselt number is investigated in detail. The results are also compared with those of the unconfined impinging air jet. The critical distance, at which thermal performance shows a minimum compared to the unconfined jet impinging, will be described in terms of the Reynolds number and the pore density of the aluminum foam.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.2
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• pp.438-444
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• 1993

The circuit board of an electronic equipment were simulated with a vertical channel which had thermal blocks protruded from one of the channel walls. A rought front plate was made of a circuit board attached with short wires to simulate the back side of a printed circuit board. Natural convection experiments were carried out to study the effects of channel space and rough front plate and to find the suitable characteristic value after the fourth row. The effect of a rough front plate was negligble. There were negligible effects of the channel space on the first and second heaters. Heat transfer coefficients after the third row decreased as the channel space decreased. Heat transfer coefficients were almost constant for larger than 20 mm channel space. A characteristic length was suggested to non-dimensionalize Nu and Ra numbers in a vertical channel with protruded heaters. A correlation was obtained using the new characteristic lengths.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.725-728
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• 2002

A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

• Journal of Advanced Marine Engineering and Technology
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• v.22 no.6
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• pp.844-853
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• 1998

Natural and forced convection experiments were carried out in order to investigate the effects of channel spacing gap between protrusions and number of rows of protrusion, In natural convection the optimum channel spacing was found to be approximately 20mm regardless of the protrusion gaps. For optimum channel spacing the heat transfer coefficients were converged to an asymptotic value after the fourth row. The heat transfer coefficient for each row approaches to constant values for protrusion gaps larger than 10 mm. An experimental correlation has been suggested by using a modified Rayleigh number based on the dimensionless characteristic length(G/L). In forced convec-tion the heat transfer coefficients were not merged to an asymptote until the fifty row and increases as the channel spacing at the constant Reynolds number decreases.

• Journal of Energy Engineering
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• v.3 no.1
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• pp.62-69
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• 1994

화염중에 존재하는 이온 및 전자의 전기적 성질을 이용하여 연소실내의 화염전파속도를 파악하기 위해 실린더 헤드에 이온 프로브를 삽입하여 천연가스 및 가솔린의 화염전파속도를 측정하였다. 본 연구에 이용된 이온전류장치 설계에 의한 방법은 광학적 측정 장비에 비해 간단하며 쉽게 측정할 수 있고 가격도 저렴하고 응답성도 우수하였다. 이온 프로브의 제작과 신호처리에 관한 기초적인 지식을 얻었으며 천연가스 및 가솔린의 연소시 연소압력의 상승지점과 이온발생지점이 일관성있게 나타났다. 기관회전수의 증가에 따라서 연소실내의 화염전파속도가 증가했으며 같은 연소조건이라고 할 수 있는 동일 기관회전수, 당량비의 조건에서 점화시간에 대한 화염전파속도를 비교해 보면 메탄의 경우가 이론치보다 6 ms∼9 ms 정도 늦었다. 또한, 메탄가스 및 가솔린에 대해 이온 전류강도 및 화염 도달시간을 측정하였으며 연소실 벽면에서는 열전달에 의한 냉각효과로인해 화염 전파속도 및 이온농도가 감소했다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.61-67
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• 2003

The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about $46{\mu}m$ in diameter, was fabricated by using the lift-off method and reflowed using the rapid thermal annealing (RTA) system. The intermetallic compounds were characterized using a secondary electron microscopy (SEM), an energy dispersive spectroscopy (EDS), and an x-ray diffractometer (XRD). The faceted and polygonal intermetallic compounds were found in the Bi-Sn solder bumps on $Au(0.1{\mu}m)/Ni/Ti$ UBM and they were indentified as $(Au_xBi_yNi_{1-x-y})Sn_2$ Phase. The intermetallic compounds grown from the $Au(0.1{\mu}m)/Ni/Ti$ UBMinterface were dispersed in the solder bump.

• Proceedings of the Korea Crystallographic Association Conference
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• 2002.11a
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• pp.22-23
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• 2002

Titanium은 높은 강도, 낮은 밀도, 부식에 대한 저항 등, 타 금속에 비해 월등히 뛰어난 성질을 가지고 있기 때문에 산업 전반에 거쳐 그 응용이 크게 증가하고 있으며, 특히 고온에서의 응용이 중요성을 띠게 됨에 따라 고온으로의 상전이 관계에 따른 구조적 규명이 필요하다. 순수한 titanium은 상온에서 조밀충진 육방정계의 α-상구조(a=2.953Å, c=4.683 Å, P6₃/mmc)를 이루고 있으나, 대략 880℃ 이상에서는 β-상의 체심입방정계 (a=3.320Å, Im3m)로 상전이가 되는 것으로 알려져 있다. 이에 대한 대부분의 연구가 kinetics와 thermodynamics에 관련되어 있으며, TEM을 이용한 직접가열실험은 거의 전무한 상태이다. 본 실험에서는 TEM 직접가열을 통하여 titanium의 고온에서의 상전이와 가열시 발생할 수 있는 산화층 형성을 연구하였다. TEM 시편은 순도 99.94％의 titanium foil(Alfa Aesar, ＃00360, 0.025mm thick)를 이용하였고, 분석 장비로는 에너지여과 기능이 있는 TEM(EM912 Omega, Carl Zeiss)과 Gatan사의 double-tilt heating holder를 사용하였다. Titanium의 상전이를 관찰하기 위해 900℃ 까지 분당 10℃ 의 속도로 가열을 하였다. 통계적 분석 오차를 줄이기 위해 서로 다른 4군데의 관찰영역을 선택하여, 상온 - 600℃ - 900℃ - 상온의 단계별로 회절패턴을 관찰 및 기록하였고, 발생 가능한 산화에 대해서는 동일한 장비를 사용하여 EDS 분석을 하였다. 상온에서의 서로 다른 영역의 회절패턴들은 결함의 존재에 상관없이, 온도가 증가함에 따라 그 결함수가 증가하게 된다. 특히 600℃ 에서는 쌍정과 관련된 회절점들이 본래의 회절점 주위에 형성되어있지만, 각 면들의 격자상수의 변화는 나타나지 않았다. 그러나 900℃ 에서는 쌍정에 의한 회절점의 수가 증가하며, 회절점 사이에 발달한 뚜렷한 막대모양의 강도분포와 격자상수의 변화를 관찰할 수 있었다. 다시 상온으로 냉각시킨 후 관찰한 각각의 회절패턴에서는 격자 상수의 감소와 함께 900℃에 보여진 막대 모양의 강도분포와 쌍정에 의한 회절점들이 여전히 남아있었다. EDS분석 결과 가열 실험을 통해 시편이 열적 산화가 되어 있음을 확인 할 수 있었다. 순수한 titanium의 α-상에서 β-상으로의 상전이를 파악할 수 있는 격자상수의 변화자체는 매우 작은 값이기 때문에 상온과 900℃ 에서 기록된 전자회절패턴 상에서의 면간거리와 면간각도의 측정만으로는 상전이 여부를 명확히 구별할 수 없었다. 그러나, 결함에 의한 상변화가 900℃ 에서 심하게 관찰되어지는 것은 상전이와 관계가 있는 것으로 볼 수 있다. 고온에서 상온으로의 가역적 반응을 관찰할 수 없었던 이유는 열적산화로 생긴 산화층의 산소원자들이 고온의 상전이 과정 중에 Ti 원자와 반응이 일어나 TiO/sub X/ 구조로 전이되었기 때문으로 추정하고 있다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.12
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• pp.3329-3343
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• 1995

The interaction of mixed convection and surface radiation in a printed circuit board(PCB) is investigated numerically. The electronic equipment is modeled by a two-dimensional channel with three hot blocks. In order to calculate the turbulent flow characteristics, the low Reynolds number k-.epsilon. model which is proposed by Launder and Sharma is applied. The S-4 approximation is used to solve the radiative transfer equation. The effects of the Reynolds number and geometric configuration variation of PCB on the flow and heat transfer characteristics are analyzed. As the results of this study, it is found that the thermal boundary layer occured at adiabatic wall in case with thermal radiation included, and the effect of radiation is also found to be insignificant for high Reynolds numbers. It is found, as well, that the heat transfer increases as the Reynolds number and block space increase and the channel height decreases and the heat transfer of vertical channel is greater than that of horizontal channel.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.