• Korean Journal of Optics and Photonics
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• v.12 no.3
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• pp.184-189
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• 2001

The design of an ultra fast ellipsometer is suggested. It adopts the division-of-amplitude-photopolarimeter (DOAP) as the polarization state detector. It does not utilize any moving part such as the rotating polarizer(analyzer) or even any electronic modulation part like the piezo-electric phase modulator. Hence the time resolution of the present system is limited only by the response time of the photo-detector and electronic circuit as well as the analog-digital converter. The feasibility of the suggested ultra fast ellipsometer was tested and the response time with nano-second time resolution has been verified. Its future application to the investigation of kinetics including that of the phase-change optical recording media like GezSb2 Tes is discussed. ussed.

• Electronics and Telecommunications Trends
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• v.28 no.5
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• pp.111-121
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• 2013

인쇄전자(printed electronics) 기술은 인쇄가 가능한 기능성 전자 잉크 소재를 이용하여 초저가격의 프린팅 공정을 통해서 다양한 전자소자를 제작하는 기술로써, 차세대 ICT 기기의 제작에 적합한 전자제품을 생산하는데 적합한 공정기술로 잘 알려져 있다. 현재 인쇄전자의 기술수준은 일부 요소 부품들을 제작하고 간단한 전자회로를 구현하는 수준에 머무르고 있으나, 도체, 반도체, 절연체의 여러 잉크 소재 및 다양한 초미세 인쇄공정 기술의 개발이 진행됨에 따라 향후 폭넓은 분야에 적용될 것으로 기대된다. 이러한 인쇄전자의 관련 기술 중에서 최근 삼차원(3D) 프린팅 기술이 부상하고 있는데, 지난해 Economist에서는 3D 프린팅을 제3차 산업혁명을 가져올 기술 중 하나로 소개했으며, 세계경제포럼(WEF: World Economic Forum)에서는 2013년 10대 유망 기술 중 하나로 선정했다. 올해 초, 미국의 오바마 대통령은 국정연설에서 거의 모든 제품의 생산 방식을 바꿀 수 있는 잠재력을 가진 기술로 3D 프린팅을 언급했고, Optomec에서는 전자소자용 3D 프린팅 기술을 선보였다. 본 논문에서는 최근에 많이 연구되는 모바일용 무선통신소자나 차세대 디스플레이 백플레인용의 인쇄전자 기술과 상품의 모형인 목업(Mock-up)을 제작할때뿐 만 아니라 전자소자 제작에도 적용이 가능한 3D 프린팅 기술에 대하여 논하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.413-413
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• 2008

최근 잉크젯, 스크린, 그라비아 등 기존의 인쇄 방식과 인쇄 기술을 이용하여 저가의 전자회로 혹은 전자 소자를 제조하고자 프린팅 소재 및 공정 개발에 대한 산업계의 관심이 증가하고 있다. 특히 PCB, RFID, 디스플레이, 태양전지 분야의 전극재료의 개발에 많은 연구가 진행 중에 있으며, 다양한 인쇄 방법 중 미세회로의 구현이 가능한 잉크젯 프린팅을 통한 전극 형성방법에 주목하고 있다. 본 연구는 잉크젯 프린팅 방식을 통해 배선을 형성하고자 이에 적합한 다양한 농도의 잉크를 배합하여 평가하였으며, 첨가제 및 소결, 건조 조건의 변화를 통해 기재와의 부착력, 배선의 크랙을 조절하였다.

• Journal of the Korea Convergence Society
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• v.11 no.7
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• pp.105-112
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• 2020

This paper presents an investigation into the development of a fabric electronics based smart bag for festival users of the 2029 generation with customizable tech flaps (music media control/ LED animated graphic functions) based on the application of traditional Korean patterns and goblin patterns in an electric circuit. The investigator took into consideration functional and design strategies to enable custom service according to users' tastes and situations. Based on these considerations, a customizable smart bag platform was proposed in a detachable module based on a computer embroidery machine. The study is significant in that it developed a product that is different from the old PCB smart products in hard form and proposed a new business model.

• Design & Manufacturing
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• v.14 no.1
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• pp.15-21
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• 2020

Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

• The Transactions of the Korean Institute of Power Electronics
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• v.3 no.4
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• pp.353-364
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• 1998

This paper presents a systematic approach to the modeling of power electronic circuits with systemlongrightarrowlevel simulation l languages. It is shown that a circuit model reduces to one of four basic types according to input/output conditions. The e elementary models for single series components and shunt components are derived which are integrated to develop a m model of given converter circuit. The constraints imposed on the model development-matching input/output conditions a and avoiding algebraic loop-are discussed in relation to the realization example of a buck converter circuit model. It is s shown that the constraints can always be fullfilled by introducing fictitious interface blocks, which is generalized to the c concept of model transformation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.2
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• pp.129-133
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• 2005

It is very important to use the charge coupled devices (CCDs) in spectrometry because we can study the molecular energy level, molecular structure, absorption or emission, intermolecular reaction, weakly bound molecular energy, photochemistry, fluorescence and photodynamic therapy (PDT). CCD is very essential to study the molecular structure and medical engineering combining laser spectroscopy in the modem physicsal and chemistry. Therefore, this study has designed and manufactured the electromagnetic spectrometry with CCD and then analyzed the printed electronic circuit. In the yesterday, CCD was thought to be used in only broadcasting system. But nowadays, it is used by industrial demand in observations, instrumentations and robotics as the industry develop.

• Journal of the Korea Computer Industry Society
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• v.3 no.2
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• pp.149-158
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• 2002

This paper deals with design and verification of an arithmetic logic unit(ALU) to be used for development of optical computers. The ALU is based on optical switching device, $LiNbO_3$, which is easy to interface with electronic technology and most common in the market. It consists of an arithmetic/logic circuit performing logic operations, memory devices storing operands and the results of operations, and supplementary circuits to select instruction codes, and operates in bit-serial manner. In addition, a simulator is developed for verification of the design, and a set of basic instructions are executed in sequence and step-by-step changes in the accumulator and the memory are examined through simulations, to show that various operations are performed correctly.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.20-24
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• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.