• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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• pp.179-179
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• 2004

최근 산업계 기술 동향은 첨단화, 고정도화 그리고 초소형화하고 있으며, 초정밀 가공 기술(nano technology)의 발전에 따른 고정밀의 계측기술이 요구되고 있는 실정이며, 기계구조 재료가 다양한 조건 하에서 사용되어지고 있다. 이에 따라 새로운 정밀계측기술 또한 급속히 발전하고 있으며, 특히 비접촉 정밀 계측 분야에서는 레이저(laser)를 이용한 광계측 방법이 선호되고 있다. 레이저를 이용한 비접촉 계측방법은 기계구조물의 미소하중, 미소균열검출, 미소변형계측, 정밀계측 등의 분야에 장점을 가지고 있어 관심이 높아지고 있다.(중략)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.556-560
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• 2005

The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.772-776
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• 2004

The paper describes the quantitative determination of out-of-plane displacement from result of Shearogrpahy, which can measure the first-order partial derivative of out-of-plane displacement directly. However, the differential sensitivity of Shearography is related to the amount of shearing, which is manually adjustable in optical interferometer and affects the quantitative determination. The relationship between those is inspected by comparing ESPI with Shearography. From the result, the amount of shearing plays a modulation factor of out-of-plane displacement and small amount of shearing gives good agreement with out-of-plane displacement.

• 비파괴검사학회지
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• 제25권2호
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• pp.81-86
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• 2005

본 논문에서는 반도체 패키지 내부결함의 비파괴 정량평가를 위한 ESPI 기법을 이용한 시스템 및 검사기 법을 제안하고 있으며, 검사시스템은 ESPI 검사장치, 열변형유도장치, 단열챔버로 구성되어있다. 기존 초음파, X-ray 기반의 검사기법에 비하여 측정시간 및 검사방법이 용이하며, 결함의 정량검출이 가능하다는 장점이 있다. 검사결과에서 대부분의 결함이 열 방출이 많은 칩 주위에서 박리결함으로 나타났으며, 원인은 층간 접착강도의 약화와 열분배 설계에서 문제점인 것으로 사료된다.

• 한국자동차공학회논문집
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• 제1권2호
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• pp.125-133
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• 1993

Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.388-392
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• 1995

The Electronic Speckle Pattern Interferometry(ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. Composite materials have various complicated characteristics depending on the ply materials,ply orientations,ply stacking sequences and boundary conditions. Therefore, it is difficult to analyze composite material. For efficient use of composit materials in engineering applications, the dynamic behavior such as, natural frequencies and modal patterns should be identified. This studying presents FEM results for the free vibration of symmetrically laminated composite as [30/-30/90] $_{s}$. The natural frequencies of laminated composite rectangular plates having the boundary condition(:2-edge clamped) are experimentally obtained. In order to demonstrate the validity of the experiment,FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculated by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.t.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.911-914
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• 2003

The non-contact laser measurement system what can be used for the vibration analysis of structures is discussed. There are few systems using laser speckle interferometer for vibration analysis. One of these systems is the Electronic Speckle Pattern Interferometer (ESPI). With ESPI system, one can obtain the vibration mode shape qualitatively and the maximum vibration amplitude quantitatively of the structure at each resonance frequency. In this paper, the phase-shifting ESPI system with stroboscopic illumination for measuring vibration mode shapes is constructed and the operating software is programmed. The results are compared with that of commercial ESPI system.

• 한국정밀공학회지
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• 제24권7호
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• pp.69-74
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• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.