• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.734-743
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• 2010

In this paper, we analyzed the EMP coupling for the nonuniform transmission lines, such as twisted cables, using the chain matrix algorithm and the multi-conductor analysis. The BLT method is widely used for the EMP coupling analysis of the transmission line, however, it is difficult to apply to the nonuniform transmission lines. In order to analyze the EMP coupling of nonuniform transmission lines, the whole nonuniform transmission line is divided into incremental uniform line sections of the finite numbers, and the coupling in each small sections is now summed up to get the EMP coupling effect of the entire nonuniform transmission line. To verify the proposed EMP coupling analysis method, the result of the EMP coupling simulation is compared with the solution of BLT equations for a uniform transmission line case. The proposed method is applied to the twisted cable over ground in case of being illuminated by the HEMP in order to analyze the EMP coupling.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.4A
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• pp.408-416
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• 2010

A dumbbell-type CPW transmission-line structure has been proposed to improve the return loss of the transmission line between a driver IC and flip-chip-bonding VCSEL(Vertical Cavity Surface Emitting Laser) in a hybrid opto-electric circuit board(OECB). The proposed structure used a pair of dummy ground solder balls on the ground lines for flip-chip bonding of the VCSEL and designed the dumbbell-type CPW transmission line to improve reflection characteristics. The simulated results revealed that the return loss of the dumbbell-type CPW transmission line was 13-dB lower than the conventional CPW transmission line. A 4-dB improvement in the return loss was obtained using the dummy ground solder balls on the ground lines. The variation rate of the reflection characteristic with the variation of terminal impedances of the transmission line (at the output terminal of the driver IC and the input terminal of the VCSEL) is about ${\pm}2.5\;dB$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.5
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• pp.879-886
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• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Journal of the Korean Institute of Telematics and Electronics
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• v.11 no.4
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• pp.25-29
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• 1974

In this paper, a surfer wide-band FM lossy-line discriminator is investigated, as it has the merit of rediucing the dimensions of the discriminator by using proper dielectric material in the transmission tine. It is shown that the lossy-line discriminator that is made of a pair of the transmission lines satisfying the distortionless condition approximately gives almost no more deterioration in its characteristics than the ideal-line FM discriminator, while the dimensions of the transmission lines of the discriminator can be reduced greatly.

• 전기의세계
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• v.20 no.4
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• pp.37-43
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• 1971

전파전송개념은 기본회로 소자인 인덕터와 커패시터의 이해에 입각하여 보다 쉽게 파악할 수 있다. 송전선은 전화신호와 전력을 한 곳에서 다른곳으로 전도하며, 이러한 전도성이 고주파 신호에 대해서는 존재하지 않지만 전파에의 초보로서 두 평행도체 사이의 전파전송을 이용하는 것이 설명에 쉽다. 전송선은 단위길이마다 커패시턴스 C와 인덕턴스 L을 가지므로, 전송선 방정식을 유도하려면 회로소자 인덕터와 커패시터의 기본성질을 알아야 한다 .

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.761-764
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• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.2
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• pp.147-152
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• 2014

A longitudinal modal transmission-line theory(L-MTLT) to analyze the static and dynamic behavior of two-section distributed feedback (DFB) lasers is used. The characteristic impedance and equivalent propagation constant of DFB structure with active layer are derived from L-MTLT. A two-section DFB laser is analogous to a transmission-line network, in which each section is described by transmission-line block corresponding to the equivalent factors. The longitudinal resonant condition of DFB laser based on equivalent transmission-line network is used to reformulate the rate equations so that static and dynamic behavior of two-section DFB lasers with active layer is demonstrated and analyzed accurately.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.5
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• pp.285-289
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• 2003

This paper proposes a 10 ${\mu}{\textrm}{m}$ thick oxide air-bridge structure which can be used as a substrate for RF circuits. The structure was fabricated by anodic reaction, complex oxidation and rnicrornachining technology using TMAH etching. High quality films were obtained by combining low temperature thermal oxidation (50$0^{\circ}C$, 1 hr at $H_2O$/O$_2$) and rapid thermal oxidation (RTO) process (105$0^{\circ}C$, 2 min). This structure is mechanically stable because of thick oxide layer up to 10 ${\mu}{\textrm}{m}$ and is expected to solve the problem of high dielectric loss of silicon substrate in RF region. The properties of the transmission line formed on the oxidized porous silicon (OPS) air-bridge were investigated and compared with those of the transmission line formed on the OPS layers. The insertion loss of coplanar waveguide (CPW) on OPS air-bridge was (about 1 dB) lower than that of CPW on OPS layers. Also, the return loss of CPW on OPS air-bridge was less than about - 20 dB at measured frequency region for 2.2 mm. Therefore, this technology is very promising for extending the use of CMOS circuitry to higher RF frequencies.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.6
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• pp.50-56
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• 2000

The integrated circuit interconnection lines are experimented with patterned ground shields (PGS) at microwave frequencies. Measurement results demonstrate that the PGS can significantly reduce the power loss through the interconnect lines over wide frequency ranges as the PGS shields the lossy silicon substrate. The transmission line characteristics of the PGS interconnect lines are analyzed and identified that the PGS reduces the wave length of the interconnect line.