Design of Dumbbell-type CPW Transmission Lines in Optoelectric Circuit PCBs for Improving Return Loss
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Lee, Jong-Hyuk
(경희대학교 전자정보학부 무선통신회로연구실)
Kim, Hwe-Kyung (경희대학교 전자정보학부 무선통신회로연구실) Im, Young-Min (경희대학교 전자정보학부 무선통신회로연구실) Jang, Seung-Ho (경희대학교 전자정보학부 무선통신회로연구실) Kim, Chang-Woo (경희대학교 전자정보학부 무선통신회로연구실) |
1 | "Optical backplanes - A global market and technology review", BPA Consulting, Dorking Survey, UK, 2001 |
2 | Thermal mechanical and optical modeling of VCSEL packaging |
3 | Young K Song, Chin C. Lee "Millimeter-wave Coplanar Strip (CPS) Line Flip Chip Packaging on PCBs", 2005 Electronic Components and Technology Conference, University of California, Irvien, 1809-1813, 2003. |
4 | Young K Song, Chin C. Lee "RF Modeling and Design of Flip Chip Configurations of Microwave Devices on PCBs", 2004 Electronic Components and Technology Conference, University of California, Irvien, 1837-1842, 2004. |
5 | Daniel G. Swanson and Jr. Wolfgang J. R. Hoefer, Microwave Circuit Modeling, Artech House, Inc. Boston London, 2003. |
6 | 60 GHz Broadband MS-to-CPW Hot-via Flip Chip Interconnects |
7 | Simulations, measurements and equibalent circuit for a CPW-CPW vertical interconnection |
8 | Rigorous Field Theory Analsis of Flip-Chip |
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