• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.965-971
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• 2001

To estimate the reliability of 12Cr alloy steel, the material of turbine blade in the steam power plant, Its corrosion susceptibility and fatigue characteristics in NaCl and Na$_2$SO$_4$solution with the difference of concentration and temperature was investigated. The polarization tests recommended in ASTM G5 standard for corrosion susceptibility in the various corrosive solutions was estimated. It showed that the higher temperature, the faster corrosion rates and corrosion rates were the fastest in 3.5 wt.% NaCl and 1M Na$_2$SO$_4$solution. From these results, the degradation conditions were determined in distilled water, 3.5 wt.% NaCl and 1M Na$_2$SO$_4$solution at room temperature, 60$\^{C}$ and 90$\^{C}$ during 3, 6 and 9 months. Its surface had a few pits for long duration. But, it was not susceptible in sulfide and chloride condition of several temperatures. If the degraded 12Cr alloy steel and non-degraded one were compared with fatigue characteristics, Any differences were not found regardless of temperature and degradation period.

• Restorative Dentistry and Endodontics
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• v.31 no.6
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• pp.452-459
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• 2006

Competition will usually develop between the opposing walls as the restorative resin shrinks during polymerization. Magnitude of this phenomenon may be depended upon cavity configuration and volume. The purpose of this sturdy was to evaluate the effect of cavity configuration and volume on microleakage of composite resin restoration that has margins on the enamel site only. The labial enamel of forty bovine teeth was ground using a model trimmer to expose a flat enamel surface. Four groups with cylindrical cavities were defined, according to volume and configuration factor(Depth x Diameter / C-factor) - Group I : 1.5 mm ${\times}$ 2.0 mm / 4.0, Group II : 1.5 mm ${\times}$ 6.0 mm / 2.0, Group III : 2.Omm ${\times}$ 1.72 mm / 5.62, Group IV : 2.0 mm ${\times}$ 5.23 mm / 2.54. After treating with fifth-generation one-bottle adhesive - BC Plus$^{TM}$ (Vericom, AnYang, Korea), cavities were bulk flted with microhybrid composite resin - Denfill$^{TM}$ (Vericom). Teeth were stored in distilled water for one day at room temperature and were finished and polished with Sof-Lex system. Specimens were thermocycled 500 times between 5$^{\circ}$C and 55$^{\circ}$C for 30 second at each temperature. Teeth were isolated with two layers of nail varnish except the restoration surface and 1 mm surrounding margins. Electrical conductivity (${\mu}$A) was recorded in distilled water by electrochemical method. Microleakage scores were compared and analyzed using two-way ANOVA at 95% level. The results were as follows: 1. Small cavity volume showed lower microleakage score than large one, however, there was no statistically significant difference. 2. There was no relationship between cavity configuration and microleakage. Factors of cavity configuration and volume did not affect on microleakage of resin restorations with enamel margins only.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.148-148
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• 1999

다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가진 입방정 질화붕소(cubic Boron Nitride)는 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되는 자료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 기대되는 재료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 크게 기대된다. 이 때문에 각종의 PVD, CVD 공정을 이용하여 c-BN 박막의 합성에 대한 연구가 광범위하게 진행되어 많은 성공사례들이 보고되고 있다. 그러나 이러한 c-BN 박막의 유용성에도 불구하고 아직 실제적인 응용이 이루어지지 못한 것은 증착직후 급격한 박리현상을 보이는 c-BN 박막의 밀착력문제때문이다. 본 연구에서는 평행자기장을 부가한 ME-ARE(Magnetically Enhanced Activated Reactive Evaporation)법을 이용하여 c-BN 박막을 합성하고, 합성된 c-BN 박막의 밀착력에 미치는 공정인자의 영향을 규명하여, 급격한 박리현상을 보이는 c-BN 박막의 밀착력 향상을 위한 최적 공정을 도출하고자 하였다. BN 박막 합성은 전자총에 의해 증발된 보론과 (질소+아르곤) 플라즈마의 활성화반응증착(activated reactive evaporation)에 의해 이루어졌다. 기존의 ARE장치와 달리 열음극(hot cathode)과 양극(anode)사이에 평행자기장을 부여하여 플라즈마를 증대시켜 반응효율을 높혔다. 합성실험용 모재로는 p-type으로 도핑된 (100) Si웨이퍼를 30$\times$40 mm크기로 절단 후, 100%로 희석된 완충불산용액에 10분간 침적하여 표면의 산화층을 제거한후 사용하였다. c-BN 박막을 얻기 위한 주요공정변수는 기판바이어스 전압, discharge 전류, Ar/N가스유량비이었다. 증착공정 인자들을 변화시켜 다양한 조건에서 c-BN 박막의 합성하여 밀착력 변화를 조사하였다. 합성된 박막의 결정성 분석을 FTIR을 이용하였으며, Bn 박막의 상 및 미세구조관찰을 위해 투과전자현미경(TEM;Philips EM400T) 분석을 병행하였고, 박막의 기계적 물성 평가를 위해 미소경도를 측정하였다. 증착된 c-BN 박막은 3~10 GPa의 큰 잔류응력으로 인해 증착직후 급격한 박리현상을 보였다. 이의 개선을 위해 증착중 기판바이어스 제어 및 후열처리를 통해 밀착력을 수~수백배 향상시킬 수 있었다. c-BN 박막의 합성을 위해서는 증착중인 박막표면으로 큰 에너지를 갖는 이온의 충돌이 필요하기 때문에 기판 바이어스가 요구되는데, c-BN의 합성단계를 핵생성 단계와 성장 단계로 구분하여 인가한 기판바이어스를 달리하였다. 이 결과 그림 1에서 나타낸 것처럼 c-BN 박막의 핵생성에 필요한 기판바이어스의 50% 정도만을 인가하였을 때 잔류응력은 크게 경감되었으며, 밀착력이 크게 향상되었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.208-208
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• 2003

RF 마그네트론 스퍼터링법을 이용하여 Ar과 $O_2$의 유량을 25sccm씩 흘리면서 $SiO_2$/Si기판 위에 Sn $O_2$ 박막을 증착하였다. 증착된 박막은 columnar 구조로 성장하였으며 많은 입자들이 뭉쳐서 형성된 양배추꽃(cauliflower) 형태의 뭉친 입자(agglomerates)를 가지는 표면형상이 관찰되었다. 분위기에 따른 어닐링 효과를 확인하기 위하여 50$0^{\circ}C$에서 공기와 질소 분위기하에서 열처리하였다. 열처리한 후 표면거칠기가 개선되었으며, 표면형상의 변화가 발생하였다. 특히 50$0^{\circ}C$, 질소분위기에서 어닐링한 경우는 양배추꽃 형태의 표면형상이 소수의 작은 입자가 뭉친 형태로 분리되면서 입도분포가 개선되었다. 이러한 결과는 어닐링 과정에서 발생되는 응력을 완화시키기 위하여 표면형상의 변화가 발생하는 것으로 판단된다. XPS 측정 결과, 질소 분위기에서 어닐링한 후에 OIs와 Sn5/3d 피크가 낮은 결합에너지에 위치하고 있어 산소공공의 농도가 어닐링 전에 비하여 증가하였음을 확인할 수 있다. 어닐링 전후에 Sn $O_2$ 박막의 면저항 측정 값은 XPS 결과와는 달리 질소 분위기 어닐링한 후에 오히려 면저항값이 크게 증가하였다. 이러한 결과는 질소 분위기 어닐링한 후 표면형상의 변화에 기인하여 입자간의 연결성이 저하되어 면저항값이 증가한 것으로 추정된다. 산소분위기에서 어닐링한 후에 전체적으로 전기적 특성의 재현성이 개선되었으며 Sensitivity( $R_{air}$/ $R_{gas}$)가 향상되었음을 확인하였다.하였다.석을 통하여 La의 분포를 확인하였으며, HRTEM 분석을 통하여 미세구조분석을 실시하였다.2463eV였다. 10K에서 광발광 봉우리의 919.8nm (1.3479eV)는 free exciton(Ex), 954.5nm (1.2989eV)는 donor-bound exciton 인 I2(DO,X)와 959.5nm (1.2921eV)는 acceptor-bound exciton 인 I1(AO,X) 이고, 964.6nm(1.2853eV)는 donor-acceptor pair(DAP) 발광, 1341.9nm (0.9239eV)는 self activated(SA)에 기인하는 광발광 봉우리로 고찰되었다.가 높을수록 방출전류가 시간에 따라 급격히 감소하였다. 각 duty비에서 방출전류의 양이 1/2로 감소하는 시점을 에미터의 수명으로 볼 때 duty비 대 에미터 수명관계를 구해 높은 duty비에서 전계방출을 시킴으로써 실제의 구동조건인 낮은 duty비에서의 수명을 단시간에 예측할 수 있었다. 단속적으로 일어난 것으로 생각된다.리 폐 관류는 정맥주입 방법에 비해 고농도의 cisplatin 투여로 인한 다른 장기에서의 농도 증가 없이 폐 조직에 약 50배 정도의 고농도 cisplatin을 투여할 수 있었으며, 또한 분리 폐 관류 시 cisplatin에 의한 직접적 폐 독성은 발견되지 않았다이 낮았으나 통계학적 의의는 없었다[10.0%(4/40) : 8.2%(20/244), p>0.05]. 결론: 비디오흉강경술에서 재발을 낮추기 위해 수술시 폐야 전체를 관찰하여 존재하는 폐기포를 놓치지 않는 것이 중요하며, 폐기포를 확인하지 못한 경우와 이차성 자연기흉에 대해서는 흉막유착술에 더 세심한 주의가 필요하다는 것을 확인하였다. 비디오흉강경수술은 통증이 적고, 입원기간이 짧고,

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.39-42
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• 2011

The composite electroplating is accomplished by adding inert materials during the electroplating. Permalloy is the term for Ni-Fe alloy and it is used for industrial applications due to its high magnetic permeability, surface wear resistance, corrosion protection. Microhardness for microdevices is enhanced after composite coating and it increases the life cycle. However, the hydroxyl group on the silica makes their surface susceptible to moisture and it causes the silica nanoparticles to be agglomerated in the aqueous solution. The agglomeration problem causes poor dispersion which eventually interrupts uniform deposition of silica nanoparticles. In this study, the dispersion of silica nanoparticles in the permalloy electroplated layer is reported with variation of additives and current densities. The optimum current density was 20 $mA/cm^2$ and the silica content was 9 at% at $50^{\circ}C$. The amount of silica nanopowder codeposition and surface morphologies were influenced with variation of additives. In the bath, smooth surface morphology and relatively high contents of silica nanopowder codeposition were obtained with addition of sodium lauryl sulfate.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.1
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• pp.62-67
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• 2011

Nanoparticles-coated and impact-damaged carbon-fiber reinforced plastics(CFRP) laminates were tested under compression-after-impact(CAI) mode and the propagation of damage due to compressive loading has been monitored by acoustic emission(AE). The impact damage was induced not by mechanical loading but by a simulated lightning strike. CFRP laminates were made of carbon prepregs prepared by coating of conductive nano-particles directly on the fibers and the coupons were subjected to simulated lightning strikes with a high voltage/current impulse of 10~40 kA within a few microseconds. The effects of nano-particles coating and the degree of damage induced by the simulated lightning strikes on the AE activities were examined, and the relationship between the compressive residual strength and AE behavior has been evaluated in terms of AE event counts and the onset of AE activity with the compressive loading. The degree of impact damage was also measured in terms of damage area by using ultrasonic C-scan images. From the results assessed during the CAI tests of damaged CFRP showed that AE monitoring appeared to be very useful to differentiate the degree of damage hence the mechanical integrity of composite structures damaged by lightning strikes.

• Nuclear Engineering and Technology
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• v.23 no.1
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• pp.1-11
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• 1991

The objective of this study is to investigate the effect of weld line on the mechanical strengths and the process of weld line elimination in the Zircaloy-4 resistance upset welding for the fabrication of heavy water reactor fuel rods. The weld current and the amount of upset increased linearly with the main heat, in which two relations between them were derived. It was found that the threshold to obtain sound weld was 50% of main heat in terms of weld upset size, mechanical strengths and weld line elimination. The weld microstructure of resistance upset welds of Zircaloy-4 comprsied basketweave, Widmanstatten and martensite respectively by changing the main heats. Dimples on uniaxially fractured surface at weld line in the Zr-4 welds were larger and deeper compared with those on biaxially fractured surface. It was also found that the process of the weld line elimination in the resistance upset weld of Zircaloy-4 could be divided into three stages in terms of the presence of many pores, their shrinkage and elimination, and the shrinkage of the original weld interface with increasing weld currents.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.11-17
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• 2010

The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.