• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.695-696
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• 2012

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• Journal of the Society of Naval Architects of Korea
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• v.45 no.2
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• pp.157-167
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• 2008

Six smooth flat tensile specimens and eighteen punch specimens with three different thicknesses were machined from steel of JIS G3131 SPHC. In addition to punch tests, incremental tensile tests were conducted to obtain average true flow stress - logarithmic true strain curves. Through parametric FE simulations for the tensile specimens, material parameters related to GTN model were identified. Using indenters with three kinds of radius, punch tests were carried out to obtain fracture characteristics of punch specimens. Numerical analyses using both fracture models, GTN and $J_2$ plasticity model, gave that the former estimated well the fracture of punch specimen but the latter did not. A new concept for critical size of plate elements was introduced based on minimum relative sharpness between contact structures. Consequently, a new criterion for critical element size was proposed to be less than 20% of minimum relative radius of interacting structures.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Composites Research
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• v.29 no.5
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• pp.236-242
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• 2016

In this work, tensile and in-plane shear tests for thermoplastic glass fiber/polypropylene composites were performed at a thermo-forming temperature and their properties were characterized and mathematically expressed by using the non-orthogonal constitutive model. As for the thermo-forming test, half-dome experiments were carried out by varying the usage of a releasing agent and the weight of holders. As results, the optimum final shape having well-aligned symmetry and no wrinkle formation was obtained when the releasing agent was used, and it was found that the careful control of a holding force is crucial to manufacture the healthy product. Furthermore, FEM simulations based on the non-orthogonal model showed similar final shapes and tendency of wrinkle formation with experimental results, and confirmed that wrinkles increase with less holding force and higher punch force is required under high frictional condition.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 한국가스학회:학술대회논문집
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• 1997.09a
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• pp.78-85
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• 1997

Indentation and small punch tests are very powerful methods to monitor the materials reliability since they are very simple, easy and almost non-destructive. First, recently-developed continuous indentation test can provide the more material properties such as hardness, elastic modulus, yield strength, work-hardening exponent, etc., than the conventional hardness test. In our study, the true stress-strain curve was derived from the indentation load-depth curve for spherical indentation. In detail, the strain was able to be obtained from plastic depth/contact radius ratio, and the flow stress was from mean contact pressure through the analysis of elastic-plastic indentation stress field. Secondly, the small punch test was studied to evaluate the fracture toughness and defomation properties such as elastic modulus and yield strength. Like the indentation test, this test can be applied without severe damage of the target structure.