• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.71-74
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• 2001

Using the Taguchi method, optimum process condition of lead frame blanking has been determined in the point of view of shape of blanked profile. As the main process parameters, clearance, strip holding pressure and bridge width are selected. According to the orthogonal array table, three levels of experiment have been carried out for each factors. The optimal blanking condition is analyzed with the SN ratio. It has been verified that the optimal process condition can be determined with a combination of basic blanking experiment and experiment design method. Both the effect of each factors and gain can be judged in the quantitative manners from the analysis of SN ratio.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.7 s.250
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• pp.849-856
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• 2006

In this paper, fabric composite draping on hemisphere moulds were studied to find out the deformation behaviour of micro-tow structures of fabrics during draping and thermoforming. Aluminium and PVC foams were used to fabricate the hemisphere moulds for draping tests. In order to observe the local tow deformation pattern during the draping several specimens for microscopic observation were sectioned from the draped hemisphere structures. The effect of forming condition and mould properties on tow deformation was investigated by the microscopic observation of the tow parameters such as crimp angle. Normalization scheme was performed to compare tow parameter variations with different forming conditions. Stress-strain .elations of two different PVC foams (HT70 and HT110) were tested to investigate the effect of foam property on the micro-tow deformation during forming.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.184-187
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• 2002

Compression molding was specifically developed for replacement of metal components with composites. As the mechanical properties of the products are dependent on the separation and orientation, it is important to research the fiber mat structure and molding conditions. In this study, the effects of the fiber mat structure(NP: 5, 10, 25punches/$\textrm{cm}^2$) and the mold closure speed($\dot{\textrm{h}}$=0.1, 1, 10mm/min) on the viscosity of composites were discussed. The composites is treated as a Non-Newtonian power-law fluid. The parallel-plate plastometer is used and the viscosity is obtained from the relationship between the compression load and the thickness of the specimen.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.3
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• pp.98-102
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• 2009

Almost all injection molds have multi-cavity runner system for mass production, which are designed with geometrically balanced runner system in order to accomplish filling balance between cavity to cavity during processing. However, even though geometrically balanced runner is used, filling imbalance has been observed. Filling imbalance could be decreased by modifying processing conditions such as injections rate, mold temperature, injection pressure, melt temperature that are related to shear, viscosity. In this study, a series of experiment was conducted to investigate filling imbalance variation when modifying runner layout and polymer and to determine which processing condition influences as the primary cause of filling imbalance in geometrically balanced runner system. The filling imbalance was decreased up to result range of $3{\leq}DFI{\leq}8(%)$ by using a new runner system for balanced filling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.04b
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• pp.49-52
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• 1993

금속의 가공공정에 있어 중요한 인자중의 하나인 재료의 연성은 환경뿐만 아니라 주변압력에 따라 변화한다는 사실이 20세기에 들어 여러 연구자들에 의해 밝혀졌고 1950년대 Birdgman에 의해 최초로 실험적인 방법으로 증면되었다. 재료의 이와같은 현상을 압력유도연성이라 하는데 이는 주변압력이 재료 내부에서의 공동발생 및 그 성장에 관계하기 때문인 것으로 알려졌다. 공동의 합체 및 성장은 연성파괴의 전체조건이 되므로 이를 억제하면 성형성 및 연성이 증가됨을 알 수 있다. 금속의 압력 유도 연성을 이용한 가공방법을 가압금속형형이라 한다. 최근에 가압금속형의 범주는 크게늘고 있 는데 특히, 성형,블랭킹, 분말야금법 등에 널리 이용되고 있다. 정수압의 크기에 다른전단면의 상태 변화 즉, 소성 변형능에 관한 연구는 Fine-Blanking가공이론에 적용, 해석되고 있다.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.937-940
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• 2010

본 연구는 fine blanking 프레스로부터 기능면으로 사용되는 100% clean cut 전단면을 얻는 fine blanking 공정에서 die roll을 최소화하기 위한 목적으로 성형 해석 및 실험적 방법을 통해 die chamfer 형상에 따라 성형되는 제품의 die roll size 변화를 검토한 것이다. fine blanking 과정을 묘사하기 위하여 deform 2D를 이용하여 성형 해석을 수행하여 die roll size를 예측하였으며, 실제 die chamfer가 다른 die insert를 제작하여 fine blanking 실험을 실시하여 die chamfer 형상에 따른 die roll size에 대한 해석 data와 실험 data를 비교 분석하여 die roll 길이 방향 size의 경향을 파악할 수 있었다. 이 연구 결과는 fine blanking 판재 성형에서 die roll을 최소화하기 위한 die chamfer 설계에 유용하게 적용될 것으로 판단된다.

• Proceedings of the Korean Geotechical Society Conference
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• 2005.03a
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• pp.99-106
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• 2005

본 연구에서는 케이싱을 영구부재로 사용함으로써 기존의 현장타설말뚝과 비교하여 시공 성,품질균일성,경제성, 내구성 등을 검토한다. 연구결과 케이싱을 영구부재로 사용하는 경우, 케이싱의 재사용을 위한 인발작업이 불필요하게 되고,말뚝길이전체에 대하여 케이싱을 사용한다면 R.C.D공법에 서 적용하는 슬러리공벽보호공정이 불필요하므로 시공성이 향상되는 것으로 판단된다. 케이싱을 영구부 재로 사용하는 현장타설말뚝의 지지력은 일반 깊은 기초의 지지력을 산정하는 방법과 동일하게 구해질 수 있다. 대구경의 영구케이싱이 있는 현장타설말뚝을 시공한다면 공내에 간단한 장비와 인력을 투입해서 선단부를 그라우팅방법 등으로 강화시킴으로써 선단지지력을 효과적으로 증대시킬 수 있을 것이다. 또한 케이싱 내부로부터 미리제작한 구멍을 통하여 그라우팅, 전단키(shear key) 등을 주입 또는 압입 함으로써 주면마찰력도 크게 향상될 수 있을 것으로 사료된다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.887-890
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• 2001

In end milling process the underformed chip thickness and the cutting force components very periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying underformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting mode. According to this analysis, when cutting Inconel 718.61% of the total energy is consumed in the shear process and the balance is consumed in the friction process.