• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.77-82
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• 2022

During etching process of PCB, the electroplated copper line and seed layer copper have different etching rates and it caused the over etching of copper line as well as undercut of lines. In this research, the effects of etchants composition on copper etching characteristics were investigated. The optimum concentration of hydrogen peroxide and sulfuric acid of etchants were obtained using polarization and OCV (open circuit voltage) analysis for both rolled copper and electroplated copper. The inhibiting effects of different inhibitors were investigated using OCV and ZRA (zero resistance ammeter) analysis. The galvanic current between electroplated copper and seed layer copper were measured using ZRA method. Inhibitors for least galvanic current could be chosen based on galvanic coupling in ZRA analysis.

• Journal of the Korean Magnetics Society
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• v.27 no.4
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• pp.135-139
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• 2017

The magneto-impedance effect (MI effect) has been investigated in metal core/soft magnetic shell composite wires fabricated by electrodeposition of $Ni_{80}Fe_{20}$ on Cu wire (diameter $190{\mu}m$). The diagonal impedances $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in cylindrical coordinate showed strong MI effect for the magnetic field applied along z-axis, while the off-diagonal impedance $Z_{{\theta}z}$ showed very weak MI effect. We have tried to develop the Cu $core/Ni_{80}Fe_{20}$ shell composite wire having strong MI effect in off-diagonal impedance by electrodeposion under torsional strain. The core/shell composite wire electrodeposited under torsional angles above $270^{\circ}$ showed significantly enhanced MI effect in the off-diagonal impedance. The maximum MI effect was observed in the composite wire electrodeposited under torsional angle of $360^{\circ}$. The developed method to enhance off-diagonal MI effect is expected to increase the applicability of the core/shell composite wire to magnetic sensor material.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.254-254
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• 2015

최근 투명전극분야에서 ITO필름을 대체할 수 있는 메탈메쉬가 연구되어지고 있다. 현재, 메탈메쉬는 유연하면서도 높은 전기전도성을 지니고 있는 장점이 있지만 영구적으로 쓰는데 한계가 있다. 이에 반영구적으로 사용할 수 있는 메탈마스터를 제작함으로써 공정상 쉽게 메탈메쉬를 제작하는 방법을 연구하고 있다.

• Proceedings of the Korean Magnestics Society Conference
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• 2006.06a
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• pp.172-173
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• 2006

• Proceedings of the Korean Vacuum Society Conference
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• 2001.07a
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• pp.99-100
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• 2001

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1590-1596
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• 2003

The experiments of boiling heat transfer were performed to investigate the boiling enhancement in saturated water by using multi-stage electroplated surface. In order to optimize the boiling performance, current flux and duration in multi-stage electroplating were varied. Current flux, 2 $A/12cm^2$ and 0.33 $A/cm^2$, and duration ranging from 15 second to 50 second are considered. The results showed that multi-stage electro plated surfaces generate enhancement of boiling parameters such as boiling incipient superheat, boiling heat transfer coefficient, and critical heat flux compared to plain surface. The SEM images of the coated surfaces were captured to examine the structure of porous surface, which provides the enhancement of boiling heat transfer.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.26 no.1
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• pp.1-6
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• 2003

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based on the principle of dividing into small part. We grouped the factors using the plating process information which we already knew. We did Hull Cell test to find relationship between plating solution and electric effects, and applied ANOVA and RSM to estimate the optimal process conditions.

• Journal of the Korean institute of surface engineering
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• v.37 no.4
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• pp.208-214
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• 2004

The influence of the boron content on the various properties of Ni-B alloy films produced by electrodeposition was investigated. The considerable reduction in grain size was observed with increasing boron content. The internal stress was tensile and increased linearly with increasing boron content. Hardness increased up to $750H_{v}$ at 2 at% boron and then kept the value to 11 at% boron for as-plated Ni-B coatings. The hardness of Ni-B films increased up to $1,250H_{v}$ due to the intermetallic$ Ni_3$B precipitation by the heat treatment, and maximum hardness of each coating increases with boron content. Wear resistance decreased with increasing the boron content because of high friction coefficient and brittle fracture of film which has higher content of boron.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.9-13
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• 2006

The copper lines in COF are usually fabricated by subtractive method. As the width of lines are smaller, the subtractive method has a lateral etching problems. In semi-additive method, copper lines are fabricated by lithographic technique followed by electroplating method. Fine line patterns of $10-40{\mu}m$ were used for this study. Two different types of thick photoresist, AZ4620 and PMER900, were employed for PR mold. Copper lines were fabricated by electroplating method. The crack were found in fine copper lines due to high residual stress when normal copper electroplating bath were used. The via filling copper electroplating bath were replaced the normal electroplating bath and then cracks were not found in the fine copper lines. During substrate etching, the lateral etching of copper lines were not occurred.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.593-600
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• 2000

This paper investigated the conduction path and conduction mechanism in undoped polycrystalline diamond thin films deposited by microwave chemical vapor deposition. The resistances measured by ac impedance spectroscopy with different directions can not be explained by the previously-known surface conduction model. The electrodeposition of Cu and electroetching of Ag experiments showed that the conduction path is the grain boundaries within the diamond films. The electodeposition of Cu with an insulating surface layer further proved that the main conduction path in polycrystalline films in the grain boundaries. The film with high electrical conductivity has low activation energy of 45meV and higher dangling bond density. By considering the results and surface C chemical bonds, the H-C-C-H bonds at surface and in grain boundaries might be the origin of high conductivity in undoped diamond films.