1 |
R. Schwerz, B. Boehme, M. Roellig, K. J. Wolter, and N. Meyendorf, "Reliability of embedding concepts for discrete passive components in organic circuit boards", Proc. 63rd Electronic Components and Technology Conference(ECTC), Las Vegas, 1243-1251, IEEE Components, Packaging and Manufacturing Technology Society(CPMT) (2013).
|
2 |
S. Lee and S. J. Moon, "Preparation of soft etchant to improve adhesion strength between photoresist and copper layer in copper clad laminates", J. Kor. Appl. Sci. and Technol., 32(3), 512-521 (2015).
|
3 |
J. H. Lee, "PCB quality and reliability affected by galvanic reaction" Proceedings of the Korean Institute of Surface Engineering Conference, 38-56, Kor. Inst. Surf. Eng. (2012)
|
4 |
S. W. Lee and J. J. Kim, "Study on the effects of corrosion inhibitor according to the functional groups for Cu chemical mechanical polishing in neutral environment", Kor. Chem. Eng. Res., 53(4), 517-523 (2015).
DOI
|
5 |
H. R. Yoo and Y. D. Son, "A study on safety management and control in wet-etching process for H2O2 reactions", J. of Kor. Academia-Industrial, 19(4), 650-656 (2018).
|
6 |
T. G. Woo, I. S. Park, and K. W. Seol, "Main effects of plating parameters on mechanical and surface properties of electroplated copper" Kor. J. Met. Mater., 56(6), 459-464 (2018).
DOI
|
7 |
D. A. Jones, Principles and Prevention of Corrosion, pp.168-196, New York, Macmillan Publishing Co. (1995)
|
8 |
H. S. Shin, "Fabrication of multilayered structures in electrochemical etching using a copper protective layer", J. Korean Soc. Manuf. Process Eng., 18(2), 38-43 (2019).
|
9 |
N. K. Allam, A. A. Nazeer, and E. A. Ashour, "A review of the effects of benzotriazole on the corrosion of copper and copper alloys in clean and polluted environments", J. Appl. Electrochem., 39(7), 961-969 (2009).
DOI
|
10 |
K. H. Dietz, "Challenges and limitations of subtractive processing in PWB and substrate fabrication", Proc. 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference(IMPACT), Taipei, 231-234, IEEE Components, Packaging and Manufacturing Technology Society(CPMT) (2008).
|
11 |
F. Vasilyev, V. Isaev, and M. Korobkov, "The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production", Przegl. Elektrotech., 97(3), 91-96 (2021).
|
12 |
Y. J. Kang, M. E. Hong, and D. H. Kim, "Study on soft etching material development to improve peel strength between surface of copper and solder resist ink", Appl. Chem. Eng., 20(2), 172-176 (2009).
|
13 |
L. Jiang, Y. Lan, Y. He, Y. Li, Y. Li, and J. Luo, "1, 2, 4-triazole as a corrosion inhibitor in copper chemical mechanical polishing", Thin Solid Films, 556, 395-404 (2014).
DOI
|
14 |
J. W. Lee, M. C. Kang, and J. J. Kim, "Characterization of 5-Aminotetrazol as a corrosion inhibitor in copper chemical mechanical polishing", J. Electrochem. Soc., 152(12), C872-C831 (2005).
|
15 |
O. J. Kwon, S. K. Cho, and J. J. Kim, "Electrochemical metallization processes for copper and silver metal interconnection" Kor. Chem. Eng. Res., 47(2), 141-149 (2009).
|