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http://dx.doi.org/10.6117/kmeps.2022.29.4.077

Electrochemical Evaluation of Etching Characteristics of Copper Etchant in PCB Etching  

Lee, Seo-Hyang (Department of Materials Science and Engineering, Hongik University)
Lee, Jae-Ho (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.4, 2022 , pp. 77-82 More about this Journal
Abstract
During etching process of PCB, the electroplated copper line and seed layer copper have different etching rates and it caused the over etching of copper line as well as undercut of lines. In this research, the effects of etchants composition on copper etching characteristics were investigated. The optimum concentration of hydrogen peroxide and sulfuric acid of etchants were obtained using polarization and OCV (open circuit voltage) analysis for both rolled copper and electroplated copper. The inhibiting effects of different inhibitors were investigated using OCV and ZRA (zero resistance ammeter) analysis. The galvanic current between electroplated copper and seed layer copper were measured using ZRA method. Inhibitors for least galvanic current could be chosen based on galvanic coupling in ZRA analysis.
Keywords
Copper etching; undercut; inhibitor; galvanic current; ZRA;
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Times Cited By KSCI : 1  (Citation Analysis)
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