• Journal of the Korean Electrochemical Society
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• v.10 no.2
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• pp.94-103
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• 2007

The transition of interconnection metal from aluminum alloy to copper has been introduced to meet the requirements of high speed, ultra-large scale integration, and high reliability of the semiconductor device. Since copper, which has low electrical resistivity and high resistance to degradation, has different electrical and material characteristics compared to aluminum alloy, new related materials and processes are needed to successfully fabricate the copper interconnection. In this review, some important factors of multilevel copper damascene process have been surveyed such as diffusion barrier, seed layer, organic additives for bottom-up electro/electroless deposition, chemical mechanical polishing, and capping layer to introduce the related issues and recent research trends on them.

• Applied Chemistry for Engineering
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• v.8 no.3
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• pp.533-542
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• 1997

Due to the trends of faster and denser circuit design, dielectric properties of packaging materials for semiconductor will give a greater influence on performance and reliability. Also as chip becomes more densified, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semiconductor packaging materials are low values of dielectric constant, high values of thermal conductivity, relatively low values of thermal expansion coefficient and low cost. Thus, in this study, to achieve increased performance of EMC, crystalline silica was selected as the filler for epoxy matrix. As a result, when the volume percent of crystal silica was 60~70%, good properties as packaging materials for semiconductor were achieved. In addition, overall molding condition of EMC in this experiment was established.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Proceedings of the KOR-BRONCHOESO Conference
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• 1981.05a
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• pp.3.3-4
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• 1981

We have observed foreign body in food and air passage in 138 cases during the period from Jan. 1972 to Dec. 1980 in E.N.T. department of Kyung Hee university hospital. The following results were obtained. 1) Age distribution was predominent in under 5 years old showing 102 cases (73.9%). 2) Distribution of location was 132 cases in food passage and 6 cases in air passage. 3) In food passage, malewas 81 cases (61.4%). In air passage, male was 4 cases(66.7%). 4) Coin was the most frequent foreign body in food passage. Others were metals, meats, bony pieces, and shell. 5) Distribution of lodgement was frequent in first narrowing of esophagus. 6) Duration of lodgement was 112 cases (84.8%) within 24 hours in food passage and 4 cases (66.7%) within 24 hours in air passage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Horticultural Science & Technology
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• v.34 no.1
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• pp.24-31
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• 2016

This study investigated the effects of flower and fruit thinning agents on fruit set and harvested fruit quality attributes in 'Gamhong' apples. Lime sulfur, MaxCel (1.9% BA), and Fruitone (3.5% NAA) were applied either at post-bloom or fruitlet stages to mature 'Gamhong/M.9' trees. In 2011, the numbers of fruits per cluster in terminal flowers were 1.74, 0.82, and 1.15 for the control, lime sulfur, and Maxcel (applied at 10-mm fruit stage) treatments, respectively. The percentages of single fruit per cluster were 36.0, 47.9, and 48.7% for the control, lime sulfur, and Maxcel (10 mm) treatments, respectively, while the percentages of clusters with three fruits per cluster were 22.9, 1.4, and 5.8%. In lateral flowers, fruit numbers per cluster were 1.20, 0.36, and 0.50 for the control, lime sulfur, and Maxcel (10 mm) treatments, respectively. In 2012, all the thinning treatments showed a positive effect on flower and fruit thinning, compared with the control. Moreover, the treatment with thinning agents did not affect fruit quality. Overall, the results suggest that a single application of flower or fruit thinning agents would be sufficient, rather than the mixed application of thinning agents, based on the observed decrease in fruit setting.

• Membrane Journal
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• v.27 no.2
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• pp.154-166
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• 2017

Polymeric films for gas barrier applications such as food packaging and electronic devices have attracted great interest due to their cheap, light and easy processability among gas barrier materials. Especially in electronic devices, extremely low gas permeance is necessary for maintaining the device performance. However, current polymeric barrier films still suffer from relatively high gas permeance than other materials. Therefore, there have been strong needs to enhance the gas barrier performance of polymeric barrier films while keep their own advantages. Recently, graphene is highlighted as a 2D-layered material for gas barrier applications. However, owing to the poor workability and difficulty to produce in engineering scale, graphene oxide (GO) is on the rise. GO consists of oxygen-containing functional groups on surface with intrinsic 2D-layered structure and high aspect ratio, and it can be well-dispersed in aqueous polar solvents like water, resulting in scalable mass production. Here, we prepared GO incorporated polyimide (PI) nanocomposites. PI is widely used barrier polymer with high mechanical strength and thermal and chemical stability. We demonstrated that PI/GO nanocomposites could perform as a gas barrier. Furthermore, surfactants (Triton X-100 (TX) and Sodium deoxycholate (SDC)) are introduced to enhance the gas barrier performance by improving the degree of dispersion of GO in PI matrix. As a result, TX enhanced the gas barrier performance of PI/GO nanocomposites which is similar to predicted value. This finding will provide new insight to polymer nanocomposites for gas barrier applications.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.1-8
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• 2019

Fabrication of monolayer is important method for enhancing physical and chemical characteristics such as light shielding and antireflection while maintaining thin film properties. In previous studies, monolayers were fabricated by various methods on small substrates, but processes were complicated and difficult to form monolayers with large area. We used rod coating equipment with a small amount of coating liquid to form a HCP (hexagonal closed packing) coating of PMMA beads on PET(poly(ethylene terephthalate)) substrate with $20cm{\times}20cm$ size. We observed that changes in morphologies of monolayers by using the solvents with different boiling points and vapor pressures, by adapting surfactants on particles and by applying plasma treatment on substrates. The coverage was increased by 20% by optimizing the coating conditions including meniscus of beads, control of the attraction - repulsion forces and surface energy. This result can potentially be applied to optical films and sensors because it is possible to make a uniform and large-scale monolayer in a simple and rapid manner when it is compared to the methods in previous studies.

• KSBB Journal
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• v.23 no.3
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• pp.257-262
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• 2008

In this study, the reaction conditions for lipase-catalyzed resolution of racemic naproxen 2,2,2-trilfluoroethyl thioester were optimized, and the effect of surfactants was investigated. Among the organic solvents tested, the isooctane showed the highest conversion (92.19%) in a hydrolytic reaction of (S)-naproxen 2,2,2-trifluoroethyl thioester. In addition, the isooctane induced the highest initial reaction rate of (S)-naproxen 2,2,2-trifluoroethyl thioester ($V_s=2.34{\times}10^{-2}mM/h$), the highest enantioselectivity (E = 36.12) and the highest specific activity ($V_s/(E_t)=7.80{\times}10^{-4}mmol/h{\cdot}g$) of lipase. Furthermore, reaction conditions such as temperature, concentration of the substrate and enzyme, and agitation speed were optimized using response surface methodology (RSM), and the statistical analysis indicated that the optimal conditions were $48.2^{\circ}C$, 3.51 mM, 30.11 mg/mL and 180 rpm, respectively. When the optimal reaction conditions were used, the conversion of (S)-naproxen 2,2,2-trifluoroethyl thioester was 96.5%, which is similar to the conversion (94.6%) that was predicted by the model. After optimization of reaction conditions, the initial reaction rate, lipase specific activity and conversion of (S)-naproxen 2,2,2-trifluoroethyl thioester increased by approximately 19.54%, 19.12% and 4.05%, respectively. The effect of surfactants such as Triton X-100 and NP-10 was also studied and NP-10 showed the highest conversion (89.43%), final reaction rate of (S)-naproxen 2,2,2-trifluoroethyl thioester ($V_s=1.175{\times}10^{-2}mM/h$) and enantioselectivity (E = 59.24) of lipase.