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The Aging Effect of $Avimid^(R)$ K3B/1M7 Laminates in $80^{\circ}C$ Water ($Avimid^(R)$ K3B/IM7 복합재료의 $80^{\circ}C$ 물에서의 노화현상)

  • Kim Hyung-Won
    • Journal of the Korean Society of Propulsion Engineers
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    • v.9 no.4
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    • pp.23-30
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    • 2005
  • The Hygrothermal aging of the laminates of $Avimid^(R)$ K3B/IM7 in $80^{\circ}C$ water was studied as a function of immersion time prior to forming microcracks. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, the change in residual stresses or the interfacial damage between the fiber and the matrix. The times to saturation in $80^{\circ}C$ water for the laminates and for the neat resin were 100 hours and 500 hours. After 500 hours aging of the neat resin, the glass transition temperature was changed less than 1% by DSC test, and the weight gain was 1.55% increase with the diffusion coefficient $7\times10^{-6}m/s^2$ and the fracture toughness was decreased about 41%. After 100 hours fully saturated aging of the ${[+45/0/-45/90]}_s$ K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was 0.41% increase with the diffusion coefficient $1\times10^{-6}m/s^2$. In 100 hours, the loss of the fracture toughness of the laminates was 43.8% of the original toughness by the microcracking fracture toughness criterion. Therefore, the main factor to degrade the microcracking toughness of the laminates could be the degradation of the matrix fracture toughness.

A Study of High-Quality Factor Solenoid-Type RF Chip Inductor Utilizing Amorphous $Al_2O_3$ Core Material (비정질 $Al_2O_3$ 코아 재료를 이용한 Solenoid 형태의 고품질 RF chip 인덕터에 관한 연구)

  • Lee, Jae-Wook;Jung, Young-Chang;Yun, Eui-Jung;Hong, Chol-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.6
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    • pp.34-42
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    • 2000
  • Recently, there is a growing need to develope small-size RF chip inductors operating to GHz to realize high-performance, micro-fabricated wireless communication products. For the development of high-performance RF chip inductors, however, the ferrite-based chip inductors can not be used above 300MHz due to the limitation of the permeability of this material. In this work, small-size, high-performance RF chip inductors utilizing amorphous $Al_2O_3$ core material were investigated. Copper (Cu) with 40${\mu}m$ diameter was used as the coils and the chip inductor size fabricated in this work is $2.1mm{\times}1.5mm{\times}1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on the bottom edges of a core material. The composition of core materials was measured using a EDX. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The developed inductors have the self-resonant frequency (SRF) of 1 to 3.5 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

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Solvent-free UV-curable Acrylic Adhesives for 3D printer build sheet (3D 프린터 빌드시트용 무용제 UV 경화형 아크릴 점착제의 제조)

  • Lee, Bae Hwa;Park, Dong Hyup;Kim, Byung Jick
    • Journal of Adhesion and Interface
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    • v.21 no.3
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    • pp.93-100
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    • 2020
  • 3D printing technology enables proper objects to be made through an additive manufacturing method, but resulting in dimension deviation of the product due to contraction phenomenon as cooling melted filament resin injected from high-temperature use environment. In this research, we studied on acrylic adhesives for 3D printer build sheet in order to fabricate high-quality products with a precise shape and to well-mount without distortion. The solvent-free UV-curable acrylic adhesive formulation was designed by adding 4-acryloylmorpholine (ACMO) with high adhesion, toughness, glass transition temperature so that adhesion properties are stable at high temperature and products are easily mounted/detached from the adhesives. The designed formulation was polymerized through two-steps using post-addition of monomers. Using this, the acrylic adhesive was coated to make a film and then analyzed using various experimental techniques. As a result, the fabricated adhesive exhibited high glass transition temperature and there was little gap in peel strength before and after thermal treatment. Moreover, it was confirmed by rheological analysis that this adhesive can provide great bonding/debonding ability without distortion. We demonstrated the fabrication of a rectangular product using a 3D printing method using our acrylic adhesive as a build sheet. Mounting ability and workability were satisfactory and dimension deviation of the product was tiny. Because the product is easily detachable from the acrylic adhesive developed here than conventional build sheets, it is expected that this will provide work convenience to users who use the 3D printer.

Tuff Cones and Tuff Rings, and Their Stratigraphic Relationships on the Western Side of Cheju Island, Korea (제주도(濟州道) 서부(西部)의 응회구(凝灰丘) 및 응회환(凝灰環) 과 이들의 층서(層序) 관계(關係))

  • Hwang, Sang Koo;Hwang, Jae Ha;Kim, Dong Hak;Howells, M.F.
    • Economic and Environmental Geology
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    • v.24 no.4
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    • pp.399-408
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    • 1991
  • There are several tuff cones and tuff rings, now only apparent on the western shoreline in Cheju Island. The observation of their landform, bedform, particle size and sorting reveals that these deposits are mainly emplaced by base surges and/or slurries originating from Surtseyan eruption which is attributed to explosive hydrovolcanism influenced by interaction of magma with external water. These are subdivided into two groups based on the plateau basalt. It is recognized that the distal limb of early tuff cones and ring at Dangsanbong, Dansan, Sanbangsan and Hwasun (lower group) are overlain by plateau basalt, on which later tuff rigns at Suwolbong and Songaksan(upper group) further extend the distal limb from each vent. The tuff cones and tuff rings are closely associated with the evidences which shelly fragments are comprised within them, and reworked tuffs, raised beach deposits, Sinyangri formation and littoral cones are deposited around them. The evidences suggest that the Surtseyan eruption resulted from direct or indirect interaction of magma with sea water.

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Changes of Soil Physico-Chemical Properties under Different Tillages of Paddy Soil (경운방법(耕耘方法)에 따른 논 토양(土壤)의 이화학성(理化學性) 변화(變化))

  • Yoo, Chul-Hyun;Shin, Bog-Woo;Jeong, Ji-Ho;Han, Sang-Soo;Kim, Seong-Jo;Han, Seong-Soo
    • Korean Journal of Soil Science and Fertilizer
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    • v.30 no.2
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    • pp.140-145
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    • 1997
  • The change of physico-chemical properties of paddy soil was monitored under different tillage. This study was conducted on Jeonbug silty cly loam, in Honam Agricultural Experiment Station, for four years starting from 1992. Different tillage involved (1)Continued no tillage, (2)Rotavation only with tractor every year, (3)Spring plowing with power tiller plus rotavation with tractor every year. The result of this study can be summarized as: Non tillage, when continued for some years, tended to increase 1)the hardness of soil, 2)the root density in the top soil, 3)the occurrence of annual and perennial weeds, and tended to lower the yield of rice compared to normal tillage(tilling with ow tiller in the spring plus rotavation by tractor before planting.

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Wide Range Analog Dual-Loop Delay-Locked Loop (광대역 아날로그 이중 루프 Delay-Locked Loop)

  • Lee, Seok-Ho;Kim, Sam-Dong;Hwang, In-Seok
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.44 no.1
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    • pp.74-84
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    • 2007
  • This paper presents a new dual-loop Delay Locked Loop(DLL) to expand the delay lock range of a conventional DLL. The proposed dual-loop DLL contains a Coarse_loop and a Fine_loop, and its operation utilizes one of the loops selected by comparing the initial time-difference among the reference clock and 2 internal clocks. The 2 internal clock signals are taken, respectively, at the midpoint and endpoint of a VCDL and thus are $180^{\circ}$ separated in phase. When the proposed DLL is out of the conventional lock range, the Coarse_loop is selected to push the DLL in the conventional lock range and then the Fine_loop is used to complete the locking process. Therefore, the proposed DLL is always stably locked in unless it is harmonically false-locked. Since the VCDL employed in the proposed DLL needs two control voltages to adjust the delay time, it uses TG-based inverters, instead of conventional, multi-stacked, current-starved inverters, to compose the delay line. The new VCDL provides a wider delay range than a conventional VCDL In overall, the proposed DLL demonstrates a more than 2 times wider lock range than a conventional DLL. The proposed DLL circuits have been designed, simulated and proved using 0.18um, 1.8V TSMC CMOS library and its operation frequency range is 100MHz${\sim}$1GHz. Finally, the maximum phase error of the DLL locked in at 1GHz is less than 11.2ps showing a high resolution and the simulated power consumption is 11.5mW.

Implementation of an LTCC RF Front-End Module Considering Parasitic Elements for Wi-Fi and WiMAX Applications (기생 성분을 고려한 Wi-Fi와 WiMAX용 LTCC 무선 전단부 모듈의 구현)

  • Kim, Dong-Ho;Baek, Gyung-Hoon;Kim, Dong-Su;Ryu, Jong-In;Kim, Jun-Chul;Park, Jong-Chul;Park, Chong-Dae
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.4
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    • pp.362-370
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    • 2010
  • In this paper, a compact RF Front-end module for Wireless Fidelity(Wi-Fi) and Worldwide Interoperability for Microwave Access(WiMAX) applications is realized by low temperature co-fired ceramic(LTCC) technology. The RF Front-end module is composed of three LTCC band-pass filters, a Film Bulk Acoustic Resonator(FBAR) filter, fully embedded matching circuits, an SPDT switch for mode selection, an SPDT switch for Tx/Rx selection, and an SP4T switch for band selection. The parasitic elements of 0.2~0.3 pF are generated by the structure of stacking in the top pad pattern for DC block capacitor of SPDT switch for mode selection. These kinds of parasitic elements break the matching characteristic, and thus, the overall electrical performance of the module is degraded. In order to compensate it, we insert a parallel lumped-element inductor on capacitor pad pattern for DC block, so that we obtain the optimized performance of the RF Front-end module. The fabricated RF front-end module has 12 layers including three inner grounds and it occupies less than $6.0mm{\times}6.0mm{\times}0.728mm$.

Laboratory and Full-scale Testing to Investigate the Performance of Rock Fall Protection System with Hexagonal Wire Net (육각 낙석방지망의 성능평가를 위한 실내 및 실대형실험)

  • Youn, Ilro;Oh, Sewook;Kwon, Youngcheul
    • Journal of the Korean GEO-environmental Society
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    • v.15 no.9
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    • pp.69-75
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    • 2014
  • Rock fall protection system installed against rock slope is one of the most conventional way to protect nearby infra structures. Despite of wide application of typical rectangular nets, virtually installed to protect rock slope face, several problems have also been pointed out up to date. Rectangular draped nets are vulnerable to a sudden external shock such as rock fall, because it doesn't have any systematical buffers or shock absorbers. Furthermore, it has been widely recognized from the some cases of rock fall accident in Korea that rock fall protection nets cause wide range of failure in the rock slope faces due to insufficient pullout bearing capacity of fixing parts. Therefore, in this study, we tried to make a consideration about the problems of existing standard rock fall protection nets in Korea, and develop a new type of hexagonal net with a shock absorber based on design rock fall energy. In this paper, laboratory and full scale test procedure is described to analysis the performance of newly developed hexagonal rock fall net, and the key results are presented and discussed.

Failure Characteristics of Scarf Patch-repaired Composite Single-lap Joints (스카프 패치로 수리한 복합재 단일겹침 체결부의 파손 특성 연구)

  • Kim, Choong-Hyun;Yoo, Jae-Seung;Byeon, Chang-Seok;Ju, Hyun-Woo;Park, Min-Young;Choi, Jin-Ho;Kweon, Jin-Hwe
    • Composites Research
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    • v.29 no.3
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    • pp.117-124
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    • 2016
  • The failure strength of composite single-lap joint repaired using scarf patch was investigated by test and finite element method. A total of 45 specimens were tested changing scarf ratio, stacking pattern, and defect size to study the failure strength and mode. Except for one case, all repaired specimens showed the equal or higher strength than the sound specimens and the effect of considered repair parameters was not remarkable. It was found through the failure mode inspection that the surface treatment for bonding was not enough in the case which failed at the lower load than the sound specimen. Three-dimensional finite element analysis was conducted to verify the test results. It was confirmed that the considered repair parameters do not significantly affect the stress distribution of the specimens. It was also observed that the applied tensile load is relieved passing through the overlapped region thickness of which is almost double. From this study, it is concluded that if the bonding procedure for adherends and patch including surface treatment for fabric layer is thoroughly followed, the strength of repaired single-lap joint can be restored up to the strength of sound one.

Development of Method for Manufacturing Freeform EPS Forms Using Sloped-LOM Type 3D Printer (Sloped-LOM 방식 3D 프린터를 이용한 비정형 EPS 거푸집 제작 공법 개발)

  • Ahn, Heejae;Lee, Dongyoun;Ji, Woojong;Lee, Woojae;Cho, Hunhee
    • Journal of the Korea Institute of Building Construction
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    • v.20 no.2
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    • pp.171-181
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    • 2020
  • Recently, free-formed construction technology is becoming a new measure of representing technological superiority and sociocultural ingenuity. However, the CNC processing technology utilizing the existing wood and iron form has limitations in terms of the manufacturing time and material cost. Therefore, in this study, the method and process of manufacturing free-formed EPS form using S-LOM-based 3D printing technology were suggested. Furthermore, through the mock-up test, a comparative analysis of the manufacturing time and precision with CNC milling technology was conducted. The results show that S-LOM-based 3D printing technology has reduced manufacturing time about 57.4% compared to CNC milling technology during the free-formed EPS form manufacturing process. In addition, compared to the design drawings, the maximum error value was 20.5mm, proving the applicability of S-LOM-based 3D printing technology. The results of this study are expected to contribute to the improvement of S-LOM method and the activation of S-LOM method by verifying the applicability of S-LOM-based 3D printing technology.