• 대한기계학회논문집A
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• 제29권4호
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• pp.632-638
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• 2005

The surface lapping process on sapphire wafer was carried out for the epitaxial process of thin film growth of GaN semiconducting material. The planarization of the wafers was investigated by the introduction of the dummy wafers. The diamond lapping process causes the surface deformation of dislocation and micro-cracks. The material deformation due to the mechanical stress was analyzed by the X-ray diffraction and the Vickers indentation. The fracture toughness was increased with the increased annealing temperature indicating the recrystallization at the surface of the sapphire wafer The sudden increase at the temperature of $1200^{\circ}C$ was correlated with the surface phase transition of sapphire from a $-A1_{2}O_{3}\;to\;{\beta}-A1_{2}O_{3}$.

• 대한기계학회논문집A
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• 제25권11호
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• pp.1844-1853
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• 2001

In the present investigation, it was attempted to design the rolling pass schedule fur a clean steel of 0.1C-1.5Mn-0.25Si with the objective of the austenite grain refinement. As the method of approach, a coupled mathematical modeling technique was proposed which consists of a recrystallization model and a flow stress modes. The validity of the coupled model was examined through comparison with results of continuous and discontinuous compression tests at various temperatures, strains and strain rates. The coupled model was incorporated with the finite element method to set up a systematic design methodology far the rolling path schedule for austenite grain refinement. Two path schedules were obtained and discussed in the paper with regard to rolling path time, average grain size, grain size deviation in thickness, etc.

• 대한기계학회논문집A
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• 제27권3호
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• pp.464-471
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• 2003

Among various methods to acquire high strength in plain carbon steel, the mettled of grain refinement by controlling thermo-mechanical processing parameters has gained a great attention if steel rolling industries. In the present study, three different rolling pass schedules are proposed to obtain fine grains which are based on combined results of recrystallization modelling, finite element analysis and experiment. Since meta-dynamic or dynamic recrystallization has been found to be very effective in producing fine grains, reduction ratio and interpass time in the proposed rolling pass schedules were determined in order to invoke such recrystallization as often as possible.

• 대한기계학회논문집A
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• 제30권6호
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• pp.637-642
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• 2006

A plastic zone size is regarded as a measure of material resistance, and also it determines the fracture behavior. The importance of estimating or measuring the plastic zone size cannot be too emphasized. In this article, SDSP(Stereo Digital Speckle Photography) is examined as a new techniques to measure the plastic zone developed in a ductile metal. This technique is simple, vibration free and non-contact, and measures simultaneously in-plane displacements as well as out-of plane displacements like the side necking. Experimental results for a CT specimen are presented to demonstrate the accuracy in comparison with those obtained by recrystallization technique and finite element analysis.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 제3회 압연심포지엄 논문집 압연기술의 미래개척 (Exploitation of Future Rolling Technologies)
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• pp.341-348
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• 1999

In the finite elemenet analysis of metal forming problems, the most critical input is the flow stress of workpiece. Conventionally, the flow stress of a metal at elevated temperatures is assumed to be a function of strain, strain rate and temperature, and obtained by experiment. However, if the workpiece is not continuously deformed as in mulit-pass rolling, the flow stress obtained by experiment is no longer valid because it does not consider the microstructure evolution occurring between deformations. In the present study, it was attemped that the flow stress of steel in the austenite region be obtained equations. It was applied to the prediction of flow stress variation at each stand during hot finishing rolling of steel.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1995년도 추계학술대회논문집
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• pp.167-171
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• 1995

The formation of preferred orientations in cold rolled and recrystallized Inconel 690 sheets was studied by the x-ray texture measurements and TEM observations. The increasing{220} pole intensity in the plane normal at the higher reductions was related to the{110}<112> texture component. The rolling texture of the Inconel 690 was the pure metal type. THe dislocation cells were found in the near{110}<112> oriented grains. The onset of deformation twins in the {112}<111>oriented grains. The onset of deformation twins in the {112}<111> oriented grains. The onset of deformation twins in the {112}<111> oriented grains caused the weakening of {112}<111> and the development of {552}<115> in the rolling texture. The annealing texture of the Inconel 690 sheets was dependent on the annealing temperature. The annealing texture of 750$^{\circ}C$ annealed sheets was similar to the cold rolling texture. The major preferred orientations of the 950$^{\circ}C$ annealed specimens were {112}<110> and {001}<110>. The formation of fine and closely spaced annealing twins in the specimen annealed at 1150$^{\circ}C$ led to the randomization of the annealing texture.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.77-80
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• 1997

The torsion tests in the range of 900~110$0^{\circ}C$, 5.0$\times$10-2~5.0$\times$100/sec were performed to study the recry stallization behavior of 304 stainless steel in the high temperature multistage deformation. The no-recrystallization temperature(Tnr) and fractional softening(FS) were determined by the change of flow curves. The inflection points of stress slope were moved to lower temperature area as the strain rate and the interrupt time were increased. From the multipass flow curve, the intersection between pass stress and FS curve was corresponding to the pass which the FS dropped abruptly and it was shown that the recrystallization area could be determined by the FS measurement in multipass deformation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.135-139
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• 1999

The static softening behavior of AISI 4140 could be characterized by the hot torsion test in the temperature ranges of 10$0^{\circ}C$~120$0^{\circ}C$ and strain rate ranges of 0.05/sec~5/sec. Deformation efficiency which was based on dynamic materials model was calculated from flow stress curves obtained continuous deformation. Interrupted deformation was performed with 2 pass deformation in the pass strain ranges of 0.25{{{{ epsilon _p}}}} ~3{{{{ epsilon _p}}}} and interrupted time ranges of 0.5~100sec. The dependences of process variables pass strain ({{{{ epsilon _i}}}}) stain rate ({{{{ {. } atop {$\varepsilon$ } }}}}) temperature (T) and interpass time ({{{{ {t }_{i } }}}}) on static recrystallization (SRX) and metadynamic recrystallization .(MDRX) could be indicidually predicted from the modified Avrami's equations. Comparison of the softening kinetics between MDRX and SRX showed that the rate of MDRX was more rapid than that of SRX for the same deformation variables. Controlled multipass deformations were performed using deformation efficiency static and metadynamic recrystallization of AISI 4140.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.21-23
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• 2005

The electron transport coefficients, the electron drift velocity W, the longitudinal diffusion coefficient $ND_L$ in $C_{3}F_{8}-Ar$ mixture gases were measured by Double shutter drift tube and calculated by multi-term approximation of the Boltzmann equation over the wide E/N range from 0.03 to 100 Td. And an inelastic collision cross sections for $C_{3}F_{8}$ molecular gas were redetermined for quantitative characteristic analysis.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.