• Title/Summary/Keyword: 입방정 질화붕소

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A Study on the Grinding Characteristics of Stainless Steel with Optimum In-process Electrolytic Dressing (최적 연속 전해드레싱을 적용한 스테인레스 강의 연삭 특성에 관한 연구)

  • 이은상;김정두
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.5
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    • pp.29-37
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    • 1998
  • In recent years, grinding techniques for precision machining of stainless steel used in shaft, screw parts and clear value have been improved by using the superabrasive wheel and precision grinding machine. The completion of optimum dressing of superabrasive wheel makes possible the effective precision grinding of stainless steel. However, the present dressing system cannot have control of optimum dressing of the superabrasive wheel. In this study, a new system and the grinding mechanism of optimum in-process dressing of superabrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of stainless steel (STS304)

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A Study on the Optimum Cutting Conditions of CBN Ball Endmill (CBN 볼 엔드밀의 최적 절삭조건에 관한 연구)

  • Choi, Sangwoo;Lee, Kiwoo;Lee, Jongchan
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.10
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    • pp.157-163
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    • 1997
  • The needs to machine hardened steels with high productivity and good sufrace integrity have been increased in the dies & molds industry. This paper presents some experimental results on the CBN ball endmilling for hardened tool steel. This investigation concerns on the effects of cutting fluids, cutting speed, and feed on the cutting performance such as cutting forces, tool wear, and surface finish. The wear of CBN ball endmill for each cutting conditions were also examined through the microscopic observation. It has been found that the higher cutting speeds with cutting fluids result in better cutting performance.

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Experimental investigation on the wear mechanism of CBN cutting tools (CBM공구의 마모에 관한 실험적 연구)

  • Kwon, O-chul;Lee, Jong-chan
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.6
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    • pp.86-97
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    • 1994
  • An experimental investigation is reported on the wear mechanism of CBN cutting tools. The cutting experiments were conducted on a lathe equipped with a tool dynamometer for cutting force measurement. The investigation of wear mechanism was executed by observing the worn tools using tool microscope and scanning electron microscope. Results indicate that the flank wear occurs dominantly by abrasive wear mode and the crater wear by adhesive wear mode. The results also indicate that the width of flank wear is closely related with the passive component of cutting force.

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Magnetic Polishing Using Ba-Ferrite Magnetic Substance (Ba-Ferrite 자성체를 사용한 자기연마 가공)

  • Yun, Yeo-Kwon;Kim, Hee-Nam
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.4
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    • pp.491-497
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    • 2010
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has an aim for clean technology in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get the best surface roughness at low cost. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. In this paper, We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

Effect of Moisture in a Vacuum Chamber on the Deposition of c-BN Thin Film using an Unbalanced Magnetron Sputtering Method (비대칭 마그네트론 스퍼터링 방법에 의한 질화붕소막의 증착시 반응실내의 초기 수분이 입방정질화붕소 박막의 형성에 미치는 영향)

  • Lee, Eun-Sook;Park, Jong-Keuk;Lee, Wook-Seong;Seong, Tae-Yeon;Baik, Young-Joon
    • Journal of the Korean Ceramic Society
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    • v.49 no.6
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    • pp.620-624
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    • 2012
  • The role of moisture remaining inside the deposition chamber during the formation of the cubic boron nitride (c-BN) phase in BN film was investigated. BN films were deposited by an unbalanced magnetron sputtering (UBM) method. Single-crystal (001) Si wafers were used as substrates. A hexagonal boron nitride (h-BN) target was used as a sputter target which was connected to a 13.56 MHz radiofrequency electric power source at 400 W. The substrate was biased at -60 V using a 200 kHz high-frequency power supply. The deposition pressure was 0.27 Pa with a flow of Ar 18 sccm - $N_2$ 2 sccm mixed gas. The inside of the deposition chamber was maintained at a moisture level of 65% during the initial stage. The effects of the evacuation time, duration time of heating the substrate holder at $250^{\circ}C$ as well as the plasma treatment on the inside chamber wall on the formation of c-BN were studied. The effects of heating as well as the plasma treatment very effectively eliminated the moisture adsorbed on the chamber wall. A pre-deposition condition for the stable and repeatable deposition of c-BN is suggested.

c-BN 박막의 박리특성 향상에 관한 연구

  • 이성훈;변응선;이건환;이구현;이응직;이상로
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.124-124
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    • 2000
  • 다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가진 입방정 질화붕소(cubic boron nitride)는 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되는 재료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 크게 기대된다. 이 때문에 각종의 PVD, CVD 공정을 이용하여 c-BN 박막의 합성에 대한 연구가 광범위하게 진행되어 많은 성공사례들이 보고되고 있다. 그러나 c-BN 박막의 유용성에도 불구하고 아직 실제적인 응용이 이루어지지 못한 것은 c-BN 박막의 증착직후 급격한 박리현상 때문이다. 본 연구에서는 평행자기장을 부가한 ME-ARE(Magnetically Enhanced Activated Reactive Evaporation)법을 이용한 c-BN 박막의 합성에서 적용한 증착공정 인자들의 변화에 따른 박리특성 고찰과 함께 다층박막화 및 제 3원소 혼입 방법을 적용하여 박리특성 향상 정도를 조사하였다. BN 박막합성은 전자총에 의해 증발된 보론과 (질소+아르곤) 플라즈마의 활성화반응증착(Activated Reactive Evaporation)에 의해 이루어졌다. 기존의 ARE 장치와 달리 열음극(got cathode)과 양극(anode) 사이에 평행자기장을 부가하여 플라즈마의 증대시켜 반응효율을 높였다. 합성실험용 모재로는 p-type으로 도핑된 (100) Si웨이퍼를 30$\times$40mmzmrl로 절단 후, 10%로 희석된 완충불산용액에 10분간 침적하여 표면의 산화층을 제거한 후 사용하였다. 박막실험실에서의 주요공정변수는 기판바이어스 전압, discharge 전류, Ar/N2가스유량비이었다. 합성된 박막의 결정성 분석을 FTIR을 이용하였으며, BN 박막의상 및 미세구조관찰을 위해 투과전자현미경(TEM;Philips EM400T) 분석을 병행하였고, 박막의 기계적 물성 평가를 위해 미소경도를 측정하였다. 박리특성의 고찰은 대기중에서의 자발적 박리가 일어나 90%이상의 박리가 진행된 시점까지의 시간을 측정하였고, 증착직후 박막의 잔류응력 변화와 연관하여 고찰해 보았다.

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Effect of Oxygen Addition on Residual Stress Formation of Cubic Boron Nitride Thin Films (입방정 질화붕소 박막의 잔류응력 형성에 미치는 산소 첨가 효과)

  • Jang, Hee-Yeon;Park, Jong-Keuk;Lee, Wook-Seong;Baik, Young-Joon;Lim, Dae-Soon;Jeong, Jeung-Hyun
    • Journal of the Korean institute of surface engineering
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    • v.40 no.2
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    • pp.91-97
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    • 2007
  • In this study we investigated the oxygen effect on the nucleation and its residual stress during unbalanced magnetron sputtering. Up to 0.5% in oxygen flow rate, cubic phase (c-BN) was dominated with extremely small fraction of Hexagonal phase (h-BN) of increasing trend with oxygen concentration, whereas hexagonal phase is dominated beyond 0.75% flow rate. Interestingly, the residual stress in cubic-phase-dominated films was substantially reduced with small amount of oxygen (${\sim}0.5%$) down to a low value comparable to the h-BN case. This may be because oxygen atoms break B-N $sp^3$ bonds and make B-O bonds more favorably, increasing $sp^2$ bonds preference, as revealed by FTIR and NEXAFS. It was confirmed by experimental facts that the threshold bias voltage for nucleation and growth of cubic phase were increased from -55 V to -70 V and from -50 V to -60 V respectively. The reduction of residual stress in O-added c-BN films is seemingly resulting from the microstructure of the films. The oxygen tends to increase slightly the amount of h-BN phase in the grain boundary of c-BN and the soft h-BN phase of 3D network including surrounding nano grains of cubic phase may relax the residual stress of cubic phase.

Improving Thermal Conductivity of Neutron Absorbing B4C/Al Composites by Introducing cBN Reinforcement (cBN 입자상 강화재 첨가에 따른 중성자 흡수용 B4C/Al 복합재의 열전도도 변화 연구)

  • Minwoo Kang;Donghyun Lee;Tae Gyu Lee;Junghwan Kim;Sang-Bok Lee;Hansang Kwon;Seungchan Cho
    • Composites Research
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    • v.36 no.6
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    • pp.435-440
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    • 2023
  • This study aimed to enhance the thermal conductivity of B4C/Al composite materials, commonly used in transport/storage containers for spent nuclear fuel, by incorporating both boron carbide (B4C) and cubic boron nitride(cBN) as reinforcing agents in an aluminum (Al) matrix. The composite materials were successfully manufactured through a stir casting process and practical neutron-absorbing materials were obtained by rolling the fabricated composite ingot. The evaluation of the thermal conductivity of the fabricated composites was carried out because thermal conductivity is critical for neutron absorbing materials. The thermal conductivity measurement results indicated an approximately 3% increase in thermal conductivity under the same volume fraction when compared to composite materials using only B4C particles. Through neutron absorption cross-sectional area calculations, it was confirmed that the neutron absorption capability decreased to a negligible level. Based on the findings of this study, new design approaches for neutron absorption materials are proposed, contributing to the development of high-performance transport/storage containers.

Effect of Residual Oxygen in a Vacuum Chamber on the Deposition of Cubic Boron Nitride Thin Film (진공조의 잔류산소가 입방정질화붕소 박막 합성에 미치는 영향)

  • Oh, Seung-Keun;Kim, Youngman
    • Journal of the Korean institute of surface engineering
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    • v.46 no.4
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    • pp.139-144
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    • 2013
  • c-BN(cubic boron nitride) is known to have extremely high hardness next to diamond, as well as very high thermal and chemical stability. The c-BN in the form of film is useful for wear resistant coatings where the application of diamond film is restricted. However, there is less practical application because of difficult control of processing variables for synthesis of c-BN film as well as unclear mechanism on formation of c-BN. Therefore, in the present study, the structural characterization of c-BN thin film were investigated using $B_4C$ target in r.f. magnetron sputtering system as a function of processing variables. c-BN films were coated on Si(100) substrate using $B_4C$ (99.5% purity). The mixture of nitrogen and argon was used for carrier gas. The deposition processing conditions were changed with substrate bias voltage, substrate temperature and base pressure. Fourier transform infrared microscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) were used to analyze crystal structures and chemical binding energy of the films. In the case of the BN film deposited at room temperature, c-BN was formed in the substrate bias voltage range of -400 V~ -600 V. Less c-BN fraction was observed as deposition temperature increased and more c-BN fraction was observed as base pressure increased.

c-BN 박막의 박리현상에 미치는 공정인자의 영향

  • 이성훈;변응선;이건환;이구현;이응직;이상로
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.148-148
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    • 1999
  • 다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가진 입방정 질화붕소(cubic Boron Nitride)는 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되는 자료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 기대되는 재료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 크게 기대된다. 이 때문에 각종의 PVD, CVD 공정을 이용하여 c-BN 박막의 합성에 대한 연구가 광범위하게 진행되어 많은 성공사례들이 보고되고 있다. 그러나 이러한 c-BN 박막의 유용성에도 불구하고 아직 실제적인 응용이 이루어지지 못한 것은 증착직후 급격한 박리현상을 보이는 c-BN 박막의 밀착력문제때문이다. 본 연구에서는 평행자기장을 부가한 ME-ARE(Magnetically Enhanced Activated Reactive Evaporation)법을 이용하여 c-BN 박막을 합성하고, 합성된 c-BN 박막의 밀착력에 미치는 공정인자의 영향을 규명하여, 급격한 박리현상을 보이는 c-BN 박막의 밀착력 향상을 위한 최적 공정을 도출하고자 하였다. BN 박막 합성은 전자총에 의해 증발된 보론과 (질소+아르곤) 플라즈마의 활성화반응증착(activated reactive evaporation)에 의해 이루어졌다. 기존의 ARE장치와 달리 열음극(hot cathode)과 양극(anode)사이에 평행자기장을 부여하여 플라즈마를 증대시켜 반응효율을 높혔다. 합성실험용 모재로는 p-type으로 도핑된 (100) Si웨이퍼를 30$\times$40 mm크기로 절단 후, 100%로 희석된 완충불산용액에 10분간 침적하여 표면의 산화층을 제거한후 사용하였다. c-BN 박막을 얻기 위한 주요공정변수는 기판바이어스 전압, discharge 전류, Ar/N가스유량비이었다. 증착공정 인자들을 변화시켜 다양한 조건에서 c-BN 박막의 합성하여 밀착력 변화를 조사하였다. 합성된 박막의 결정성 분석을 FTIR을 이용하였으며, Bn 박막의 상 및 미세구조관찰을 위해 투과전자현미경(TEM;Philips EM400T) 분석을 병행하였고, 박막의 기계적 물성 평가를 위해 미소경도를 측정하였다. 증착된 c-BN 박막은 3~10 GPa의 큰 잔류응력으로 인해 증착직후 급격한 박리현상을 보였다. 이의 개선을 위해 증착중 기판바이어스 제어 및 후열처리를 통해 밀착력을 수~수백배 향상시킬 수 있었다. c-BN 박막의 합성을 위해서는 증착중인 박막표면으로 큰 에너지를 갖는 이온의 충돌이 필요하기 때문에 기판 바이어스가 요구되는데, c-BN의 합성단계를 핵생성 단계와 성장 단계로 구분하여 인가한 기판바이어스를 달리하였다. 이 결과 그림 1에서 나타낸 것처럼 c-BN 박막의 핵생성에 필요한 기판바이어스의 50% 정도만을 인가하였을 때 잔류응력은 크게 경감되었으며, 밀착력이 크게 향상되었다.

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