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http://dx.doi.org/10.6110/KJACR.2015.27.8.426

Experimental Study on the Thermal Performance of a Printed Circuit Heat Exchanger in a Cryogenic Environment  

Kim, Dong Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Na, Sang Jun (Plant System and Machinery, Korea University of Science and Technology)
Kim, Young (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Choi, Jun Seok (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Yoon, Seok Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.27, no.8, 2015 , pp. 426-431 More about this Journal
Abstract
The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.
Keywords
Printed circuit heat exchanger; Cryogenic heat exchanger; Heat transfer correlation;
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