• Fashion & Textile Research Journal
• /
• v.6 no.4
• /
• pp.440-446
• /
• 2004

The purpose of this study was to classify the In-line skate clothing interest of in-line skaters according to in-line skate involvement. The questionnaire was administrated to 124 male, 96 female in-line skaters aged over 20 living in Daegu. Data were analyzed by using Frequency, Factor analysis, One-way analysis of variance, Duncan test, T-test, Correlation analysis. The results of this study can be summarized as follows ; The factor of in-line skate clothing interest of in-line skater were classified into 5 factor, expression orientation, performance enhancement, information dependence, anti deviation, individual assertion. The in-line skate clothing interest, men have interests in performance enhancement, women have interest in individual assertion. The more experience of in-line skate they have. the more interest in performance enhancement they want. High involvement in-line skater have high cloth interesting of sub-factors which are expression orientation, performance enhancement and individual assertion etc. As a result, we need more deliberate marketing strategies for the experience degree, involvement degree and women in-line skater then men.

• Journal of Ocean Engineering and Technology
• /
• v.23 no.1
• /
• pp.135-139
• /
• 2009

In the line heating for the plate forming of a ship's hull, an in line assessment of completion is necessary for an automated production system. In the current curved plate forming process, a fabricated plate is compared to a template that is made in the mold loft and is used for the determination of the heating line for the next step. In this paper, a new method is presented for the in line assessment of completion for curved plate forming. This method uses a 3-D scanner. For the registration of the scanned data for a surface and the target surface, the ICP (Iterative Closest Points) method was adopted. A computer program was developed to carry out the registration, check for similarities, visualize the surface, and control the results. This program was applied to a sample curved plate forming process.

• Journal of Korea Multimedia Society
• /
• v.13 no.3
• /
• pp.400-409
• /
• 2010

This paper presents a position error recognition system when the wafer is mounted in cleaning equipment among the wafer manufacturing processes. The proposed system is to enhance the performance in cost and reliability by preventing the wafer cleaning system from damaging by alerting it when it is put in correct position. The key algorithms are the calibration method between image acquired from camera and physical wafer, a infrared lighting and the design of the filter, and the extraction of wafer boundary and the position error recognition resulting from generation of circle based on least square method. The system is to install in-line process using high reliable and high accurate position recognition. The experimental results show that the performance is good in detecting errors within tolerance.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.23 no.4
• /
• pp.286-291
• /
• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Journal of the Korea Society of Computer and Information
• /
• v.15 no.7
• /
• pp.99-108
• /
• 2010

For effective maintenance for web applications, it is necessary to improve the readability of the source pages. Though CSS(Cascading Style Sheet) belongs to pure presentation layer in various web constituent entities, CSS codes are often used by inlning and they are sometimes automatically generated by web development tools. The existing studies on CSS optimization have only focused on reducing the size of codes and they did not incorporate the readability or the reusability. In this paper, CSS codes are structured and several criteria for readability are defined to improve the readabilty and reusability. Based on them, the algorithm to improve the readability are proposed. Finally, case study are presented to show the applicability of the proposed algorithm.

• The KSFM Journal of Fluid Machinery
• /
• v.18 no.2
• /
• pp.5-13
• /
• 2015

The aim of this study is to investigate the feasibility of a new type of casing for the inline Francis hydro turbine. Comparing with the traditional turbine with spiral casing, this turbine is unique for its flow passage shape at the first stage of flow to the turbine, very similar to a pipe, called inline casing. Before the commercialization of this new type of casing, a global investigation of the inline casing must be conducted. Preserving the structural characteristics of simple, compact-size and convenient for manufacture, different shapes of the belt passage, vertical corner and stay vanes are applied to investigate the influence of flow passage shape on the turbine performance. Stable and relatively high efficiency is achieved regardless of flow passage shape difference proving the feasibility of the inline casing used in a hydro turbine.

• Proceedings of the Korea Information Processing Society Conference
• /
• 2014.11a
• /
• pp.1113-1115
• /
• 2014

본 프로젝트팀에서 개발한 'VTK'(Virtual Training by Kinect)는 아이부터 노인까지 모든 연령이 이용 가능한 기능성 게임으로써 동작인식 컨트롤러인 키넥트를 이용하여 불필요한 장비가 없이 동작인식을 통해 인터페이스가 가능하게 했다. 주요기능은 평가와 트레이닝, 통계분석 세 가지로 이루어져 있다. 사용자는 6분 걷기와 폐안시 외발서기를 통해 개인별 심폐지구력과 평형감각 수준을 알 수 있으며 조깅과 인라인 스케이트를 통해 기능 향상을 위한 트레이닝을 할 수 있다. 통계분석은 별도의 용용프로그램을 통해 확인 할 수 있다. 성장하고 있는 기능성 게임 시장에 새로운 방향성 제시를 목표로 하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.476-476
• /
• 2010

유도 결합 플라즈마 (ICP)는 축전 결합 플라즈마 (CCP) 보다 상대적으로 높은 밀도의 플라즈마를 발생시킬 수 있다. 또한 구조가 간단하고 기존 스퍼터링 장치의 내부에 추가 설치가 용이하며, 스퍼터된 입자의 이온화, 반응성 가스의 활성화를 위한 2차 플라즈마원으로 적용이 가능하다. 그러나 대면적의 고밀도 플라즈마의 균일도 측정은 고가의 2D probe array등을 사용하여야 한다. 본 연구에서는 간단한 CCD camera를 챔버 내부에 삽입하여 가시광 영역의 적분 강도를 이용해서 플라즈마의 2차원적 균일도를 정성적으로 비교 판단하고 시간에 따른 국부적인 이상 방전을 감시할 수 있도록 내장형 무선 카메라를 사용하였다. 직경 380 mm의 챔버 내에 2 turn ICP antenna를 이용하여 유도 결합 플라즈마를 발생시켰다(Ar 30 sccm, 35 mTorr, 2 MHz, 400 W). 내장형 무선 카메라를 챔버 내부 중앙의 ICP antenna에서 8 cm 아래에 위치시켜 플라즈마를 진공 중에서 촬영하였다. 내장형 무선 카메라를 챔버 내부에 위치하여 촬영한 결과 외부에서 view port로 쉽게 확인할 수 없는 ICP antenna 내부의 고밀도 플라즈마의 불균일도를 평가할 수 있었고, ICP antenna 가장자리에서 중심으로 이동할수록 밝아지는 것을 토대로 중심 영역의 plasma 밀도가 가장 높다는 것을 알 수 있었고, 채도와 명도의 차이를 이용하여 시각적인 플라즈마 균일도를 분석하였으며 이를 플라즈마 모델링 기능이 있는 전산 유체 역학 프로그램인 CFD ACE+를 이용하여 플라즈마 분포를 모델링 및 비교하였다. 또한 인라인 타입의 마그네트론 스퍼터링 시스템에서 기판 캐리어에 무선 카메라를 장착하여 이동하면서 캐리어와 마그네트론 방전 공간의 상대적인 위치에 따른 마그네트론 방전링의 형상 변화도 관찰하였다.

• Journal of Korea Multimedia Society
• /
• v.14 no.5
• /
• pp.632-641
• /
• 2011

This paper presents a position error recognition system when the wafer is mounted in cleaning equipment among the wafer manufacturing processes. The proposed system is to enhance the performance in cost and reliability by preventing the wafer cleaning system from damaging by alerting it when it is put in correct position. The proposed algorithm is in obtaining a mapping function from camera and physical wafer by designing and manufacturing the radial shape calibrator to reduce the error by using the conventional chess board one. The system is to install in-line process using high reliable and high accurate position recognition. The experimental results show that the performance of the proposed system is better than that of the existing method for detecting errors within tolerance.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.22 no.6
• /
• pp.694-699
• /
• 2012

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.