• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.5
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• pp.467-471
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• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.528-534
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• 2021

To confirm effects of natural and artificial aging of precipitate on thermal diffusivity and hardness, the studied Al-Mg-Si alloy were manufactured by gravity casting method with 0.6 wt% and 1.0 wt% additional Cu element. The samples were used for measuring thermal diffusivity and hardness. The addition of Cu, promoted by intermediates such as Q'' and θ'' phases, contributing to the improvement of hardness and high-temperature thermal diffusivity. The natural aging decreased the hardness of the Al-Mg-Si-Cu alloys with increasing time, but did not affect the thermal diffusivity.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.3
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• pp.220-225
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• 2014

Generally, the nonlinearity of ultrasonic waves is measured using a nonlinear parameter ${\beta}$, which is defined as the ratio of the second harmonic's magnitude to the power of the fundamental frequency component after the ultrasonic wave propagates through a material. Nonlinear parameter ${\beta}$ is recognized as an effective parameter for evaluating material degradation. In this paper, we evaluated the nonlinear parameter of Al6061-T6 which had been subjected to an artificial aging heat treatment. The measurement was using the transmitted signal obtained from contact-type transducers. After the ultrasonic test, a micro Vickers hardness test was conducted. From the result of the ultrasonic nonlinear parameter, the microstructural changes resulting from the heat treatment were estimated and the hardness test proved that these estimates were reasonable. Experimental results showed a correlation between the ultrasonic nonlinear parameter and microstructural changes produced by precipitation behavior in the material. These results suggest that the evaluation of mechanical properties using ultrasonic nonlinear parameter ${\beta}$ can be used to monitor variations in the mechanical hardness of aluminum alloys in response to an artificial aging heat-treatment.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.717-722
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• 2011

The purpose of this study is to predict the residual stress in Al6061 during T6 heat treatment. In this study, the variable residual stress in case of the solid solution($530^{\circ}C$, 2h) and artificial ageing($175^{\circ}C$, 9h) of Al6061 subjected to T6 heat treatment is determined at different ageing times. A heat treatment experiment is conducted to determine the heat transfer coefficient, on the basis of which the residual stress during the T6 heat treatment is predicted. In order to take into account the relaxation of residual stress during artificial ageing, a Zener-Wert-Avrami function is used and elasto-plastic nonlinear analysis is conducted through FE-simulation. Further, the residual stress is measured by using the X-ray diffraction(XRD) method, and the result is compared with the result from the FE-simulation. It is found that the residual stress predicted form the FE-simulation is in good agreement with the residual stress measured by using the XRD method.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• Journal of Power System Engineering
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• v.16 no.4
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• pp.66-73
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• 2012

본 연구는 횡방향 TIG 용접된 Al6013-T4 알루미늄 합금 용접부의 피로균열전파거동에 미치는 용접후열처리(PWHT)의 영향을 조사하는 것이 주목적이다. 기초적으로 인장시험, 경도 및 미세조직이 조사되었으며, 피로균열전파거동을 고찰하기 위한 피로 시험은 모두 중앙균열인장(CCT) 시험편에 대하여 수행되었다. T82열처리에 있어서 시효시간은 피로균열전파율, 인장강도 및 경도에 대단히 민감함을 나타내었으며, 모재와 열영향부재의 경우가 용접재보다 기계적 성질이 우수하였다. 횡방향 TIG 용접한 Al6013-T4 시험재의 용접후열처리 조건에 따라서 피로균열전파 저항에는 차이가 나타났으며, 본 실험의 조건하에서 24시간 인공시효 PWHT-82 시험편이 피로균열전파 저항이 가장 우수한 결과를 나타내었다.

• Journal of Power System Engineering
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• v.15 no.6
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• pp.73-80
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• 2011

The experimental investigation focuses on an influence of artificial aging time in longitudinal butt welded Al 6013-T4 aluminum alloy on the fatigue crack growth resistance. The preferred welding processes for this alloy are frequently tungsten inert gas welding (TIG) process due to its comparatively easier applicability and better weldability than other gas metal arc welding. Fatigue crack growth tests were carried out on compact tension specimens (CT) in longitudinal butt TIG welded after T82 heat treatment was varied in three artificial aging times of 6 hours, 18 hours and 24 hours. Of the three artificial aging times, 24 hours of artificial aging time are offering better resistance against the growing fatigue cracks. The superior fatigue crack growth resistance preferred spatial variation of materials within each specimen in the Paris equation based on reliability theory and fatigue crack growth rate by crack length are found to be the reasons for superior fatigue resistance of 24 hours of artificial aging time was compared to other joints. The highest of crack propagation resistance occurs in artificial aging times of 24 hours due to the increase in grain size (fine grained microstructures).

• Journal of the korean academy of Pediatric Dentistry
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• v.40 no.4
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• pp.283-295
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• 2013

In this study, researchers tried to find the effect, if any, of aging treatment to the specimens with three different dentin bonding agents using MicroCT. One, 5th generation - [Adper$^{TM}$ Single bond Plus] and two 6th generation [AdheSE$^{(R)}$, Adper$^{TM}$ Prompt$^{TM}$ L-Pop$^{TM}$] dentin bonding agents were used in this study. Specimens were divided into 4 groups according to aging treatment method used. Group I : control group, Group II : thermocycled between $5^{\circ}C$ and $55^{\circ}C$ for 60 seconds dwell time 5,000 times, Group III : aged as Group II and artificially brushed 20,000 times, Group IV : aged as Group III and were stored in artificial saliva for 6 months. With Single bond Plus, Group II showed more microleakage than Group I (p < 0.05). Group II and Group III showed more microleakage than Group IV (p < 0.05). There were no statistically significant differences among the groups using AdheSE$^{(R)}$ and Prompt$^{TM}$ L-Pop$^{TM}$ (p > 0.05). Among Group I, AdheSE$^{(R)}$ showed more microleakage than Single bond Plus and Prompt$^{TM}$ L-Pop$^{TM}$ (p < 0.05). Among Group II, there were no statistically significant differences (p > 0.05). Among Group III, AdheSE$^{(R)}$ showed more microleakage than Single bond Plus and Prompt$^{TM}$ L-Pop$^{TM}$ (p < 0.05). Among Group IV, AdheSE$^{(R)}$ and Prompt$^{TM}$ L-Pop$^{TM}$ showed more microleakage than Single bond Plus (p < 0.05).