• Title/Summary/Keyword: 응력 특이

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Stress intensities at the interface corner of the co-cured lap joint with composite and steel adherends (복합재료와 강재료를 이용한 동시경화조인트의 계면 모서리에서의 응력집중계수)

  • 신금철;이정주
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2003.04a
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    • pp.83-86
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    • 2003
  • 동시경화조인트는 경화 시 복합재료로부터 흘러나오는 수지를 접착제로 사용하기 때문에 제조과정이 간편할 뿐 아니라 복합재료를 표면 처리할 필요가 없기 때문에 기존의 접착제에 의한 접합방법에 비해 장점을 지닌다. 최근 동시경화조인트에 관한 연구가 활발하게 진행되고 있으나 해석적인 방법을 통한 연구는 아직까지 미비하다. 실험적으로 연구된 결과를 보면 동시경화 조인트는 계면 모서리에서 파괴가 시작되어 계면을 따라 파괴가 진행된다. 그러므로 조인트의 계면 모서리에서의 응력집중계수에 관해 연구하는 것이 중요하다. 본 논문에서는 고유치 문제를 고려하여 복합재료와 강재료로 구성된 동시경화조인트의 계면 모서리에서 발생하는 응력 및 변위장을 결정하고, H-적분을 이용하여 응력집중계수를 구하는 방법을 제시하고자 한다.

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An Electrorheological (ER) Study on the Silica Suspensions (실리카 현탁액의 전기유변학적 연구)

  • 주상현
    • The Korean Journal of Rheology
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    • v.6 no.1
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    • pp.49-59
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    • 1994
  • 높은 전기장 하에서 다분산, 비구형 실리카/실리콘 오일 현탁액의 전기유변 (electrorheological, ER)현상을 살펴 보았다. 전기유변유체는 전기장 방향으로 사슬구조를 형 성하는 특성을 보이며 이것이 유변물성의 향상에 기여하는 것으로 알려졌다. 동적(dynamic) 상태 실험에서 전기장 하의 실리카 현탁액은 매우낮은 임계변형율(${\gamma}$c =0.1%)이상에서 비선 형 점탄성을 보였다. 저장탄성계수(G')는 변형율 변화에 손실탄성계수(G")는 매질의 점도 에 더 민감한 의존성을 보였다. 또한 겉보기 항복응력은 입자의 부피분율과 전기장에$\Phi$1.9E1.4 의 의존성을 보였는데 부피분율에 대한 의존성이 큰 이유는 0.1 이상의 부피분율에서 복합 사슬 구조 내의 입자들 간의 상호 정전효과가 지배적으로 나타나기 때문이라고 생각된다. 정상상태 실험에서는 부피분율이 크거나 높은 전기장 하에서 전단속도가 0.1sec-1 정도 이하 로 감소함에 따라 전단응력이 급겨히 증가하는 현상을 보였다. 그러므로 본질적인 동적 항 복응력을 얻기 위해서는 매우 낮은 전단속도 영역의 특이한 응력거동을 고려해야한다. 큰 전단속도 하에서는 hydrodynamic interaction의 영향으로 전단속도의 증가에 따라 전단응력 이 증가하였다. 이같은 전단응력의 거동을 계단전단실험으로 확인하였다.

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Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe (칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.13 no.1
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    • pp.97-103
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    • 2000
  • This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

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A Study on Stress Singularities for V-notched Cracks in Pseudo-isotropic and Anisotropic Dissimilar Materials (유사등방성과 이방성 이종재료 내의 V-노치 균열에 대한 응력특이성에 관한 연구)

  • Cho, Sang-Bong;Kim, Jin-Kwang
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.10
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    • pp.152-163
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    • 1999
  • The problem of eigenvalue and eigenvector for v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was obtained to discuss stress singularities from traction free boundary and perfect bonded interface conditions assuming like the form of complex stress function for v-notched cracks in an isotropic material. Eigenvalues were solved by a commercial numerical program, MATHEMATICA. The relation between wedged angle and material property for eigenvalue, ${\lambda}$ indicating stress singularities of v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was examined.

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Boundary element analysis of singular stresses at interface edge of infinitely layered structure (무한 적층 구조체의 자유경계면에 나타나는 특이응력의 경계요소해석)

  • 이상순
    • Computational Structural Engineering
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    • v.8 no.3
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    • pp.75-78
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    • 1995
  • The boundary element analysis has been attempted for investigating the singular stress at the interface edge of infinitely layered structure. The subdomain technique has been employed and the analysis model has been divided into two subdomains, which are respectively homogeneous elastic zones. The boundary element equation has been formulated using the equilibrium and continuity conditions at the common interface. The numerical results of example problem has been presented.

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Evaluation of stress intensity factor for a crack normal to bimaterial interface using cubic isoparametric finite elements (3차 등매개 유한요소를 이용한 이종재료 접합면에 수직인 균열의 응력확대계수 평가)

  • Lim, Won-Gyun;Jeong, Gyu-Cheol;Song, Chi-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.22 no.1
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    • pp.206-214
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    • 1998
  • When a crack meets bimaterial interface stress singularity depends on the elastic constants of the adjacent materials. In the present study we are going to describe the finite element formulation for problems with a crack to be embedded in the stiffer material$({\mu}_2/{\mu}_1)$. The cubic isoparametric singular element, represented by adequately shifting the mid-side nodes adjacent to the crack tip is constructed to enclose the crack tip. An alternative method to obtain the optimal position of the mid-side nodes of cubic isoparametric elements is presented. In addition, a proper definition for the stress intensity factors of a crack normal to bimaterial interface is provided. It is based upon near a tip displacement solutions. Models for numerical analysis are two dimensional elastic bodies with a through crack under plain strain. The results obtained are compared with the previous solutions.

Numerical Analysis of Viscoelastic Cylinders with Mode I Cracks (점탄성 원통의 모드 I 균열 해석)

  • Sim Woo-Jin;Oh Guen
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.19 no.3 s.73
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    • pp.259-269
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    • 2006
  • In this paper, the stress intensity factor, energy release rate and crack opening displacement are computed using the finite element method for axisymmetric viscoelastic cylinders with the penny-shaped and circumferential cracks. The triangular elements with quarter point nodes are used to describe the stress singularity around the crack edge. The analytical solutions are also derived by using the elastic-viscoelastic correspondence principle and compared with the numerical results to show the validity and accuracy of the presented method. Viscoelastic materials are assumed to behave elastically in dilatation and like a three-parameter standard linear solid.

Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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A Study on the Analysis Parameter Used in Improved EFG Crack Analysis Technique Based on Error Estimate (오차분석을 통한 개선된 EFG 균열해석기법의 해석계수 영향평가)

  • 이상호;윤영철
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.15 no.4
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    • pp.703-713
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    • 2002
  • Recently, an improved EFG(Element-Free Galerkin) crack analysis technique, which includes a discontinuous approximation and a singular basis function on the auxiliary supports, was developed. The technique is able to accurately analyze the crack propagation problem without any modification of the analysis model; however, it shows some dependency on the analysis parameters used. In this study, the effect of analysis parameters such as the size of compact support, dilation parameter, the smoothness of shape function around the crack tip, and the number of node using auxiliary supports on the accuracy of solution has been investigated. Through a patch test with a crack, relative L₂ error norm of stresses and the stress intensity factor were computed and compared for various analysis parameters and the results were presented as guidelines for adequate choice of analysis parameters.

A Study on the Calculation of Stress Intensity Fantors considering Pressure of Crack-Face (균열면의 압력을 고려한 응력확대계수의 결정에 관한 연구)

  • 진치섭;최현태;이홍주
    • Magazine of the Korea Concrete Institute
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    • v.7 no.3
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    • pp.175-186
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    • 1995
  • The determination of the stress intensity factors is investigated by sur-face integral method around the crack tip of the nlass~vc: concrete structure. The surface integral met hod is naturally derived from the standal-ci path integral J. Howevcr. In the J integral method, pressure in the crack-face and body forces can not be considered, while this theory has advantage of ccmsidering many kind of forces, so t.his theory will be useful in investigating more accurate strt:ss states around crack tip. Furthermore. t h~s rrlethod can elerninate unntussary process of using singular elements and fine mesh around crack tip which is used 11; modelling the singularity around crack tip. A computer program for determming $K_I$, $K_{II}$ is tfcvulopcd by applying this theory. $K_I$, $K_{II}$ values usmg X noded isoparametric elements which was proved and variation of the stress intensity factor was investigated by application of darn structures.