• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.25-29
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• 2003

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Computational Structural Engineering
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• v.10 no.2
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• pp.131-138
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• 1997

This paper concerns the stress singularity at the interface corner of the viscoelastic adhesive layer bonded between rigid adherends, subjected to a uniform transverse tensile strain. The characteristic equation is derived in the Laplace transformed space, following Williams, and the transformed characteristic equation is inverted analytically into real time space for the viscoelastic model considered here. The order of the singularity is obtained numerically. The time-domain boundary element method is employed to investigate the nature of stresses along the interface. Numerical results show that the order of the singularity increases with time while the free-edge stress intensity factors are relaxed with time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.1
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• pp.135-145
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• 1996

Order of stress singularities at bonded Edge Corners with two or three dissimilar isotropic Materials is analyzed. The problem is formulated by Mellin transform and characteristic equation is obtained as a determinant of matrix considering boundary conditions. Roots of characterictic equation are determinde by numerical calculations with ward method, from which the order of stress sigularities is obtained. Applying the results to the electronic packaging, the order of stress singularities is obtained. Applying the results to the electronic packaging, the order of stress singularities at bounded edge corners is calculated as a various bouned edge angle with given material combinations. Comparing the results, the optimal material combinaitons of bounded edge corners and bouned edge angle to reduce stress singularity could be determined. It suggests that the results are used to the basic design of electronic packaging reducing the stress singularity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.3 s.174
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• pp.685-690
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• 2000

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. Th e time domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.206-214
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• 1998

When a crack meets bimaterial interface stress singularity depends on the elastic constants of the adjacent materials. In the present study we are going to describe the finite element formulation for problems with a crack to be embedded in the stiffer material$({\mu}_2/{\mu}_1)$. The cubic isoparametric singular element, represented by adequately shifting the mid-side nodes adjacent to the crack tip is constructed to enclose the crack tip. An alternative method to obtain the optimal position of the mid-side nodes of cubic isoparametric elements is presented. In addition, a proper definition for the stress intensity factors of a crack normal to bimaterial interface is provided. It is based upon near a tip displacement solutions. Models for numerical analysis are two dimensional elastic bodies with a through crack under plain strain. The results obtained are compared with the previous solutions.

• Computational Structural Engineering
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• v.2 no.4
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• pp.15-20
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• 1989

이글에서는 2가지 예제를 통해 h-version과 p-version의 비교를 살펴보면서 p-version 해석이 h-version에 비해 상대적으로 많은 장점들을 가지고 있으며, 신뢰도, 정확도, 효율성, 경제성, 용장성 등 측면에서 우월함을 증명해 보였다. 특히 응력집중(stress concentration)이 일어나는 crack-tips, cut-outs, reentrant corners, presence of stiffners, mixed boundary conditions 등 많은 특이성(singularity) 문제에 더욱 적합함을 본 예제 외의 발표된 많은 논문들을 통해 알 수 있으며, 모델링의 단순성에 기인하여 사용이 매우 쉽다는 것도 무엇보다 큰 이점이라 하겠다. p-version은 h-version의 비효율성을 차수 p를 1, 2 또는 3으로 줄인 후 이 값을 고정시키고 다시 요소분할을 통해 진해(true solution)에 접근시키는 방식을 위하면 다시 종래의 h-version으로 환원되는 호환성을 갖고 있다는 것이다. 고로 구조해석에서 h-p version이 가장 이상적인 유한요소해석 방법이라 할 수 있겠는데, 다시 말하면 균열문제의 경우 균열선단(crack-tip)에서는 p-level을 높이고 (p=8, 9 or 10) 비교적 응력집중이 낮은 영역에서는 p-level을 낮춤으로써 (p=3, 4 or 5) 그 효율성을 극대화할 수 있겠다.

• Computational Structural Engineering
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• v.9 no.1
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• pp.93-99
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• 1996

In the particular situations where the crack is terminated at an interface of two materials, the order of stress singularity depends on the elastic constants which specify the properties of two materials. A multidomain boundary element technique is used to solve a crack normal to bimaterial interface. A correct order of shape function is used for displacement by using the isoparametric elements by shifting adequately the side nodes adjacent to this crack tip. A shape function containing the same order of singularity as that in the interface crack is also used for the interpolation of traction. Numerical testing of a binaterial with a crack normal to the interface is carried out with three-node elements. The results obtained are compared with the previous solutions.