• Title/Summary/Keyword: 유한피로수명

Search Result 205, Processing Time 0.022 seconds

Structural Design and Analysis for Carbon/Epoxy Composite Wing of A Small Scale WIG Vehicle (소형 위그선의 탄소/에폭시 복합재 주익의 구조 설계 및 해석에 관한 연구)

  • Park, Hyun-Bum;Kang, Kuk-Jin;Kong, Chang-Duk
    • Composites Research
    • /
    • v.19 no.5
    • /
    • pp.12-19
    • /
    • 2006
  • In this paper, conceptual structural design of the main wing for a small scale WIG(Wing in Ground Effect) among high speed ship projects, which will be a high speed maritime transportation system for the next generation in Rep. of Korea, was performed. The Carbon/Epoxy material was selected for the major structure, and the skin-spar with a foam sandwich structural type was adopted for improvement of lightness and structural stability. As a design procedure for the present study, firstly the design load was estimated through the critical flight load case study, and then flanges of the front and rear spars from major bending loads and the skin and the spar webs from shear loads were preliminarily sized using the netting rule and the rule of mixture. Stress analysis was performed by a commercial FEA code, NASTRAN. From the stress analysis results for the first designed wing structure, it was confirmed that the upper skin between the front spar and the rear spar was unstable fer the buckling. Therefore in order to solve this problem, a middle spar and the foam sandwich type structure at the skin and the web were added. After design modification, the structural safety and stability for the final design feature was confirmed. In addition to this, the insert bolt type structure with eight high strength bolts to fix the wing structure to the fuselage was adopted for easy assembly and removal as well as in consideration of more than 20 years fatigue life.

Thickness Design of Composite Pavement for Heavy-Duty Roads Considering Cumulative Fatigue Damage in Roller-Compacted Concrete Base (롤러전압콘크리트 기층의 누적피로손상을 고려한 중하중 도로의 복합포장 두께 설계)

  • Kim, Kyoung Su;Kim, Young Kyu;Chhay, Lyhour;Lee, Seung Woo
    • KSCE Journal of Civil and Environmental Engineering Research
    • /
    • v.42 no.4
    • /
    • pp.537-548
    • /
    • 2022
  • It is important to design the pavement thickness considering heavy-duty traffic loads, which can cause excessive stress and strain in the pavement. Port-rear roads and industrial roads have many problems due to early stress in pavement because these have a higher ratio of heavy loads than general roads such as national roads and expressways. Internationally, composite pavement has been widely applied in pavement designs in heavy-duty areas. Composite pavement is established as an economic pavement type that can increase the design life by nearly double compared to that of existing pavement while also decreasing maintenance and user costs. This study suggests a thickness design method for composite pavement using roller-compacted concrete as a base material to ensure long-term serviceability in heavy-duty areas such as port-rear roads and industrial roads. A three-dimensional finite element analysis was conducted to investigate the mechanical behavior and the long-term pavement performance ultimately to suggest a thickness design method that considers changes in the material properties of the roller-compacted concrete (RCC) base layer. In addition, this study presents a user-friendly catalog design method for RCC-base composite pavement considering the concept of linear damage accumulation for each container trailer depending on the season.

Estimation Method of Resilience Pads Spring Stiffness for Sleeper Floating Tracks based on Track Vibration (궤도 진동기반의 침목플로팅궤도 침목방진패드 스프링강성 추정 기법 연구)

  • Jung-Youl Choi;Sang-Wook Park;Jee-Seung Chung
    • The Journal of the Convergence on Culture Technology
    • /
    • v.9 no.6
    • /
    • pp.1057-1063
    • /
    • 2023
  • The urban railway sleeper floating track, the subject of this study, is an anti-vibration track to reduce vibration transmitted to the structure. currently, the replacement cycle of resilience pad for sleeper floating tracks is set and operated based on load. however, most previous studies were conducted on load-based structural safety aspects, such as fatigue life evaluation of sleeper anti-vibration pads and increase in track impact coefficient and track support stiffness due to increase in spring stiffness. therefore, in this study, we measure the vibration acceleration of the ballast for each analysis section and use the results of 7 million fatigue tests to calculate the spring stiffness of the resilience pad for each section. the spring stiffness of the resilience pad calculated for each section was set as the analysis data and the concrete vibration acceleration was derived analytically. the adequacy of analysis modeling was verified as the analyzed concrete bed vibration acceleration for each section was within the field-measured concrete bed vibration acceleration range. using the vibration acceleration curve according to the derived spring stiffness change, the spring stiffness of the resilience pad is estimated from the measured vibration acceleration. therefore, we would like to present a technique that can estimate the spring stiffness of resilience pad of a running track using the vibration acceleration of the measured concrete bed.

Mechanical Reliability Evaluation on Solder Joint of CCB for Compact Advanced Satellite (Sherlock을 활용한 차세대 중형위성용 CCB 솔더 접합부의 기계적 신뢰성 평가)

  • Jeon, Young-Hyeon;Kim, Hyun-Soo;Lim, In-Ok;Kim, Youngsun;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.45 no.6
    • /
    • pp.498-507
    • /
    • 2017
  • Electronic equipments comprised of high density components with various packaging types have been recently applied to a satellite. Therefore, to guarantee high reliability of electrical equipment, a design approach, which can reduce the development period and cost through an early diagnosis in potential risks of failure, should be established. In the previous research, the reliability assesment of the electronic equipments have based on Steinberg's fatigue failure theory. However, this theory was not enough for further investigation of life prediction and reliability of the electronic equipments comprised of various sizes and packaging types due to its theoretical limitations and analysis results sensitivity with regard to different modeling technic. In that case, if detailed finite element model is established, aforementioned problems can be readily solved. However, this approach might arise disadvantage of spending much time. In this paper, to establish strategy for high reliability design of electronic equipment, we performed mechanical reliability evaluation of CCB (Camera Controller Box) at qualification level based on the approach using Sherlock unlike design techniques applied to existing business.

Pin Pull Characteristics of Pin Lead with Variation of Mechanical Properties of Pin Lead in PGA (Pin Grid Array) Package (PGA (Pin Grid Array) 패키지의 Lead Pin의 기계적 특성에 따른 Pin Pull 거동 특성 해석)

  • Cho, Seung-Hyun;Choi, Jin-Won;Park, Gyun-Myoung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.17 no.1
    • /
    • pp.9-17
    • /
    • 2010
  • In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.