• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.29-36
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• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.1
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• pp.87-96
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• 2019

Flexible organic light-emitting diode (OLED) displays with organic thin-film transistors (OTFTs) backplanes have been studied. A gate driver is required to drive the OLED display. The gate driver is integrated into the panel to reduce the manufacturing cost of the display panel and to simplify the module structure using fabrication methods based on low-temperature, low-cost, and large-area printing processes. In this paper, pseudo complementary metal oxide semiconductor (CMOS) logic gates are implemented using OTFTs for the gate driver integrated in the flexible OLED display. The pseudo CMOS inverter and NAND gates are designed and fabricated on a flexible plastic substrate using inkjet-printed OTFTs and the same process as the display. Moreover, the operation of the logic gates is confirmed by measurement. The measurement results show that the pseudo CMOS inverter can operate at input signal frequencies up to 1 kHz, indicating the possibility of the gate driver being integrated in the flexible OLED display.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.291-292
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• 2012

플렉시블 (F-PCB, Flexible Printed Circuit Board)은 얇고 유연하며 모바일, 광학, 노트북, 프린터, LCD 등 IT산업전반에 걸쳐 사용되고 있다. 통신기기가 이동용으로 전환되면서 대용량, 고속의 정보 전달이 필요하다. 인접 회로간의 전자파 차폐, 구리성분의 편석방지와 고성능의 회로소재 확보가 요구된다. 본고에서는 최근의 플렉시블 인쇄회로기판의 주석도금의 위스커방지 품질향상을 중심으로 기술하였다.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.94-101
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• 2004

This paper presents the development of a keypad test system for the improvement of working environment and productivity using PTC 16F877 microprocessor. In order to detect the fault of keypad products, hardware and software design is performed in this system. Keypad fault detection system is controlled by the 8 bit one chip PIC microcontroller for the exactness and speed. Developed panel of the keypad test system is comprised of the sub-panel for selecting in the inspected keypad types and the main panel f3r displaying the working order and fault position. Furthermore, all data from keypad inspection are stored in main memory of personal computer for the database. All these functions lead to the improvement of working speed and environment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.459-462
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• 2002

This paper presents the development or a keypad test system for the improvement or the working environment and productivity improvement using the microprocessor PIC16F877 Chip. In order to detect the fault of keypad products, the design of hardware and software is performed in this system. All controls of the system is implemented by the 8 bit one chip micro-controller PIC. This keypad test system can also recognizes the work process, the work result and the fault position of the keypad which is made by the method of a flexible printed circuit (FPC) and construct the database about test results using personal computer. The experimental results show the effective performance of the keypad test system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.9-15
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• 2013

Roll-to-roll printing technology has lately become a subject of special interests in the field of printed electronics. Since this technology has the advantage that continuous and mass production is possible. And for high precision register control is required in multi-layer printing to produce the electronic devices, this is one of the most important technologies in roll-to-roll printing technology. Register error could be generated by various reasons like eccentricity of roll and thermal deformation due to temperature variation in drying section. In this study, the effect of tension variation on the register was analyzed. The results of these analyses show that it is essential to consider the tension disturbance which is generated by the change of temperature in drying section, and conventional register model has limitation to estimate the register error. In order to overcome the limitation of the register model, advanced register model based on the SI process was developed. Also, the performance of the developed model was verified experimentally.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.8
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• pp.653-658
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• 2014

Roll-to-Roll printing process has become a great issue as a breakthrough for low cost and mass production of electronic devices such as organic thin film transistor, and etc. To print the electronic devices, multi-layer printing is essential, and high precision register control is required for this process. Unlike stop-and-repeat printing process, it is impossible to control the register in a static state since the roll-to-roll process is a continuous system. Therefore, the behavior of web such as polyethylene terephthalate (PET) and polyimide (PI) by the tensile and thermal stress generated in the roll-to-roll process as well as motor control of driven rolls has to be considered for a high precision register control. In this study, the correlation between curing temperature and thermal deformation of PET web is analyzed. Finally, it is verified experimentally that the temperature disturbance generates the more serious register error under the higher curing temperature.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.340-340
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• 2015

상지 절단 장애인들을 위한 미관형 의수는 95% 이상의 시장 보급률을 보인다. 하지만 외부 형상 향상에만 연구 초점이 맞추어져 있어 많은 장애인들이 의수를 착용할 때 차가운 표면으로 인해 이질감을 느낀다. 이로 인해 의수 제작 업체 및 절단 장애인들은 착용 시 이질감이 적은 의수의 보급을 희망하고 있다. 그러므로 본 연구에서는 인체와 유사한 온도를 발생시켜 이질감을 감소시키는 의수를 개발하기 위해 유연 기판인 TPU (Temperature Polyurethane)와 PET (Polyethylene terephthalate) 위에 상용 silver nano paste를 3D 프린터로 인쇄하였으며, UV 표면처리를 사용하여 단시간 내에 낮은 저항과, 높은 회로 접착강도를 갖는 회로를 개발 하였다.

• Journal of Ocean Engineering and Technology
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• v.14 no.4
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• pp.79-85
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• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.