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http://dx.doi.org/10.7736/KSPE.2014.31.8.653

A Study on the Correlation between Curing Temperature and Thermal Deformation of a Moving Web in Roll-to-Roll Printed Electronics  

Lee, Jongsu (Department of Mechanical design and production Engineering, Konkuk Univ.)
Lee, Changwoo (Department of Mechanical Engineering, Changwon Nat'l Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.31, no.8, 2014 , pp. 653-658 More about this Journal
Abstract
Roll-to-Roll printing process has become a great issue as a breakthrough for low cost and mass production of electronic devices such as organic thin film transistor, and etc. To print the electronic devices, multi-layer printing is essential, and high precision register control is required for this process. Unlike stop-and-repeat printing process, it is impossible to control the register in a static state since the roll-to-roll process is a continuous system. Therefore, the behavior of web such as polyethylene terephthalate (PET) and polyimide (PI) by the tensile and thermal stress generated in the roll-to-roll process as well as motor control of driven rolls has to be considered for a high precision register control. In this study, the correlation between curing temperature and thermal deformation of PET web is analyzed. Finally, it is verified experimentally that the temperature disturbance generates the more serious register error under the higher curing temperature.
Keywords
Roll-to-Roll Printing Process; Curing Temperature; Thermal Strain;
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