• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
• /
• v.13 no.3
• /
• pp.235-242
• /
• 2015

A commercially available copper mesh was investigated as an iodine off-gas capturing medium for pyroprocessing, with an aim to replace costly silver based adsorbents. Theoretical calculation results suggested that the reaction between metallic copper and gaseous iodine will occur spontaneously to produce copper iodide in the temperature range of 100 ~ 500℃. The effect of the reaction temperature on iodine capturing efficiency was investigated by experimentation, and it was found that 5 and 6 wt% of iodine (initial mass 2.0 g) was captured by a single copper mesh (0.26 g) at 300 and 400℃, respectively. The repeated experimental results also suggested that copper utilization can be increased with the help of the spontaneous detachment of the reaction product (CuI) from a copper mesh. The formation of the CuI phase was confirmed using the X-ray diffraction technique, and the surface morphology of the reaction product was observed using scanning electron microscopy.

• Korean Chemical Engineering Research
• /
• v.43 no.1
• /
• pp.98-102
• /
• 2005

This article describes a study of chemical vapor deposition (CVD) of copper thin films on TiN substrates using (HFAC)Cu(DMB) as a precursor. The surface morphology and conformality of the Cu films as functions of substrate temperature and the presence or absence of iodine have been investigated. The surface roughness was increased significantly along with decrement of the step coverage by increasing the deposition temperature. The highest conformal films with the lowest surface roughness were obtained using the process of copper CVD, where iodine vapor were discretely introduced into the reactor during the growth of copper.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.30-30
• /
• 1999

알루미늄에 비해 전기저항이 낮고 electromigration 및 stress-migration에 대한 저항서이 높은 구리는 차세대 반도체 소자의 배선금속 재료로 여겨지고 있다. 최근 Chemical Mechanical Polishing (CMP) 기술의 도래로 구리배선 공정의 채택이 더욱 앞당겨질 전망이다. 한편, 구리 MOCVD를 위해 다양한 전구체화합물이 합성되었고, 근래에는 Cu(I)(hfc)L (L은 Lewis base 형태의 ligand) 형태의 전구체를 이용한 많은 증착 연구를 통하여 순수하고 전기저항이 낮은 구리 박막의 증착이 보고되었다. 구리 MOCVD의 가장 큰 문제점은 증착속도가 150-$^{\circ}C$20$0^{\circ}C$에서 500$\AA$/min 이하로 낮고 또한 증착된 필름 표면이 매우 거칠다는 데 있다. 이러한 단점으로 인해 전기화학적 증착후 CMP를 적용하는 것이 더욱 경제적이라는 견해가 우세해 지고 있다. 본 강연에서는 박막의 증착 속도와 표면 거칠기를 동시에 향사시키기 위해 catalytic surfactant를 이용한 새로운 MOCVD 개념을 도입하고, 구리 MOCVD에서 단원자층으로 흡착된 요오드 원자가 그 역할을 수행할 수 있음을 보이겠다. 또 요오드원자가 표면반응을 어떻게 수정하여 활성화에너지를 낮추는가를 반응메카니즘으로 밝히고 표면 평탄화의 미시적 해석을 제공하고자 한다. Catalytic Surfactant의 개념은 다른 박막 재료의 MOCVD에도 적용될 수 있으며, 나아가 적절한 기판 표면처리를 통하여 epitaxy도 가능할 것으로 본다.

• Journal of the Korean Institute of Gas
• /
• v.7 no.1 s.18
• /
• pp.47-52
• /
• 2003

The adsorption characteristics of rert-butyl mercaptan(TBM) on base activated carbon and activated carbon impregnated with $CuCl_2$ or KI were studied. Adsorption of TBM on the surface of the KI or $CuCl_2$ impregnated activated carbon was detected by gas chromatograph equipped with a flame photometric detector. The amount of adsorption on those impregnated carbon found to be 7 or 8 times greater than on the non-impregnated activated carbon and varied according to the concentration of impregnated metal. FT-IR measurement showed that major reaction occuring on the surface of the catalytic adsorbent was dimerization of TBM into di-tert-butyl disulfide which had no stench.

• Electrical & Electronic Materials
• /
• v.1 no.2
• /
• pp.126-135
• /
• 1988

Acrylonitrile-Acrylic acid 공중합체와 이를 amidation시킬 공중합체에 구리착물을 형성시켜 IR spectrum분석, 점도측정, 전자현미경관찰, 열분석, 전기전도성등을 검토하였다. AN-AA 공중합체-Cu(II)와 아미드화 AN-AA 공중합체-Cu(II)착물은 pH9의 범위에서 가장 안정한 값을 가지며 착물이 형성되거나 Cu$_{x}$S가 도입된 공중합체는 그 구조가 ompact해짐을 알 수 있었다. 공중합체에 Cu(II)착물이 형성되면 열안정성이 감소되며 Cu(II)착물은 아세톤 용액에서 요오드로 dope 될 때 저항값이 $10^{5}$-$10^{6}$.OMEGA..cm를 나타냈다. 저항값은 CuCl$_{2}$와 I$_{2}$의 양에 영향을 받으며 20wt% 이상의 CuCl$_{2}$와 1.0wt% I$_{2}$로 처리하였을 때 반도체영역의 저항값을 보였다. 또 Cu$_{x}$S를 도입할 경우 CuSO$_{4}$의 농도가 30g/l로, 3시간 반응시켰을 때 가장 만족스러운 전도도값을 나타냈다. 공중합체-Cu(II)보다 구리이온을 도입한 Cu$_{x}$S공중합체의 전도도값이 $10^{4}$정도로서 공중합체-Cu(II)보다 높은 전도성을 나타냈다.다.

• Journal of Conservation Science
• /
• v.25 no.3
• /
• pp.283-291
• /
• 2009

Methyl Bromide that was used as fumigation gas turned out to be the substance of destroying the ozone layer. For that reason, at the Montreal Protocol in 1987 the use of methyl bromide was forbidden starting 2005 in the advanced country. Also according to the 2007 Bali Protocolly methyl bromide is expected to be forbidden and therefore the purpose of this study is to find out the effects of substitution fumigation gas (Ethylene Oxide+HFC 134a, Methyl Iodide, Cyanogen and Argon) on the metal(silver, copper and iron), wood(oregon pine), pigment(yellow, red, blue, white and black), textile(hemp, ramie, jute, silk1 and silk2 / indigo, safflower and cork) and paper. After the fumigation test, ethylene oxide+HFC 134a did not have changes in the weight and color of the material itself before and after the experiment. On exterior alteration, color change occurred partly on paper and metal. Also, in most materials color change extent was 0.5 to 1.5 on the average and showed scanty difference. The materials after the fumigation test with methyl iodide did not show weight changes after the test. However, color changes more than 1.0 was shown in most of the materials especially in dyed textile material. In blue pigment, the discoloration on the surface could be seen by naked eyes. Fumigation test with cyanogen gas did not show weight changes and discoloration is more than 1.5 before and after the test. The weight changes of test materials with the argon gas was decreased about 3 to 6%. It can be observed that discoloration on paper was generated. Color changes can be seen on jute dyed with safflower and cork for two weeks with argon gas and the extent was 6.3 and 6.0.