• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.12
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• pp.559-565
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• 2002

Today, because a quality factor of the inductor fabricated on silicon substrate for RFIC is under 12, the realization of inductor haying high-Q is essential. In this paper, two inductors having improved Q-factor are proposed and fabricated using a bondwire on silicon substrate. Also for the PGS is applied to the same inductors, four inductors are fabricated finally The bondwire Inductors have the relatively low conductor loss due to wide cross-section area and they can reduce the parastic capacitance very much because they are located in the air. Simulation and measurement results show that the proposed inductors have much more improved Q-factor, 15, than a conventional spiral inductor at 1.5 GHz. Because of the use of an automatic bonding machine, we can fabricate the high - Q inductors very easily, repeatedly.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.129-129
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• 2017

열전재료는 열에너지를 전기에너지로 또는 전기에너지를 열에너지로 직접 변환하는데 가장 널리 사용되는 재료이다. $Bi_2Te_3$계 열전 재료는 400K 이하의 비교적 저온 영역에서 높은 성능지수(Dimensionless Figure of merit, ZT($={\alpha}2{\sigma}T/{\kappa}$, ${\alpha}$: 제백계수, ${\sigma}$: 전기전도도, T: 절대온도, ${\kappa}$: 열전도도))를 나타내는 열전재료이며 자동차 시트나 정수기 등에 응용되고 있다. 열전모듈은 제조시 수십 개에서 수백 개 이상의 n형 및 p형 열전소자를 알루미나($Al_2O_3$)와 같은 세라믹 기판(substrate) 상에 접합된 동 전극 위에 전기적으로 서로 직렬로 접합시켜 제조한다. 기존의 열전모듈의 제조방법에는 동 전극 위에 위에 Sn합금 분말과 플럭스(flux)의 혼합물인 솔더페이스트를 스크린 인쇄법을 사용하여 동 전극에 도포한 다음, 그 위에 열전소자를 얹고 약 520K의 열풍을 가하여 솔더를 용융시켜 열전소자와 동 전극을 접합시킨다. 스크린 인쇄법에서는 인쇄 압력이 일정하지 않으면, 솔더페이스트 층의 두께가 균일하지 않게 되어 열전소자 접합부의 불량을 유발시킨다. 그러나 열모듈은 단 하나의 접합 불량이 모듈 전체의 열전변환성능에 심각한 영향을 줄 수 있기 때문에 본 연구에서는 이러한 문제점을 해결하기 위해, 솔더페이스트를 도포하지 않고 열전소자를 직접 동 전극과 접합할 수 있는 방법을 고안하였다. 무전해도금을 이용한 니켈층을 형성시킨 $Bi_2Te_3$계 열전소자 표면에 약 $50{\mu}m$의 주석도금층을 전기도금법을 구사하여 형성시켰다. 그 후, wire cutting을 통하여 $3mm{\times}3mm{\times}3mm$의 크기로 절단한 주석도금된 열전소자를 동 전극에 얹고 1.1KPa의 압력을 가하면서 523K의 핫플레이트 위에서 3분간 방치하여 직접(direct) 열압착 접합을 실시하였다. 접합부의 단면을 SEM을 이용하여 관찰한 결과, 동 전극과 열전소자 사이의 계면에 용융 후 응고된 주석층이 결함없이 균일하게 형성된 양호한 접합부를 관찰할 수 있었다. 따라서, 솔더페이스트를 이용하지 않고, 열전소자 표면에 주석도금을 실시한 후, 동 전극과 직접 열압착 본딩을 실시하는 방법은 균일한 접합계면을 얻을 수 있는 새로운 공정으로 기대된다.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.63-69
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• 2013

The warpage of a bottom package of Package on Package(PoP) where a chip was mounted to a substrate by flip chip process was compared to that of a bottom package for which a chip was bonded to a substrate using die attach film(DAF). At the solder reflow temperature of $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpages of $57{\mu}m$ and $-102{\mu}m$, respectively. At the temperature range between room temperature and $260^{\circ}C$, the packages processed with flip chip bonding and DAF bonding exhibited warpage values ranging from $-27{\mu}m$ to $60{\mu}m$ and from $-50{\mu}m$ to $-15{\mu}m$, respectively.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.2
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• pp.148-162
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• 1996

Bonding wires for high frequency device packaging have dominant parasitic inductances which limit the performance of semiconductor lasers. In this paper, the inductance sof bonding wires are claculated by the method of moments with incorporation of ohmic loss, and the wideband modulation characteristics are analyzed for ddifferent wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire is 7 GHz wider than that for 2mm-length bonding wire. We also observed th estatic inductance calculation results in dispersive deviation of the parasitic inductance and the modulation characteristics from the wideband moment methods calculations. The angled bonding wire has much less parasitic inductance and improves the modulation bandwidth more than 6 GHz. This calculation resutls an be widely used for designing and packaging of high-speed semiconductor device.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.7
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• pp.17-24
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• 1998

We proposed a novel bondwire inductor buried in plastic package for low cost MMIC and characaterized the electrical perofmrance in a wide frequency range using the full-wave analysis of finite element method(FEM), and then we fabricated and measured the scale-up model in order to prove the characteristics. Th ebondwire inductor has higher quality factor and higher cutoff frequency than the conventional spiral inductor designed n the same area as the bondwire inductor. Since the air-bridge process is not requried for the bondwire inductor, it is very suitable for low cost plastic-packaged MMIC production. The bondwire inductor has the field distribution localized around the bondwire inductor and hence is more compatible to the crosstalk problems.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.9
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• pp.98-105
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• 1995

Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30$^{\circ}$ internal angle, the calculated total reactance is 45% less than that of a single bonding wire due to the negative mutual coupling effect. The radiation effect has been observed decreasing the mutual inductance, whereas for parallel bonding wires it greatly increases the mutual inductance. This calculation results can be widely used for designing and packaging of high frequency and high density MMIC's and OEIC's.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.21-26
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• 1997

The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.9
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• pp.28-35
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• 1997

A novel high-Q vertical jinductor for MMICs is proposed and characterized in a wide range of frequencies (DC~10 GHz) using the numerical methods such as the PeEC(partial equivalent element circuit), the FDM (finite difference method) and the MoM (method of moments). Electrical superiority of the vertical inductor to the horizontal is observed in terms of the magnetic flux linkage and the ground screening effect. The veritcal bondwire inductor is designed in consideration of the wire bonding feasibility and the optimum electrical peformance. This structure is also analyzed using the equivalent circuit and compared with the conventional spiral inductors From the calculated results, high Q-factor, inductance, and cut-off frequency are observed to be inherent characteristics of the veritcal bondwire inductor.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.367-368
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• 2008

한의학의 주요 방법 중 하나인 맥진은 한의사가 환자의 손목 부위를 손가락으로 진맥하여 환자의 맥동을 감지하는 행위이다. 하지만 이러한 맥진은 주관적이고 형이학적 이어서 맥진의 발전을 위해서는 맥진의 객관화와 정량화가 요구된다. 본 연구는 기존의 와이어 본딩(wire bonding)을 이용한 맥진 센서의 단점인 내성을 극복하기 위하여 FDB(Face Down Bonding) 방식을 이용하였으며, $3{\times}3$ 멀티 어레이 센서간의 crosstalk를 극복하고자 센서들을 격리시킬 수 있는 댐(dam)을 형성하였다. 또한, 댐을 감싸고 상단 및 하단에 들기를 형성하는 패드를 이용하여 피부에 접촉하도록 제작하였다. 센서의 특성을 평가하기 위하여 각 센서 출력 단자의 저항 값을 측정하였으며 센서 스펙에서 제공하는 값과 동일함을 확인하였고, 실제 요골동맥 부위에서 맥파를 측정하여 전형적인 요골동맥 맥과 파형이 측정됨을 확인하였다.