• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.805-808
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• 2008

Due to the fact that bare FBG sensors are very fragile, bare FBG sensor is not properly applied in practical infrastructures as it is not suitable to the rudeness of construction. Therefore packaged FBG sensors are developed for construction application. Since FBG senses strain and temperature simultaneously, temperature compensation for FBG strain sensors is indispensable. In this paper, temperature compensation techniques for steel sleeve packaged FBG sensors are brought forward. And its application on monitoring concrete beam was carried to test the feasibility of the temperature compensation technique. Temperature compensation technique used in this paper is feasible to be extended to structure health monitoring in civil engineering especially in large infrastructures etc.

• Nuclear Engineering and Technology
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• v.21 no.2
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• pp.89-98
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• 1989

The expanding copper mandrel test performed at three strain rates (3.2$\times$10E -5/s, 2.0$\times$10E-6/s and 1.2$\times$10E-7/s) over 553-873 K temperature range by varying the heating rates (8-1$0^{\circ}C$/s, 1-2$^{\circ}C$/s and 0.5$^{\circ}C$/s) in air and in vacuum (5$\times$10E-5 torr). The yield stress peak, the strain rate sensitivity minimum and the activation volume peaks could be explained in terms of the dynamic strain aging. The activation energy for dynamic strain aging obtained from the yield stress peak temperature and strain rate was 196 KJ/mol and this value was in good agreement with the activation energy for oxygen diffusion in $\alpha$-zirconium and Zircaloy-2 (207-220 KJ/mol). Therefore, oxygen atoms are responsible for the dynamic strain aging which appeared between 573 K and 673 K. The yield stress increase due to the oxidation was obtained by comparing the yield stress in air with that in vacuum and represented by the percentage increase of yield stress ( $\sigma$$^{a}$ $_{y}$ - $\sigma$$^{v}$ $_{y}$ / $\sigma$$^{v}$ $_{y}$ ). The slower the strain rate, the greater the percentage increase occurs. In order to estimate the yield stress of PWR fuel cladding material under the service environment, the yield stress in water was obtained by comparing the oxidation rate in air that in water assuming the relationship between the oxygen pick-up amount and the yield stress increase.

• Journal of Korean Society of Steel Construction
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• v.9 no.4 s.33
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• pp.659-672
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• 1997

Thermal response induced from nonlinear temperature distribution in composite box gilder bridges depends on several variables(environmental conditions, physical and material properties, location and orientation of bridge, and cross-section geometry). In this paper, parametric study are conducted in order to find the effects of variations of seasons, location and orientation of bridge, sectional geometry and some material properties on the axial deformation, curvature and stresses in composite box girder bridge. A two-dimensional transient finite element model to conduct this parametric studies is briefly presented. Firstly, the effects of the parameters on the diurnal variation of curvature are considered, and for the time of maximum curvature, on the distribution of temperature and stresses of composite box girder sectional are considered. Finally, some considerations about the influence of the parameters on the daily maximum values of axial deformation, curvature and stresses are carried out. The influence of thermal effect on structures is important as much as the influence of live or dead load in some cases. In the design of steel composite bridges, the thermal stresses calculated on the supposition that the temperature difference between the concrete slab and steel girder is $10^{\circ}C$ and the temperature distributions are uniform in concrete slab and steel girder can be underestimated.

• Journal of the Society of Naval Architects of Korea
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• v.39 no.1
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• pp.49-60
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• 2002

Welding is essential in ship production since welding is very popular method for joining two or more metals. However, welding causes residual stress and distortion and these give a bad influence to the structure strength and assembly of ship blocks. Therefore, prediction and treatment of residual stress and distortion is a key to accuracy control in shipyard. In this paper, a computational procedure, based on thermal-elastic-plastic 3-dimensional FEA, has been suggested to simulate butt and fillet welding process. In the simulation process, temperature distribution at each time step is obtained by heat transfer analysis and then thermal deformation analysis is done with obtained temperature distributions to find the residual stress and distortion. In heat transfer analysis, enthalpy method is used to realize phase change at melting temperature. Also element birth and death method is used to simulate adding of weld metal in both heat transfer analysis and thermal elastic plastic analysis. The proposed procedure is verified by related researches and the results show good agreement with those of related researches.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Explosives and Blasting
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• v.29 no.1
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• pp.34-40
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• 2011

In this study, effects that thermal stress and water pressure have on the deformation behaviour of granite specimens recovered in Gagok Mine are estimated. To analyze effects of the thermal stress and water pressure on the deformation behaviour, granite specimens were preheated with cycles of predetermined temperatures ranging $200^{\circ}C$ to $700^{\circ}C$ and 500, 600, $700^{\circ}C$ specimens were pressurized to 7.5 MPa. The deformation behaviour of the specimens had been studied by performing uniaxial compressive tests. Axial and lateral strains of specimens were found to increase with increasing temperature, and above $600^{\circ}C$, the increase of strains were more pronounced. The reduction trends of uniaxial compressive strength and Young's modulus with temperature appeared to follow an exponential decay function. Specimens under water pressure showed the more inelastic deformation characteristics, which means that water pressure has an effect on the widening and extending of micro-cracks existed in preheated specimens.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.1
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• pp.71-75
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• 1994

In this study, a thermoelastic stress index of (100) oriented single crystalline silicon wafer and a relationship between thermal stress and critical plastic deformation temperatures were simulated. The simulated results for the thermoelastic stress index indicated a maximum value on <110> direction and a minimum on <100>. Then, it could be predicted that silicon wafer is plastically deformable over 1000 K, based on the relationship between the thermal stress derived from the thermoelastic stress index and the critical plastic deformation temperature.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2006.06a
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• pp.275-276
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• 2006

선박 및 해양기자재의 안전 진단을 위한 기존의 기술은 접 센서(point sensor)를 이용한 변형률 측정 기술이 대부분이라 할 수 있다. 본 논문은 기존의 기술보다 효율적으로 응용될 수 있는 광섬유 센서를 이용한 분포 개념의 온도 및 변형률 측정(DTSS: Distributed Temperature & Strain Sensing) 기술에 대해 소개하고 있다. 이 기술은 선체 응력 모니터링, 해양 구조물 안전진단, subsea flowline 모니터링, platform의 riser 안정성, umbilical 모니터링 등에 활용될 수 있다.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.10
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• pp.127-134
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• 1997

열가소성 복합재료는 고상 성형법에 의해 저렴한 가격으로 부피가 튼 제품의 제조에 널리 사용될 수 있어 아주 좋은 전망을 가지고 있다. 그러나, 이러한 재료의 성형성에 대해선 아직 잘 알려지지 않았다. 본 연구의 첫번때 주안점은 2축 인장성형시 성형성에 대한 연구에 두었다. 실험에 사용된 재료는 임의의 방향으로 위치한 유리 섬유를 중량비로 20, 35, 40% 함유한 폴리프로필렌이다. 성형시험은 75 .deg. C 에서 150 .deg. C 사이의 온도에서 행했으며, 펀치 속도는 0.01cm/sec 와 1cm/sec 에서 행했다. 2축 인장성형에서 측정된 한계 변형률(Limiting Strain)은 Marciniak 불완전성 (Imperfection) 이론에 근거한 예견치외 비교되었다. 이론치와 실험치가 잘 일치함을 보였으며, 성형한계선도(Forming Limit Diagram) 로써 결과들을 요약하였다. 성형한계 변형률은 성형온도와 성형속도에 의해 크게 영향을 받는다는 것을 보인다. 이러한 결과들은 적절한 성형조건이 선택된다면 열가소성 복합재료의 인장성형은 실제 상업적으로 이용하기에 충분한 성형성을 갖는다는 것을 보인다.