• Title/Summary/Keyword: 열판

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NUMERICAL SIMULATION OF THERMAL CONTROL OF A HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY MACHINES (고온 나노임프린트 장비용 핫플레이트의 열제어에 대한 수치모사)

  • Park, G.J.;Kwak, H.S.;Shin, D.W.;Lee, J.J.
    • 한국전산유체공학회:학술대회논문집
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    • 2007.04a
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    • pp.153-158
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    • 2007
  • Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

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A Visualization Study on the Characteristics of Droplets Impinging on a Hot Surface (고온 열판에 충돌하는 액적의 거동에 대한 유동가시화 연구)

  • Kim, Dong-Yeon;Yi, Seung-Jae;Kim, Kyung-Chun
    • Journal of the Korean Society of Visualization
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    • v.10 no.1
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    • pp.21-26
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    • 2012
  • Hydrophobic characteristics of high temperature metal surface were investigated by high-speed visualization of water droplet impact. An aluminum plate was used as the sample plate and the initial diameter of a water droplet was 2 mm. Transient behavior of a single droplet impinging on the surface with and without heating was captured by using a high speed camera running at 4,000 frames per second. The Leidenfrost phenomenon was demonstrated for the case of $300^{\circ}C$ surface temperature, however there was no rebounding of droplet on the cold plate due to hydrophilic nature. The experimental results show that the shape evolution of a droplet impinging on the surface varies with the Weber number, i.e. the ratio of impact inertia to capillary force. The overall water-repellent characteristics of the heated surface was very similar to that of the super hydrophobic surfaces.

Thermal Design and Experimental Test of a High-Performance Hot Chuck for a Ultra Precision Flip-Chip Bonder (초정밀 플립칩 접합기용 고성능 가열기의 열적 설계 및 시험)

  • Lee Sang-Hyun;Park Sang-Hee;Ryu Do-Hyun;Han Chang-Soo;Kwak Ho-Sang
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.10 s.253
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    • pp.957-965
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    • 2006
  • A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

Studies on the Improvement of Butt Welding Characteristic of Polyethylene Pipes using an Advanced Heat Plate (PE 이중벽관 융착시 열판 형상에 따른 PE 파이프의 용접성에 관한 연구)

  • Gang, Chang-Gu;Kim, Jae-Seong;An, Dae-Hwan;Lee, Gyeong-Cheol;Hwang, Ung-Gi;Lee, Bo-Yeong
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.276-278
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    • 2007
  • Many processes have been introduced to join PE pipes, but most of these methods have lots of disadvantages such as costs and lack of reliability, etc. Recently due to the benefits of cost, safety and reliability, the but welding has been paid much attention to join PE pipes. In case of butt welding, the heat plate which is used to melt PE pipes is the most critical equipment. In this study, after designed secondary developed heat plate of new shape, the PE double wall pipes were but-welding by using the developed heat plate and secondary developed heat plate and comparison of weld-zones and tensile test were performed. As results of tensile test, tensile strengths using secondary developed heat plate were measured higher $1.17{\sim}1.5$ than using developed heat plate.

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Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes (히트 파이프를 이용한 열경화성 나노임프린트 장비용 열판의 온도 균일도 향상)

  • Park, Gyu Jin;Yang, Jin Oh;Lee, Jae Joong;Kwak, Ho Sang
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.2
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    • pp.74-80
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    • 2016
  • This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

Press-drying of Plantation Softwood Lumber (인공조림(人工造林) 침엽수재(針葉樹材)의 열판건조(熱板乾燥))

  • Jung, Hee-Suk;Lee, Nam-Ho;Yeo, Hwan-Myeong
    • Journal of the Korean Wood Science and Technology
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    • v.21 no.3
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    • pp.61-66
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    • 1993
  • 24mm-thick specimens from three species of plantation-grown softwood were press dried under two platen pressures of 1.75kgf/$cm^2$ and 3.50kgf/$cm^2$ to obtain drying information regarding to drying rate, thickness shrinkage and drying defects. The influence of platen pressure on drying fare in range of moisture content (30 to 10 percent) increased for pitch pine and larch, but reduced for korean white pine at higher pressure. Thickness shrinkage was increased at the higher pressure, and estimated thickness shrinkage at final MC of 10 percent became unrealistically greater for specimens containing higher final moisture content under the great influence of compressive strain. The effects of pressure on the amount of surface checks and honeycombing were different from species used. These species should have applied lower temperature than 177$^{\circ}C$ in this study to reduce surface checks and honeycombing.

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Distribution Model Based on Computer Simulation for Internal Temperature and Moisture Content in Press Drying of Tree Disks (원판(圓板)의 열판건조(熱板乾燥)에서 컴퓨터 시뮬레이션에 의한 내부온도(內部溫度)와 함수율(含水率) 분포모형(分布模型))

  • Yeo, Hwan-Myeong;Jung, Hee-Suk
    • Journal of the Korean Wood Science and Technology
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    • v.22 no.2
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    • pp.61-70
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    • 1994
  • This study was executed to find the applicability of press drying of tree disk by investigating the shrinkage and drying defect and to form appropriate model by comparing the actual moisture content(MC) and internal temperature in respect of drying time with calculated values based computer simulation to which was applied finite difference method. In press drying disk, heating period, constant drying rate period maintained plateau temperature at 100$^{\circ}C$ and falling drying rate period were significantly distinguished. Actual MC and internal temperature were analogous to those calculated at comparing points. Heat transfer model formed by Fourier's law using specific heat of moist wood and conduction coefficient considering fractional volume of each element of wood cell wall, bound water, free water and air showed applicability as basic data to developing heat expansion, shrinkage and drying stress during press drying. Also mass transfer model formed by Fick's diffusion law using water vapor diffusion coefficient showed applicability. Longitudinal shrinkage was developed by pressure of hot press and tangential shrinkage was restrained by hygrothermal recovery. The heart check, surface check and ring failure were occurred differently in species, but V-shaped crack didn't develop.

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크라이오펌프 국산 개발품 공정 신뢰성 및 내구성 시험

  • In, Sang-Ryeol;Gang, Sang-Baek;No, Yeong-Ho;Yu, Jae-Gyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.119-119
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    • 2013
  • 5년 동안 진행된 고진공 펌프 개발 사업의 일환으로 맥동관형 냉동기에 활성탄 어레이를 장착한 흡기구 직경 14인치 국산 크라이오펌프 완제품이 만들어졌다. 이미 지난해에 완성한 시제품을 가지고 모든 배기성능시험을 완료하고 목표를 뛰어 넘는 성능을 가지고 있음을 입증하였지만 완제품의 경우는 현장에서 스퍼터링 공정에 대한 신뢰성과 열적 내구성 시험이 중요한 항목으로 대두되었다. 개발된 펌프를 생산 공정에 직접 투입하는 모험을 하지 않으면서도 신뢰성을 확보하는 방편으로 카이스트 나노종합팹 센터에서 가동중인 스퍼터링 장비에 완제품을 달고 기존 공정과 같은 방식으로 장치를 운영하면서 외제 상용품을 사용했을 때와 진공성능 및 공정수율을 비교하는 시험을 수행하였다. 또 내구성 시험 항목으로 열부하 시험과 열 사이클 시험을 수행하였다. 열부하 시험은 300도까지 온도를 올릴 수 있는 열판을 펌프 흡기구 배플 앞에 설치하여, 냉동기 2차 냉각단 온도가 20 K 이하로 유지될 수 있는 최대 허용 복사열을 측정하는 방식으로 진행되었으며 열 사이클 시험은 크라이오 펌프의 활성화 기능을 활용하여 완전 활성화(full regen., 10K-300K-10K) 과정을 10회 연속 시행하여 펌프의 배기성능과 기계적 이상 유무를 관찰하였다.

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Reliability Evaluation System of Hot Plate for Photoresist Baking (Hot Plate 신뢰성 시험.평가시스템 개발)

  • Song, Jun-Yeop;Song, Chang-Gyu;No, Seung-Guk;Park, Hwa-Yeong
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.8
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    • pp.180-186
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    • 2002
  • Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8")\;to\;\Phi300mm$ (wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

A Study on Thermal Conductivity Properties of Ground Heat Exchangers for GSHP systems (지열냉난방시스템 수직형 지중열교환기 그라우트의 열적 특성에 관한 연구)

  • Baek, Sung-Kwon;Jeon, Joong-Kyu;An, Hyung-Jun
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.11a
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    • pp.546-549
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    • 2007
  • 지열 냉난방 시스템의 설계는 냉난방 공간의 크기에 따라 필요한 부하를 계산하여 설계하게된 다. 설계 부하를 충분히 소화할 수 있는 지열교환기의 길이와 보어홀의 깊이 및 개수는 지반의 열적 특성에 크게 좌우된다. 열전도율이 큰 지반일수록 지열교환기 내의 열 흡수 및 소산이 효과적으로 이루어져 지열교환기의 길이도 상대적으로 짧아질 수 있다. 즉, 효율적이고 정확한 설계를 하기 위해서는 지반, 암반 및 지중열교환기의 물리적 특성에 따른 열적 특성을 설계자는 미리 숙지하여야 한다. 현재 국내에서 수직 밀폐형 지중열교환기의 그라우트로 벤토나이트를 가장 많이 사용하고 있으나, 해외의 경우 지중 조건에 따라 시멘트 또는 벤토나이트를 적절히 선택하여 시공하고 있다. 이는 벤토나이트의 특성상 적용 조건이 제약을 받기 때문이며, 특히 지하수가 존재하지 않을 경우 사용이 사실상 불가능하다. 국내에서 이에 대한 충분한 연구는 아직 이루어지지 않았으며, 시멘트 그라우트를 사용하기 위한 물리적, 열적 특성에 대한 연구가 필요한 시점이라 판단하여 본 연구를 수행하였다. 시멘트 그라우트의 경우 수화반응이 일어나는 초기의 건조수축을 최소화하는 배합비로 물성을 구성하였으며, 벤토나이트는 일반 현장 시공 비율을 사용하였다. 열전도율은 첫째 실내 시험으로 시멘트 그라우트에 대한 열판시험법과 벤토나이트 그라우트에 대한 탐침시험법으로 수행하여 구하였으며, 두 번째 방법인 현장 시공으로 직접 현장열응답시험을 수행하여 그라우트 간의 열적 특성을 비교하였다. 또한 기존 시멘트그라우트의 열적 특성을 개량한 코오롱건설에서 개발한 시멘트 그라우트에 대한 열적 거동도 기존 타 그라우트의 열적 거동과 비교하였으며, 개발 제품의 성능이 상당히 우수함을 알 수 있었다.

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