• Journal of the Korean Institute of Gas
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• v.9 no.1 s.26
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• pp.26-32
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• 2005

This paper presents the design safety of metal seals in pressure vessels. For a high-pressure vessel, a metal seal is usually used as a primary sealing, and an elastomeric rubber O-ring is adopted as a secondary sealing unit. The FEM computed results show that an aluminium material for sealing a gas leakage is superior to a steel one because of the thermal expansion rate. The deformation and stress distributions on the metal seal and pressure vessel structures are mainly dominated by transferred temperature compared to those of the gas pressure in which is supplied by an external pump. Thus, the temperature of a metal seal material should be restricted to under $200^{\circ}C$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.197-202
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• 2001

The influence of thermal treatment and cold drawing was investigated for poly(ethy1ene terephthalate) films fabricated with various experimental conditions. Samples were elongated at room temperature under stepwise-drawing condition with the cross-head speed kom 0.5 to 500 mrdmin in an universal tester. Stress oscillation was observed in the stress-stnin curve of the samples heat-treatd at 50, 72 and $129^{\circ}C$ for 30 min, but it was not observed in the samples heat-treatd at $83^{\circ}C$ for 30 min. Thermal analyses of the samples were carried out in differential scanning calorimeter at the heating rate df $10^{\circ}C$/min/min, and the glass transition temperature, crystallization peak, enthalpy of fusion and degree of crystallinity were measured. The dynamic mechanical analyses of the samples were also carried out in a multiplefimction internal kiction pendulum at 1 Hz with the heating rate of $1.5^{\circ}C$/min, and it was found that the elastic modulus increases in the order of non-treated, heat-treated, and elongated samples.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1262-1265
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• 2004

송전용량 증가를 위해 개발되어 최근 본격적으로 사용되고 있는 STACIR/AW 송전선은 송전용량의 증가에 따라 그 운전환경도 변화하여 연속사용온도의 경우, 기존 ACSR 전선의 90t에 비해 높은 $210^{\circ}C$로 규정 되어 있을 만큼 고온에서 운전되고 있다. 따라서 STACIR/AW 송전선은 이도설계와 그 운용에 있어서 운전 온도 상승에 따른 각별한 주의관리가 필요하다 실제 STACIR/AW송전선은 그 설계단계에서도 이와 같은 고온운전 환경을 고려하여 고온에서도 소정강도를 유지하는 내열 Al도체와 이도제어를 위한 낮은 열팽창 특성의 INVAR합금(Fe-35Ni계 합금)을 강선으로 하는 특화된 재료로 구성되어 있다. 그러나 이와 같은 재료 설계적 보완책에도 불구하고 실제 송전선은 전선의 자중, 철탑 간에 형성된 가설장력과 같은 다양한 응력이 고온환경에서 부하되는 복합 열화 상태에 노출되어 있고, 이것은 재료학적인 관점에서 크릴 변형 발생의 가능성을 높이고 있으나 이것에 대한 연구 또는 실험결과는 크게 미미한 실정이다. 본 연구에서는 STACIR/AW $410mm^2$ 송전선과 그 구성소재를 대상으로 $200^{\circ}C$, $300^{\circ}C$에서 장시간 열화한 후, 구성소재의 탄성계수, 열팽창계수 및 STACIR/AW전선의 크림변형 거동을 조사하여 열화에 노출된 STACIR/AW 송전선의 이도변화 거동을 규명하고자 하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.1083-1089
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• 2010

Shape memory alloys (SMAs) are smart materials. The unique characteristics of SMAs enable the production of large force and displacement. Hence, SMAs can be used in many applications such as in actuators and active structural acoustic controllers; the SMAs can also be used for dynamic tuning and shape control. A SMA torque tube actuator consisting of SMA tubes and superelastic springs is proposed, and the behaviors of the actuator are investigated. From the results of heat transfer analysis, it is proved that the SMA torque tube actuator with both resistive heating of SMA itself and a separate conventional heating rod in the tube core has good performance. The behavior of an actuator system was analyzed by performing a contact analysis, and the twisting motion was noticed when checking the actuation. 3D SMA nonlinear constitutive equations were formulated numerically and implemented by performing a nonlinear analysis by using Abaqus UMAT.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Journal of the Korea Computer Graphics Society
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• v.16 no.3
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• pp.31-39
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• 2010

The particle system based on quad mesh has been posed to model cloth. But we need to develop cloth models on triangular meshes because they are widely used. Cloth modeling on triangular mesh is often done in the style of finite element method, which assumes that material is continuous. To preserve the advantages of particle system, e.g. model simplicity and the ease of implementation, even on triangular mesh, this paper proposes a particle system on triangular mesh. The motion of cloth is modeled so that vertices interact with each other via the edges on the triangular mesh. The interactions of vertices are assumed to exist between every adjacent vertex and between every other vertex. The deformation energy due to interaction is constructed based on the theory of elasticity. The contribution of the paper is to implement the advantages of particle system on triangular mesh.

• Journal of the Korea Concrete Institute
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• v.26 no.6
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• pp.707-714
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• 2014

CFT (Concrete-Filled Tube) is a type of steel column comprised of steel tube and concrete. Steel tube holds concrete and the concrete inside tube takes charge of compressive load. This study presents structural performance of the CFT column which has 73~100 MPa high strength concrete inside. Fluidity, mechanical compression, pump pressure test in flexible pipe were conducted for understanding properties of the high strength concrete. Material properties were achieved by various experimental tests, such as slump, slump flow, air content, U-box, O-Lot, L-flow. In addition, mock-up tests were conducted to monitor concrete filling, hydration heat, compressive strength. From construction sites in Sang-am dong and University of Seo-kang, long-term behaviors could be effectively predicted in terms of ACI 209 material model considering elastic deformation, shrinkage and creep.

• Journal of the Korea Concrete Institute
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• v.23 no.2
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• pp.219-224
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• 2011

In this study, a piezoelectric smart sensor that can be embedded inside of concrete structures is developed to investigate the early stage of concrete curing. A waterproof coating is used to protect the piezoelectric sensor from moistures of concrete mixture. Also, a mortar case is utilized to encapsulate the sensor to protect it from impact loads. To estimate the strength of concrete, a self-sense guided-wave actuated sensing technique is applied. In the guided wave, its velocity is varied according to the mechanical properties of concrete such as modulus of elasticity. Because modulus of elasticity directly affects the strength of concrete, the guidedwave's velocity also affects the concrete strength development. To verify the feasibility of using the proposed approach, the smart sensor was embedded into a 100MPa concrete cylinder and the self-sense guided wave is continuously measured throughout the curing process. The measurements showed that the propagation time (TOF) of the measured guided waves gradually decreased as the curing age increased. Especially, at the early age of the curing process, the variation of the TOF was very significant. Furthermore, the results showed that there is a linear relationship between the TOF of the self-sense guided waves and the strength of concrete existed. It is safe to conclude that the proposed approach can be used very effectively in monitoring of the strength development of high strength concrete structures.

• Proceedings of the Korea Crystallographic Association Conference
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• 2003.05a
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• pp.22-22
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• 2003

원자로에서 핵분열에 의해 생성된 고에너지 중성자는 감속재를 통해 열평형에 의해 에너지가 낮춰져 통계적 분포, 즉 Maxwell-Boltzman 운동에 따른 에너지 스펙트림을 갖게 된다. 중성자 산란장치는 통상 단색빔을 이용하므로 단색기(monochiomator)를 통해 이 분포에서 특정 파장의 중성자빔을 인출, 즉 단색화한다. 이때 단색기는 각각의 중성자 산란장치에 사용할 수 있는 특정 파장의 중성자빔을 인출하면서도, 파장의 퍼짐을 적절하게 조절하여 높은 중성자속(neutron flux)을 가지며 분해능도 또한 좋아야 한다. 전통적으로 많이 사용하는 단색화 방법은 결정의 내부결함을 유도하여 만든 모자익(mosaic) 결정을 이용하는 것이다. 이 방법은 특정 파장을 얻으면서도 좋은 분해능과 높은 중성자속을 갖는 모자익 결정을 만들기가 어렵고, 한번 결정된 단색기의 특성을 바꿀 수 없는 단점이 있다. 1980년대부터 몇몇 그룹이 거의 완전하게 성장된 단결정 슬랩을 미세하게 구부려서 탄성변형을 주어 effective 모자익 구조를 발생시킨 '구부린 완전결정(bent perfect crystal, BPC)' 단색기를 개발하여 특정 목적에 활용하는 시도를 하였다. BPC 단색기는 단색화된 중성자빔을 집속(focusing)할 수 있으며, 결정의 구부림 정도를 조절하고 배치 기하를 바꿈으로써 다양한 특성을 갖는 단색빔을 얻을 수 있는 장점이 있다. 이렇게 단색기의 기하학적 변수를 조절함으로써 회절빔의 집속도와 분해능을 조절할 수 있어서 잔류응력 측정이나 단결정 회절 및 집합조직 측정장치 등에 적용할 수 있다. 본 연구에서는 BPC 단색기의 원리와 여러 배치기하에 따른 빔의 특성을 소개하고자 한다.빔이 시료와 상호 작용하는 면적과 상호작용하지 않을 때의 빔을 회절모드에서 faraday cup으로 측정한 빔전류로 부터 계산하였다. Gibbsite에 대한 전자빔 조사 시 1분 이내에 급격한 Hydroxyl Ion(OH-)의 이탈로 인해 Cibbsite의 구조는 거시적 비정질화가 되며 시간증가에 따라 χ-alumina → ν-alumina → σ-alumina or δ-alumina의 순으로 상전이를 겪는다. 전자빔 조사 시 관찰된 회절자료의 가시적 변화를 통해 illumination angle 1.25mrad(Dose rate : 334 × 10³ e/sup -//sec·n㎡)일 경우 약 3초 이내에 비정질화가 시작됨을 알 수 있었고 이는 약 1 × 10/sup 6/ e/sup -//sec·n㎡ 의 전자선량에 해당되며 이를 기준으로 각각의 illumination angle에 대한 임계전자선량을 평가할 수 있었다. 실질적으로 Cibbsite와 같은 무기수화물의 직접가열실험 시 전자빔 조사에 의해 야기되는 상전이 영향을 배제하고 실험을 수행하려면 illumination angle 0.2mrad (Dose rate : 8000 e/sup -//sec·n㎡)이하로 관찰하고 기록되어야 함을 본 자료로부터 알 수 있었다.운동횟수에 의한 영향으로써 운동시간을 1일 6시간으로 설정하여, 운동횟수를 결정하기 위하여 오전, 오후에 각 3시간씩 운동시키는 방법과 오전부터 6시간동안 운동시키는 두 방법을 이용하여 품질을 비교하였다. 각 조건에 따라 운동시킨 참돔의 수분함량을 나타낸 것으로, 2회(오전 3시간, 오후 3시간)에 나누어서 운동시키기 위한 육의 수분함량은 73.37±2.02%를 나타냈으며, 1회(6시간 운