• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.140-140
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• 2013

3차원 실장을 위한 TSV의 제조 공정 중에 발생할 수 있는 Cu의 돌출 거동에 대해 연구하였다. Cu의 돌출은 반도체를 제조할 때 고온(>$350^{\circ}C$) 공정인 BEOL (back end of line) 중에 발생하는 현상이다. Cu의 돌출은 Si과 Cu의 열팽창계수 차이에 의해 발생하는 현상으로 고온 공정 뿐만아니라 열충격 시험과 같은 열피로에 의해서 발생할 수 있다. 따라서 본 연구에서는 $-65^{\circ}C$에서 15분과 $150^{\circ}C$에서 15분을 1 사이클로 설정하여 0, 250, 500, 1000 사이클의 열충격 시험을 수행하였다. 열충격 시험 후 각 사이클에서의 Cu 돌출 거동과 Cu의 표면 거칠기 변화에 대해 연구하였다.

• Journal of Energy Engineering
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• v.22 no.4
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• pp.327-332
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• 2013

일본 연구에서는 열충격 시험을 통한 태양전지의 파괴모드에 따른 전기적 특성을 분석하였다. 시편은 Photovoltaic Module을 만들기 전 3 line Ribbon을 Tabbing한 단결정 Solar Cell을 제작하였다. 열충격 시험 Test 1의 온도조건은 저온 $-40^{\circ}C$, 고온 $85^{\circ}C$, Test 2는 저온 $-40^{\circ}C$, 고온 $120^{\circ}C$에서 Ramping Time을 포함하여 각각 15분씩, 총 30분을 1사이클로 500사이클을 각각의 조건으로 수행하였다. 열충격 시험 후 Test 1에서는 4.0%의 효율 감소율과 1.5%의 Fill Factor 감소율을 확인하였으며, Test 2에서는 24.5%의 효율 감소율과 11.8%의 Fill Factor 감소율을 확인하였다. EL(Electroluminescence)촬영 및 단면을 분석한 결과, Test 1과 Test 2 시편 모두 Cell 표면 및 내부에서의 Crack이 발견되었다. 하지만, Test 2의 시험이 Test 1보다 가혹한 온도조건의 시험으로 인해 Test 1에서 나타나지 않았던, Cell 파괴를 Test 2에서 확인하였다. 결국, Test 1에서 효율의 직접적인 감소 원인은 Cell 내부에서의 Crack이며, Test 2에서는 Cell 내부에서의 Crack 및 Cell 파괴로 인한 Cell 자체의 성능저하로 효율이 크게 감소한다는 것을 본 실험을 통하여 규명하였다.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.225-227
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• 2005

Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 열 충격 시험을 행하였다. 열 충격 시험은 $-40^{\circ}C$에서 $80^{\circ}C$범위에서 1000 사이클 동안 하였다. 접합 기판으로는 각각 OSP(Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608 Chip(Multi Layer Chip Capacitor, Chip Resistor) 으로 전극 부위에 Sn-37wt%Pb, Sn 도금하여 사용하였다. 솔더링 후 1608 Chip의 전단 강도와 솔더링부에서 미세조직 및 IMC(Inter Metallic Compound) 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 강도는 기판의 표면처리에 상관없이 약 40N 이상이었다. 그리고 열충격 시험 1000 사이클 후에는 모든 기판에서 2N 정도 약간의 강도 저하를 보였다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Journal of Energy Engineering
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• v.21 no.1
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• pp.26-32
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• 2012

This study has been performed Thermal Shock test for analyze the cause of Power drop in PV(Photovoltaic) Module. Thermal Shock test condition was performed with temperature range from $-40^{\circ}C{\sim}85^{\circ}C$. One cycle time is 30min. which are consist of low and high temperature 15min. each other. The test was performed with total 500cycles. EL, I-V were conducted every 100cycle up to 500cycles. Mono Cell resulted in 8% Power drop rates in Bare Cell and 9% in Solar Cell. In the case of Multi Cell resulted in 6% Power drop rates in Bare Cell and 13% in Solar Cell. After Thermal Shock test, Solar Cell's Power drop resulted from surface damages, but in the case of Bare Cell's Power drop had no surface damages. Therefore, Bare Cell's Power drop was confirmed as according to leakage current increase by analysis of Fill Factor after Thermal Shock test. Also, Solar Cell's Power drop rates are higher than that of Bare Cell because of surface damages and consuming electric power increase. From now on, it should be considered that analyzed the reasons of Fill Factor decrease and irregular Power drop in PV module and Cell level using cross section, various conditions and test methods.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.91-95
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• 2012

본 연구에서는 열충격 시험을 통하여 Cell레벨에서의 효율저하 특성을 분석하였다. 열충격 시험은 PV모듈의 시험 규격인 KS C IEC-61215를 이용하여 보다 가혹한 조건인 $-40^{\circ}C$에서 $120^{\circ}C$의 조건으로 500사이클 수행하였다. I-V 측정을 통하여 효율을 분석한 결과, 열충격 시험 전 13.9%에서 열충격 시험 후 11.0%로 효율이 저하 됐으며, 감소율은 20.9% 나타났다.EL촬영을 통해 표면을 분석한 결과 Ribbon접합부 및 Gridfinger의 손상으로 확인 됐으며, 보다 정확한 효율 저하의 원인을 분석하기 위해 단면분석을 실시한 결과 표면손상으로 확인 되었던 위치의 Cell내부에서도 Crack을 확인 할 수 있었다. 또한 FF값을 분석한 결과 열충격 시험 전 72.3%에서 시험 후 62.0%로 11.8%의 감소율을 보였다. 따라서, 경년 시 나타나는 효율저하는 Cell자체의 소모전력 증가와 외부환경에 의한 표면 손상 및 Cell내부의 Crack에 기인하여 가속된다고 판단된다.

• Journal of Energy Engineering
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• v.21 no.3
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• pp.249-253
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• 2012

In this study, The report analysed the characteristics of power drop in solar cell through thermal shock test. The solar cells were tested 500 cycles in $-40^{\circ}C$ lowest temperature and $120^{\circ}C$ highest temperature by thermal shock test on ironbound conditions, that excerpted standard of PV Module(KS C IEC-61215). The result of the efficiency analysis through measure of I-V, efficiency of Cell decreased from 13.9% to 11.0% and decreasing rate was 20.9% after test. The result of the surface analysis through EL, solar cell has damage of gridfinger and ribbon joint. Cell cracks were founded in damage of cells through cross section of solar cells. Also, Fill factors were decreased from 72.3% to 62.0% after thermal shock test and decreasing rate is 11.8%. therefore, Yearly power drop is aggravated with facts that cell crack, damage of surface and power loss of cell by change of I-V characteristic curve with decreasing of parallel resistance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.8
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• pp.62-68
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• 2016

The feeder cable assembly is an automotive part used for telecommunication. If it malfunctions, the control and safety of the automobile can be put at risk. ALT (Accelerated Life Testing) is a testing process for products in which they are subjected to conditions (stress, strain, temperatures, etc.) in excess of their normal service parameters in an attempt to uncover faults and potential modes of failure in a short amount of time. Failure is caused by defects in the design, process, quality, or application of the part, and these defects are the underlying causes of failure or which initiate a process leading to failure. Thermal shock occurs when a thermal gradient causes different parts of an object to expand by different amounts. Thermal shock testing is performed to determine the ability of parts and components to withstand sudden changes in temperature. In this research, the main causes of failure of the feeder cable assembly were snapping, shorting and electro-pressure resistance failure. Using the Coffin-Manson model for ALT, the normal conditions were from Tmax = $80^{\circ}C$ to Tmin = $-40^{\circ}C$, the accelerated testing conditions were from Tmax = $120^{\circ}C$ to Tmin = $-60^{\circ}C$, the AF (Acceleration Factor) was 2.25 and the testing time was reduced from 1,000 cycles to 444 cycles. Using the Bxlife test, the number of samples was 5, the required life was B0.04%.10years, in the acceleration condition, 747 cycles were obtained. After the thermal shock test under different conditions, the feeder cable assembly was examined by a network analyzer and compared with the Weibull distribution modulus parameter. The results obtained showed good results in acceleration life test mode. For the same reliability rate, the testing time was decreased by a quarter using ALT.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.5
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• pp.450-457
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• 2009

Periodical thermal shock can introduce defects in thermal barrier coating made by layers of CoNiCrAlY bond coating(BC) and $ZrO_2-8wt%Y_2O_3$ ceramic top coating(TC) on Inconel-738 substrate using plasma spraying. Thermal shock test is performed by severe condition that is to heat until $1000^{\circ}C$ and cool until $20^{\circ}C$. As the number of cycle is increased, the fatigue by thermal shock is also increased. After test, the micro-structures and mechanical characteristics of thermal barrier coating were investigated by SEM, XRD. The TGO layer of $Al_2O_3$ is formed between BC and TC by periodical thermal shock test, and its change in thickness is inspected by eddy current test(ECT). By ECT test, it is shown that TGO and micro-crack can be detected and it is possible to predict the life of thermal barrier coating.

• Journal of Power System Engineering
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• v.15 no.6
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• pp.5-10
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• 2011

A turbocharger is subjected to rapid temperature changes during thermal cyclic loads. In order to predict the thermo-mechanical failures, it's very important to estimate temperature distributions under the thermal shock test. This paper suggest the finite element techniques with the temperature histories, a constitutive material model and the mechanical constraints to calculate the thermal stresses and plastic strain distributions for the turbine housing. The first step was to develop a simple coupon approach to represent the failure mechanism of the classical design shapes and secondly applied the actual turbocharger to predict and validate the weak locations under the physical engine test.