• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.10a
• /
• pp.870-874
• /
• 1997

Super-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with resinoid-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance and the surface roughness are measured and discussed. The results are as follows.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1992.04a
• /
• pp.55-59
• /
• 1992

최근 신 연삭 공구인 미세한 지립의 다이아몬드 휠을 이용함으로써 고경도와 취성을 지니는 엔지 니어링 세라믹스등의 신소재및 초경재 등 난삭재류를 대상으로 경면 가공을 추구하고자 노력이 진행중이다. 이는 래핑이나 폴리싱 등의 유리 지립에 의한 경면 창성법에 비하여 가공 능률이나 가공 정도가 높고 곡면이나 홈 등의 복잡 형상부의가공에도적용할 수 있다는 잇점이 있기 때문이다. 따라서 현재 이러한 신 연삭 가공법은 지금까지 연삭 가공후에 연마 가공 공정을 부가함으로써 초정 밀 효과를 지닐 수 있었던 각종 부품들에대한 단일 최종 마무리가공 공정으로의 응용에많은 기대를 걸고 있다. 본 연구는 높은 압축 강도치, 고온경도치와 내마모성, 강성 등을 지님으로써 외부 압력에 대한 변형률이 극히 적어 금형 칫수에가까운 제품을 생산할 수 있다는 특성으로 근래그 사용도가 급증 하고 있는 초경합금 금형재를 대상으로 해그 동안 난삭재에 대한 최적 가공 조건 설정이 정립되어 있지 못했던 관계로 인하여 기존의 숙련자 경험에만 주로 의존 할 수 밖에 없었던 단순한 다이아몬드 연삭 공구의 활용추세로부터 탈피하고 Diamond wheel 및 범용 연삭 공구를 최적으로 활용함으로써 연삭 가공의 초정밀화를 달성하며후 가공을 생략할 수 있는 가공 공정을 창출 해내기위하여, 상관 관계를 연삭 저항 및 가공 표면 품위등의 측면으로분석, 평가해봄으로써 초정밀 가공 차원에서의 최적 가공 조건 설정을 위한 지침을 명확하게 규명하기 위하여 실험적으로 수행하게 된 것이다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1992.05a
• /
• pp.111-111
• /
• 1992

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 1994.10b
• /
• pp.9-9
• /
• 1994

• Transactions of the Korean Society of Automotive Engineers
• /
• v.2 no.6
• /
• pp.38-49
• /
• 1994

In this study, grindability of some representative engineering ceramics are experimentally investigated using resin bond diamond wheel with conventional surface grinding machine, and proper grinding conditions which can be obtained from various experimental results are established also for mechanical components which are proper to domestic circumstances with high reliability. And through the results of experiment, it is confirmed that grinding energies of the ceramics, especially in the case of $Al_2O_3$, are lower than steel with same machining condition in the conventional grinding because of their fine-brittle fracture mode type removal process, though the ceramics are well-known to unmachinable materials. And moreover, the total pass numbers needed for spark-out process to be completed are depend on their mechanical properties because that grinding stiffness is different from each other. The grinding force, ginding power and ground surface roughness are also measured and compared. Furthermore, the experiments carried out in this study, some useful results are obtained with can guide to grind engineering ceramics with conventional surface grinding machine.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.04a
• /
• pp.43-47
• /
• 2002

In this study, through the experimental results of grinding ratio, grinding force and surface roughness with the obtained wear amount of diamond wheel and ceramic material during the grinding process, the following conclusions could be found. In the case of $Si_3N_4$, the wear of diamond wheel is large while the grinding force is stable and the range of change in surface roughness is small. for the case of $AL_2O_3$ and $ZrO_3$, while the wear of diamond wheel is getting smaller, the grinding force is increasing but the value of surface roughness is decreasing. For grinding with the vitrified bond wheel, it seems that the self-sharpening can be found for $Si_3N_4$ and the glazing effect of the cutting edge for $AL_2O_3$ and $ZrO_3$.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.2
• /
• pp.187-194
• /
• 2002

For the fine grinding process development of semiconductor monocrystalline silicon, wheel rotational speed, chuck rotational speed, feed rate and hysteresis force were controlled. Magic mirror system was used for grinding wheel pattern analysis. Curvature of wheel pattern was measured by fitting equation. The modeling of surface wheel pattern was related to wheel and chuck rotational speed. The calculated curvature of the model was well matched with the measured curvature. The statistical analysis indicated wheel and chuck rotational speed were significantly effective on.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.9
• /
• pp.165-170
• /
• 2001

In normal grinding abrasive particles of a grinding wheel rotate on planes parallel to the direction of workpiece fred. which may induce continued scratch lines on ground surface as the workpiece feeds. Instead in helical scan grinding the planes make an angle, called a helical angle, with the feeding direction. Thus scratch lines produced by abrasive particles per one revolution are discontinued which implies that the generation of scratch lines are suppressed by the helical scan grinding. In this study some experimental works have been done on the helical scan grinding of glass to find the effects of grinding conditions on the surface roughness and estimate the optimal grinding conditions. The helical angle, fred rate, material removal rate and the wheel speed are taken as factors for three kinds of grinding wheels i.e., coarse(#140 mesh), medium(#400) and fine(#800) diamond wheels. The experiments are scheduled by Taguchi technique and ANOVA has been carried out for the interpretation of the results. As a result of this study effects of the factors are verified quantitatively showing that the major factors are changed according to the wheel's mesh size and the helical angle is one of the influencing factors on the surface quality.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.5 no.1
• /
• pp.33-38
• /
• 2006

Silicon has been widely used in electronic parts as a semiconductor equipment. It, however, requires much effort to grind without microcrack and chipping because of its high hardness and brittleness. So far, many studies for the grinding of engineering ceramics have been done, but not for the grinding of silicon. In this paper, a theoretical analysis on the grinding forces is introduced. Grinding experiments were performed at various grinding conditions including grinding directions (Up grinding and Down grinding), table speeds and depth of cuts. The grinding forces were measured to compare at various grinding conditions. The experimental values agree well with theoretical ones.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.9 no.2
• /
• pp.138-143
• /
• 2000

The establishment of a practical ultra-precision grinding technique using Diamond and CBN wheels is one of the major key technolo-gies to improve production techniques for machine-to-difficult materials without finishing process such as lapping and polishing. But the special efficient dressing technique for ultra-fine grit type grinding wheels to stabilize the grinding ability was not developed. Recently electrolytic in-process dressing technique is proposed to ultra-fine grit type metal bonded diamond wheels to protrude abra-sives continuously from the tool surface. This technology can be widely used to surface grinding and cylindrical grinding but cannot be used efficiently to internal grinding because of the electrode attachment trouble. This paper describes the effect of interval type electrolytic dressing as proposed newly to cast iron bonded diamond wheel for efficient internal grinding with mirror type high quality ground surface.