• 월간포장계
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• 통권192호
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• pp.78-82
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• 2009

• 한국산학기술학회논문지
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• 제12권3호
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• pp.1045-1050
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• 2011

본 연구는 자동차 내장 부품에서 표피재에 열을 가하여 금형내에서 엠보싱을 생성하는 새로운 압착방법을 제안한다. 엠보싱 무늬가 없는 표피재를 상부 금형에서 진공으로 흡입시켜 흡입력에 의하여 무늬를 성형한 후 금형을 닫아 사출물에 압착시키는 가열 압착 공법으로 엠보싱 무늬의 손상을 방지할 수 있다. 이 검증실험을 위하여 금형과 시험장치를 개발하여 시작품을 제작한 후 실험을 통하여 성능을 분석 평가하였다.

• 한국산학기술학회논문지
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• 제16권3호
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• pp.1585-1593
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• 2015

3차원 구조 알루미늄 판재(엠보싱 판재)는 표면적이 증가되어 방열효과가 뛰어나고 가공경화에 의해 굽힘강성 증가효과가 있으므로 자동차 열차단 부품에 널리 사용된다. 그러나 엠보싱 판재는 평판의 판재와 비교하면 기계적 특성이 상이하고 또한 3차원 형상으로 인해 프레스 가공에 있어서 많은 제약이 따른다. 본 연구에서는 프레스 가공공정을 대신하여 최근 신제품의 디자인 검증과 시생산에 널리 채용되고 있는 점진성형공정을 대상으로 엠보싱된 판재의 성형특성을 평가하였다. 본 연구에서 채용한 공구형상을 이용한 사각 원뿔의 점진성형 결과, 엠보싱된 판재의 경우가 평판의 경우보다 더 큰 기울기를 갖는 사각 원뿔을 파단없이 성형할 수 있음을 보였다. 이는 점진성형공정에서 CNC 공구의 이동경로(tool path)하에서 공구가 엠보싱 판재의 산과 골을 눌러 복원시키면서 재료의 소성변형을 증가시키기 때문이다. 또한 공구의 이동경로가 내향 경로보다 외향 경로인 경우가 보다 큰 기울기의 제품을 성형할 수 있지만 스프링 백의 발생으로 제품의 표면품질은 열세에 있음을 보였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1269-1272
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• 2005

Sandwich structures, which are composed of thick core between two thin faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. In this research, we have investigated the embossing configuration at the sheet metal shape through research with regard to the construction that the hardness and stiffness are excellent, and formability is advantage as inner structure. Through the FLD analysis according to the pattern changes, we have confirmed the forming possibility and variation of the aspect thickness. Also, we have fabricated the embossing press mold according to the pattern changes, and obtained the embossing inner structure the forming experiments.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1025-1029
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• 2003

We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2003년도 학술.기술논문 발표회
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• pp.37-40
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• 2003

This present paper mainly contains adhesion part disconnection type exposure composition waterproof method using embossing PVC sheet. The existing polymer resin coating and sheet waterproofing construction method have, however, some weak point such as being decrease life cycle of concrete with water leaking from materials be affected by crack and movement dash bond concrete through the whole-adhere construction. Above the reason, this paper has particular method increasing crack-defending performance from stress occurred concrete movement by part disconnection, adds maintain waterproofing performance subordinate sheet, that can be contributed a convenience of maintenance which is decreasing industrial waste and repair construction cycle through the part repair in case of leaking water.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2003년도 학술.기술논문발표회
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• pp.37-40
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• 2003

This present paper mainly contains adhesion part disconnection type exposure composition waterproof method using embossing PVC sheet. The existing polymer resin coating and sheet waterproofing construction method have, however, some weak point such as being decrease life cycle of concrete with water leaking from materials be affected by crack and movement dash bond concrete through the whole-adhere construction. Above the reason, this paper has particular method increasing crack-defending performance from stress occurred concrete movement by part disconnection, adds maintain waterproofing performance subordinate sheet, that can be contributed a convenience of maintenance which is decreasing industrial waste and repair construction cycle through the part repair in case of leaking water.

• 설비공학논문집
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• 제12권10호
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• pp.917-924
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• 2000

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel during the summer. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel is higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.168-174
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• 2007

A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.