• 건축사
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• 통권623호
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• pp.86-91
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• 2021

• 건축사
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• 통권634호
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• pp.58-63
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• 2022

• 건축사
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• 통권642호
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• pp.76-79
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• 2022

• 건축사
• /
• 통권642호
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• pp.58-63
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• 2022

• 건축사
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• 통권643호
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• pp.72-77
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• 2022

• 건축사
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• 통권649호
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• pp.42-47
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• 2023

• 건축사
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• 통권625호
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• pp.36-41
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• 2021

• 건축사
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• 통권654호
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• pp.58-63
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• 2023

• 한국정밀공학회지
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• 제29권1호
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• pp.109-113
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• 2012

The LED failure rate greatly depends on the physical properties of packaging materials (epoxy). The glass transitions temperature (Tg) of the epoxy is one of the most important physical properties. Therefore, in the present study, various epoxies with high Tg were prepared and their failure shapes were analyzed. In addition, the failure shapes depending on the amount of epoxy and the wire bonding structure were measured. As a consequence, the lower failure rate was obtained with the smaller amount of epoxy. The safety of LED was improved with increasing the Tg of the epoxy.

• 설비공학논문집
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• 제28권10호
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• pp.394-401
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• 2016

The configuration of an extruded-type cooling structure was optimized for the light-emitting diode (LED) streetlights that have recently replaced convectional metal halide streetlights for energy saving. Natural convection and radiative heat transfer over the cooling structure were simulated using a numerical model with experimental verification. An improved cooling structure type was suggested to overcome the previous performance degeneration, as confirmed by analyzing the thermal flow around the existing cooling structure. A parameter study of the cooling structure geometries was also conducted and, based on the numerical results, the configuration was optimized to reduce the weight of the cooling structure. Consequently, the mass of the cooling structure was reduced by 60%, while the thermal performance was improved by 10%.