• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.106-108
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• 2001

본 실험에서는 플라즈마 화학기상증착(PECVD)으로 증착한 비경질 실리콘(amorphous silicon, a-Si) 박막에 국부적으로 Si+ 이온을 주입한 후 엑시머 레이저 어닐링(exicimer laser annealing, ELA)을 수행하여 그레인의 수평 성장(lateral growth)에 미치는 영향을 관찰한다. Si+ 이온 주입은 비정질 실리콘 박막의 원자 결합 에너지를 효과적으로 감소시키는 역할을 하여 박막이 녹기 시작하는 문턱(threshold) 에너지가 $105mJ/cm^2$에서 $85mJ/cm^2$ 까지 낮아지는 것을 확인하였다. 결과적으로 선택적인 Si 이온 주입을 통해 비정질 박막의 결정화 시 온도 구배에 의한 결정핵(nucleation) 형성의 차이를 유발시킴으로써 위치 제어가 가능한 1um 크기를 갖는 수평 성장 그레인을 얻었다.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.353-356
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• 2002

Planar laser induced fluorescence(PLIF) has been widely used to obtain two dimensional fuel distribution. Preliminary investigation was performed to measure quantitative air excess ratio distribution in an engine fueled with LPG. It is known that fluorescence signal from acetone as a fluorescent tracer is less sensitive to oxygen quenching than other dopants. Acetone was excited by KrF excimer laser (248nm) and its fluorescence image was acquired by ICCD camera with a cut-of filter to suppress Mie scattering from the laser light. For the purpose of quantifying PLIF signal, an image processing method including the correction of laser sheet beam profile was suggested. Raw images were divided by each intensity of laser energy and profile of laser sheet beam. Inhomogeneous fluorescence images scaled with the reference data, which was taken by a calibration process, were converted to air excess ratio distribution. This investigation showed instantaneous quantitative measurement of planar air excess ratio distribution for gaseous fuel.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.1
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• pp.55-62
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• 2004

This paper addresses the method for figuring out the hole diameter on the mask containing the information about machining depth. With this mask e micro machining is carried out with a simple 2D movement of the mask. Based on e suggested method excimer laser ablation processes are modeled and determination of the optimal laser ablation conditions such as hole diameter, step size, mask movement velocity, etc. is completed. The excimer laser ablation simulation for creating 3D micro lens is carried out by employing determined ablation conditions to prove verification of the method. The results from simulation illustrated the average error of 140nm and e relative error of 2％.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.423-427
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• 2003

In this paper, we have investigated the output characteristics of the Stokes Raman laser in hydrogen, deuterium, and their mixed gases as a function of the incident pump energy and gas pressure using KrF excimer laser as pumping source for generating the differential absorption lidar (DIAL) wavelengths suitable in measuring the ozone concentration of the troposphere. The optimization results of compact excimer-Raman laser transmitter in DIAL system for the tropospheric ozone sounding at the 292 nm/319 m and 292 nm/313 nm wavelength pairs are presented. for the ozone sounding in the 4-12 km range, it has been demonstrated that the design of transmitter for DIAL lidar may be significantly simplified by the use of 292 nm/319 nm wavelength pair. The investigations of Raman scattering in the mixture of hydrogen and deuterium gases have shown that such mixture may be efficiently used for developing the multi- wavelength light sources for DIAL systems.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1627-1629
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• 1997

엑시머 레미저를 이용한 다결정 실리콘막과 게이트 절연막 사이의 계면 거칠기를 개선하기 위해 변형핀 방법의 레이저 어닐링으로 다결정 실리콘 박막 트랜지스터를 제작하였다. SEM(scanning electron microscope)으로 활성층과 게이트 절연층과의 표면 이미지를 관찰한 결과 기존의 레이저 어닐링 결정화에 의한 것보다 계면 거칠기 정도가 상당히 줄었음을 관찰 하였다. 이렇게 개선된 계면 거칠기가 다결정 박막 트랜 지스터의 성능에 미치는 효과를 분석하기 위해 기존의 방법으로 제작된 소자와 계면 거칠기를 줄인 소자의 여러 가지 전기적 변수들(문턱 전압 기울기, 문턱 전압, 누설 전류)을 비교해 보았다. 우리는 또한 계면 거칠기와 다결정 박막 트랜지스터 소자의 상관 관계를 보기 위해 컴퓨터 시뮬레이션도 함께 병행하였다. 시뮬레이션을 통해 거친 계면 부근의 전계 집중 효과 같은 것으로 인해 소자의 성능이 저하된다는 것을 알 수 있었다.

• Journal of Energy Engineering
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• v.10 no.4
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• pp.379-386
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• 2001

This experimental study deals with on Nitric Oxide Formation & Reduction in Industrial Bunner. In this study, Laser-induced fluorescence (LIF) techniques have been used for quantitative measurements of Nitric Oxide. The NO A-X (0, 0) Vibrational band around 226 nm was excited using a XeCl excimer-pumped dye laser. And on-line excitation used $P_{21}+Q_1(14.5)/R_{12}+Q_2(20.5)/P_1(23.5)$ transition, for minimizing the other interferential effect. The measurements were taken NO concentration distribution in double swirling diffusion flame. In this swirl burner, NO concentration in downstream fo the flame decrease as primary/secondary air ratio increases.

• Journal of the Korean Vacuum Society
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• v.17 no.5
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• pp.455-460
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• 2008

In recent years, there has been highly interestedin pulsed laser deposition (PLD) method for fabrication of the organic thin films, as an alternative to conventional fabrication method such as vacuum evaporation and spin coating techniques. In this study, organic thin films of $Alq_3$ (aluminato-tris-8-hydroxyquinolate) and TPD for organic light emitting diodes (OLED) were deposited by PLD using KrF excimer ($\lambda$=278 nm) laser in nitrogen atmosphere. Deposited films were evaluated by photoluminescence(PL), Fourier-transform Infrared Spectroscopy (FT-IR) to study the effect of the laser and $N_2$ atmosphere parameters on the structural and optical properties.

• Journal of ILASS-Korea
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• v.12 no.4
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• pp.185-190
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• 2007

There is a growing interest to develop a new cleaning technology to overcome the disadvantages of wet cleaning technologies such as environmental pollution and the cleaning difficulty of contaminants on integrated circuits. Laser cleaning is a potential technology to remove various pollutants on a wafer surface. However, there is no fundamental data about cleaning efficiencies and cleaning mechanisms of contaminants on a wafer surface using a laser cleaning technology. Therefore, the cleaning characteristics of a wafer surface using an excimer laser were investigated in this study. Fingerprint consisting of inorganic and organic materials was chosen as a representative of pollutants and the effectiveness of a laser irradiation on a wafer cleaning has been investigated qualitatively and quantitatively. The results have shown that cleaning degree is proportional to the laser irradiation time and repetition rate, and quantitative analysis conducted by an image processing method also have shown the same trend. Furthermore, the cleaning efficiency of a wafer contaminated by fingerprint strongly depended on a photothermal cleaning mechanism and the species were removed in order of hydrophilic and hydrophobic contaminants by laser irradiation.

• Korean Journal of Optics and Photonics
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• v.3 no.2
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• pp.133-136
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• 1992

Calculation and comparison of the design parameter between Chang and Ernst profile that can be used for the uniform discharge in excimer or TEA $Co_2$ laser are carried out. This result can be used to establish the initial $\kappa$-value in the design of electron. Also, calculation shows that Ernst profile is 2-3 times superior to Chang profile in uniformity of electric field with respect to the same k-value ($0.001\le\kappa\le0.25$).

• Laser Solutions
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• v.8 no.2
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• pp.21-32
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• 2005

The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.