• Journal of the Korea institute for structural maintenance and inspection
• /
• v.12 no.3
• /
• pp.191-198
• /
• 2008

Pot life of two-component adhesives such as epoxy resin used in saturating FRP composite is defined as a certain time periods which can guarantee the bond performance and workability of epoxy resin. Therefore, adhesion procedure in strengthening RC members should be completed before chemical hardening is going on at job site. It has been known that there are two types of test method to evaluate the pot life of structural adhesive based on apparent viscosity or temperature change. This study is to verify the test methods how to assess pot life of structural adhesive for FRP composites by means of changing in apparent viscosity and means of exothermic reaction temperature proposed in existing test standards. Results of each test method were compared and analyzed, and reasonable test and evaluation method were suggested.

• Elastomers and Composites
• /
• v.43 no.1
• /
• pp.39-48
• /
• 2008

Peel strength of epoxy adhesives can be increased by adding some amounts of XNBR. In this case, thermal resistance of the adhesive will be decreased by decrease of glass transition temperature of the adhesive. Epoxy resin modified with siloxane-imide was synthesized to improve thermal resistance and peel strength of the adhesive, after that the properties of modified epoxy resin were compared with the commercial epoxy resin. When 5% XNBR was added to 30% modified epoxy resin, this adhesive showed 0.42 N/mm of peel strength and $155^{\circ}C$ of glass transition temperature. These properties are enough compared to the required properties by the industry, i.e., 0.3 N/mm and $150^{\circ}C$, respectively. Weight loss of the modified epoxy resin by the treatment of nitric acid and 0.1N NaOH was reduced, but weight gain by the humid condition was increased by the presence of benzene ring and imide ring. 30% modified epoxy resin blended with 5% XNBR showed 220% improvement in tensile strength and elongation compared to the case of common epoxy resin. This is due to the flexibility of the siloxane in the modified epoxy resin.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.11 no.5
• /
• pp.89-98
• /
• 2007

This study investigates the deformation behavior, related to debonding failure, of adhesion and repairing-strengthening materials of RC construction. A strain-stress curve shows that when the stress of specimens reached the highest and then fails, the strain value of cement mortar is $2.0{\times}10^{-3}$, while concrete was indicated at around $1.3{\times}10^{-3}$, epoxy resins are $0.8{\times}10^{-3}$, polymer mortar is $2.5{\times}10^{-3}$, steel plate is $2.5{\times}10^{-3}$, and carbon bar was $9.1{\times}10^{-3}$, respectively. For a thermal expansion coefficient with temperature variation, those basis materials, cement mortar and concrete, exhibited around $10{\mu}{\varepsilon}/{^{\circ}C}$, but adhesive materials, such as epoxy resins and polymer mortar, were $41{\sim}54{\mu}{\varepsilon}/{^{\circ}C}$ and $-0.5{\sim}0.7{\mu}{\varepsilon}/{^{\circ}C}$, respectively. In the case of steel plate is similar to basic materials but carbon fiber is indicates at $-1.7{\mu}{\varepsilon}/{^{\circ}C}$, which is the lowest value. Especially, between basic and adhesive materials, the thermal expansion coefficient was highly different. Although the coefficient depends on the type of epoxy resins, it is clear that the epoxy resins are susceptible to be debonded in nature, when the difference of environmental temperature varies more than $20{\sim}35{^{\circ}C}$.

• Journal of Adhesion and Interface
• /
• v.2 no.2
• /
• pp.35-47
• /
• 2001

• The Korean Journal of Rheology
• /
• v.8 no.2
• /
• pp.129-138
• /
• 1996

접착강도는 접착제의 점탄성을 반영한 온도·속도 의존성을 나타낸다는 것이 잘 알 려져있다. 특히 유리전이온도(Tg)에서의 역학적 완화기구가 접착층의 변형을 수반하는 접착 층의 변형을 수반하는 접착강도에 크게 영향을 미치고 있다. 또한 접착계의 모드I의 변형에 너지 해방율(GIC)를 측정할때에도 접착제의 변형과 파괴가 발생하기 접착제의 점탄성이 그 값에 어떠한 영향을 미치는 지에 흥미가 깊다. 본 연구에서는 2종류의 에폭시 수지를 블랜 드한 접착제를 이용하여 일정한 측정조건에서 인장 접착강도와 GIC의 상관관계에 대하여서 도 토론하였다.

• Journal of Conservation Science
• /
• v.26 no.1
• /
• pp.85-94
• /
• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Journal of Adhesion and Interface
• /
• v.21 no.2
• /
• pp.65-70
• /
• 2020

Epoxy adhesive was mainly used to combine different composite materials. Epoxy adhesive was a typical thermosetting resin that can be bonded by changing from a linear structure to a three-dimensional network structure by curing reaction of epoxy and hardener. The curing conditions of epoxy adhesive were different with different types of hardener such as mixing ratio, curing time, and temperature. These curing conditions affected to the adhesive property of epoxy adhesive. In industry, it was difficult to proceed the applying epoxy adhesive and combining two parts immediately. The adhesive property decreased by humidity and pre-curing of epoxy adhesive in waiting time between two processes. In this paper, the glass fiber reinforced composite (GFRC) was combined with epoxy adhesive and adhesion property between epoxy adhesive and GFRCs was evaluated using single lap shear test. The different waiting times and humidity conditions were applied to epoxy adhesive in room temperature and adhesive property decreased as the waiting time increased. In small amount of humidity, the adhesive property increased because a small amount of moisture in the surroundings accelerated the curing reaction. In certain amount of humidity, however, the adhesion property decreased.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2020.11a
• /
• pp.163-164
• /
• 2020

The purpose of this study was to evaluate the shrinkage properties of a tile reinforced with epoxy resin, which has the advantages of high adhesion and low shrinkage, and causes a hardening reaction by chemical bonding with cement mortar. As a result, since the epoxy resin adhesive suppresses the moisture evaporation of the mortar, the drying shrinkage of the mortar itself is reduced, accordingly, the shrinkage of the tile itself is greatly reduced, and it is thought that it is possible to prevent a decrease in adhesion due to shear stress.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2020.06a
• /
• pp.128-129
• /
• 2020

In this study, flexural strength and tile adhesion strength were evaluated by using a mortar, dry mortar and an epoxy resin reinforced mortar to examine the adhesion performance by reinforcing the epoxy resin adhesive. As a result, it was clearly confirmed that the effect of improving the adhesion strength by reinforcing the epoxy resin adhesive regardless of the type of tile, and in particular, when applying the epoxy resin adhesive to the porcelain and polishing tiles, it is judged that sufficient adhesion performance can be secured.

• Proceedings of the Korean Society of Fisheries Technology Conference
• /
• 2003.05a
• /
• pp.27-29
• /
• 2003

해양생명체인 홍합(mussel)은 접착단백질(adhesive protein)을 생산, 분비함으로써 홍합 자신을 바다 속의 바위와 같은 젖은 고체표면에 단단히 부착할 수 있도록 하여 강한 파도의 충격이나 바닷속의 부력 효과에 대하여도 저항할 수 있다. 홍합접착단백질은 현재 알려진 어떠한 화학합성 접착제보다도 강력한 자연적인 접착제로 알려져 있으며 대부분의 에폭시 수지보다 두 배 정도의 커다란 인장강도를 지니고 있으면서도 휘어질 수 있는 유연성을 가지고 있는 혁신적인 물질이므로 접착제 산업계에서 매우 커다란 관심을 끌고 있다. (중략)