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http://dx.doi.org/10.17702/jai.2020.21.2.65

Evaluation of Adhesion Property with Pot Life and Curing Humidity of GFRC and Epoxy Adhesive  

Yoo, Ji-Hoon (Department of Materials Science and Engineering, Gyeongsang National University)
Shin, Pyeong-Su (Department of Materials Engineering and Convergence Technology, Research Institute for Green Energy Convergence Technology, Gyeongsang National University)
Kim, Jong-Hyun (Department of Materials Engineering and Convergence Technology, Research Institute for Green Energy Convergence Technology, Gyeongsang National University)
Lee, Sang-Il (Institute of Offshore Wind Energy, Kunsan National University)
Park, Joung-Man (Department of Materials Science and Engineering, Gyeongsang National University)
Publication Information
Journal of Adhesion and Interface / v.21, no.2, 2020 , pp. 65-70 More about this Journal
Abstract
Epoxy adhesive was mainly used to combine different composite materials. Epoxy adhesive was a typical thermosetting resin that can be bonded by changing from a linear structure to a three-dimensional network structure by curing reaction of epoxy and hardener. The curing conditions of epoxy adhesive were different with different types of hardener such as mixing ratio, curing time, and temperature. These curing conditions affected to the adhesive property of epoxy adhesive. In industry, it was difficult to proceed the applying epoxy adhesive and combining two parts immediately. The adhesive property decreased by humidity and pre-curing of epoxy adhesive in waiting time between two processes. In this paper, the glass fiber reinforced composite (GFRC) was combined with epoxy adhesive and adhesion property between epoxy adhesive and GFRCs was evaluated using single lap shear test. The different waiting times and humidity conditions were applied to epoxy adhesive in room temperature and adhesive property decreased as the waiting time increased. In small amount of humidity, the adhesive property increased because a small amount of moisture in the surroundings accelerated the curing reaction. In certain amount of humidity, however, the adhesion property decreased.
Keywords
Adhesion property; Lap shear test; Curing condition; Pot life; Humidity;
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