1 |
R. N. Sampson and D. M. Mattox, ''Electronic Packaging and Interconnection Handbook", ed. by C. A Harper, Chapter 1 McGraw-Hill, New York, 1997
|
2 |
日立化成功菜株式會社, "다이싱 다이본드 시트", 일본특허 2005-303275 (2005)
|
3 |
E. J Vardaman, L. Matthew, ''New Developments in Stacked Die CSPs", Proceeding of HDP'04, 29 (2004)
|
4 |
H. B. Park, J. H. Kim, J. K. Kim and Y. M. Lee, "Morphology of a Poly(imide siloxane) Segmented Copolymer/Silica Hybrid Composite", Macromol. Chem. Rapid Commun., 9, 23 (2002)
|
5 |
F. Nobuyuki, Y. Masatoshi, O. Fumihiro, Y. Yasuharu, "Adhesive properties of siloxane modified polyimides and application for multi-layer printed circuit boards", Journal of Adhesion, 59, 281 (1996)
DOI
ScienceOn
|
6 |
H. T Li, H. R. Chuang, M. W. Wang and M. S. Lin, ''Synthesis, properties and pyrolysis of siloxaneand imide-modified epoxy resin cured with siloxane- containing dianhydride", Polymer Int. 54, 1416 (2005)
DOI
ScienceOn
|
7 |
S. W. Lee, W. S. Huh, J. Y. Kim, L. S. Park and J. R. Haw, "The Effect of Imide/Ester Composition on the Thermal Characteristics of Cured Poly (ester-imide)", J. Korean Ind. Eng. Chem., 14, 1121 (2003)
|
8 |
L. T. :Manzione, "Plastic Packaging of Microelectronic Devices", Chapter 1-2 Van Nostrand Reinhold, New York, 1990
|
9 |
C. Feger, H. Franke, "POLYIMIDES", ed. by M. K. Ghosh and K.L. Mittal, Chapter 24 Marcel Dekker, Inc., New York, 1996
|
10 |
J. Y. Moon, S.K Kim, C. B. lung, and J. M. Park, "Thermal stable adhesive and adhesive tape coated it", 한국특허 2005-0106148 (2005)
|
11 |
J. Seo, A. Lee, Y. I. Joe and H. Han, ''Water Sorption Behavior in High Performance Polyimde Thin Fims Based on p-Phenylene Diamine(p-PDA)", Journal of the Korean Institute of Chemical Engineers, 37, 459 (1999)
|
12 |
J. Wilde, Z. N. Cheng and G. Z. Wang, ''Influence of Packaging on the Solder Joint Reliability of Chip Scale Package Assemblies", 1999 International Symposium On Advanced Packaging Materials, 144(1999)
|