• Elastomers and Composites
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• v.41 no.3
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• pp.172-181
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• 2006

Flame retardant synergism of phyllite was studied in ABS resins containing brominated flame retardant(tetrabromobisphenol A(TBBA) or brominated epoxy oligomer(BEO)) and antimony trioxide($Sb_2O_3)$. Talc was used for the comparison purpose. ABS compounds were manufactured by a twin-screw co-rotating extruder and subsequently injection molded into several specimen for mechanical and thermal properties. Flame retardancy of ABS compounds measured by UL 94 vertical test with 1.6 mm thick bar specimen was enhanced by the replacement of antimony trioxide into phyllite or talc in the range of 12.5%(0.5 wt%) to 37.5%(1.5 wt%). Phyllite showed better synergistic effect comparing with talc especially for BEO. Only phyllite enhanced the flowability of ABS compounds. Notched Izod impact strength decreased with the proportion of phyllite or talc content. Phyllite could replace the antimony trioxide up to the content of 25%(1 wt%) to give better flame retardancy and flowability without darkening problem.

• Environmental Analysis Health and Toxicology
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• v.23 no.4
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• pp.291-299
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• 2008

Bisphenol A diglycidyl ether(BADGE)는 비스페놀 A와 에피클로로하이드린의 축합에 의해 만들어지는 물질로 상업용 액상 에폭시 수지의 주성분이다. 본 연구는 clusterin mRNA 발현이 BADGE의 노출된 생식기계 독성에 연관되어 있는지를 연구하기 위해 수행하였다. BADGE는 SPF Sprague-Dawley 임신 랏트에 임신 6일부터 수유기가지 하루에 한 번 0(대조군)과 375mg/kg/day를 경구 투여하였다. 수컷 새끼는 일반 사항과 몸무게, 일반 발달 지표(예, 항문과 생식기 사이의 거리, 이개개전, 절치붕출, 유두잔류, 안검개열, 고환하강, 포피박리 등)등을 관찰하였다. 대조군과 투여군에서 다섯 마리의 수컷 새끼는 출생 후 3, 6와 9주에 부검하여 부고환의 조직학적 변화 등을 관찰하였다. BADGE 375 mg/kg/day 투여군에서 항문과 생식기 사이의 거리는 대조군보다 길어지는 경향을 보였다. 출생 후 6주와 9주에서 부고환의 상대 무게는 대조군보다 약간 증가하였으나 조직학적인 변화는 관찰되지 않았다. BADGE 투여 군에서 clusterin mRNA 발현량은 대조군에 비해 3주에 56%, 6주에 57% 그리고 9주에 86% 감소하였다. 이런 결과는 랏트의 부고환에서 clusterin은 BADGE에 반응하는 유전자 중 하나일 수 있다는 가능성을 나타낸다.

• Magazine of the Korean Society of Agricultural Engineers
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• v.24 no.3
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• pp.92-99
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• 1982

The objective of this study was to investigate the compressive and bending strength characteristics of epoxy resin mortar, which is still in an early stage of its use and study in Korea. The results obtained are summarized as follows; 1. The compressive strengths of epoxy resin mortar after 1 day, 2 days and 3 days were gained 87%, 91% and 95%, respectively, in view of that of mortar at the age of 7 days. This result showed that the initial compressive strength within 1 day was very high. 2. The highest compressive strength of epoxy resin mortar was 914 kg/cm2 at the point of having the mixing ratio of one to two. It reached up to 3.7 times that of the normal portland cement mortar at the age of 28 days. 3. The bending strengths of epoxy resin mortar after 1 day, 2 days and 3 days came up to 88%, 93% and 97%, respectively, in comparing that of mortar at the age of 7 days. It was expressed to be simielar to the tendency of compressive strength. 4. The highest bending strength of epoxy resin mortar was 384 kg/cm2 at mixing ratio of one to two. It came up to as much as 6.5 times in comparing with that of the normal portland cement mortar at the age of 28 days. Therefore, the epoxy resin mortar would be effective for promoting the bending strength of structural members. 5. The regression equation between compressive and bending strength was obtained as follows; oo~=0.391 oc+27.54 (r=0.99) And the estimated value of bending strength was corresponded to about 44 per cent in comparing with that of the compressive strength.

• Polymer(Korea)
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• v.24 no.3
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• pp.350-357
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• 2000

Curing behaviors of glass/epoxy prepreg for printed circuit boards (PCB) were studied by using dielectrometer and differential scanning calorimeter. This prepreg was showed the lowest ionic viscosity at about 115$^{\circ}C$, and then the ionic viscosity was gradully increased up to 15$0^{\circ}C$. This indicated that the curing reaction of this prepreg started at 115$^{\circ}C$ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan $\delta$ values were also measured and discussed. The dielectric behaviors of this prepreg system were also measured according to the cure cycle for PCB. This material was found to be thermally stable up to about 30$0^{\circ}C$ and then was showed an abrupt decomposition beyond this temperature.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.215-222
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• 1993

Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.

• Journal of Radiation Industry
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• v.9 no.1
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• pp.9-13
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• 2015

Epoxy resin is widely used as aerospace, automobile, construction and electronics due to their good mechanical and electrical properties and environmental advantages. However, the inherent flammability of epoxy resin has limited its application in some field where good flame retardancy is required. Nano clay can enhance the properties of polymers such as flames retardancy and thermal stability. In this study, we have investigated the nanoclay filled epoxy composite, which has good flame retardancy while maintaining high mechanical properties. The cured epoxy resins were obtained using an electron beam curing process. The nano clays were dispersed in epoxy acrylate solution and mechanically stirred. The prepared mixtures were irradiated using an electron beam accelerator. The composites were characterized by gel content and thermal/mechanical properties. Moreover, the flammability of the composite was evaluated by limited oxygen index (LOI). The flame retardancy of nano clay filled epoxy composite was evidently improved.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.33-39
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• 2010

The moisture absorption properties such as diffusion coefficient and moisture content ratio of liquid type epoxy resin systems with the filler were investigated. Bisphenol A type and Bisphenol F type epoxy resin, Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these liquid type epoxy encapsulant according to the change of filler size. The temperature of glass transition (Tg) of these epoxy resin systems was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these epoxy resin systems according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these systems were calculated in terms of modified Crank equation based on Ficks' law. An increase of Tg and diffusion coefficient with filler size in these systems can be observed, which are attributed to the increase of free volume with Tg. The change of maximum moisture absorption ratio according to the filler size and filler content cannot be observed; however, the diffusion coefficients of these systems decreased with filler content. The diffusion via free volume is dominant in the epoxy resin systems with low nano-sized filler content; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the liquid type epoxy encapsulant with high nano-sized filler content.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.68-73
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• 2019

We prepared hydrophobic silica particles by a sol-gel process from tetraethyl orthosilicate (TEOS), followed by coupling the reaction with octyltrimethoxysilane (OTMS) or hexadecyltrimethoxysilane (HDTMS) under various reaction conditions. We confirmed the extent of silica surface modification with organic compounds by SEM-EDS, thermogravimetry and elemental analysis. The silica particles obtained after the hydrolysis reaction of TEOS in ethanol at $50^{\circ}C$ for 24 h and the coupling reaction with OTMS for 2 h at the same temperature displayed the optimum performance in terms of the dispersity in an organic solvent and the surface roughness of films composited with epoxy resins. The oxygen permeability of the composite film with modified-silica was 12% lower than that of using the film without modified-silica.

• Journal of the Korea Institute of Building Construction
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• v.18 no.6
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• pp.569-576
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• 2018

In modern society, a huge number of the buildings have been constructed with RC structure. RC structures have many structural instabilities due to earthquake, typhoon, construction fault, design phase errors. Therefore, many reinforcement methods are being implemented to solve this problem. In the reinforcement method, the organic epoxy adhesive used in the FRP reinforcing method is abruptly damaged when exposed to high temperature, which is directly connected to the fall of the reinforcing material. Therefore, the present study was conducted to develop inorganic refractory mortar with a certain level of adhesion ability to reduce the heat transferred to FRP reinforcement when exposed to high temperatures. As a result of the test, it showed high adhesion strength at room temperature condition with the inclusion of EVA resin, and showed no performance deterioration up to about $300^{\circ}C$ even under heating conditions. Also, it was confirmed that the backside temperature was lower as the thickness increased, and converged to a constant temperature of about $780^{\circ}C$ after 2 hours of heating.

• Textile Coloration and Finishing
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• v.33 no.2
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• pp.79-86
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• 2021

This study investigated the effect of a pigment (C. I. Pigment Red 122) addition on mechanical properties of the epoxy resin, diglycidyl ether of bisphenol F (DGEBF) and G640 curing agent. The K/S value, thermal properties, tensile properties, and fracture toughness of the prepared epoxy samples were evaluated. When the pigment was added to the DGEBF/G640 epoxy system, the color of the epoxy resin changed to red from transparent and yellowish color, and the K/S value in the red region increased as the pigment content increased. When the pigment content was increased up to 0.1 phr, the tensile strength was improved up to 21.8 %, whereas the pigment content was over 0.1 phr, the tensile strength decreased. The fracture toughness was improves up to 23.1 % until the amount of pigment added was up to 0.2 phr, and then decreased when the amount of the pigment added was more than 0.2 phr. This attributed to the aggregation of the pigments in the epoxy resin when the amount of the pigment added was more than 0.2 phr. Therefore, the coloration of the epoxy resin with an organic pigment must be carried out very carefully because the coloration of epoxy resin affects its mechanical properties.