• Clean Technology
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• v.12 no.1
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• pp.27-35
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• 2006

Main compositions of powder paint based on thermoset type epoxy resin consist of epoxy resin for powder coating, curing agent, filler and pigment. The curing system used in this study was based on diglycidyl ether of bisphenol-A (DGEBA) and dicyan diamide (DICY). The curing behavior and rheological properties of powder coating material were investigated using DSC and rheometer, respectively. And the adhesion strength between steel and powder coating material was measured using lap shear geometry. The optimum formulation of epoxy powder paint obtained from this study was base resin of 100 phr, DICY of 6 phr, $CaCO_3$ of 20 phr, and $TiO_2$ of 10 phr.

• Analytical Science and Technology
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• v.24 no.5
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• pp.336-344
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• 2011

The study attempted to find out any effect to prevent photo aging of epoxy resin used for conservation by way of adding UV stabilizer, one of plastic additives. Specimens were made by adding HALS and UVA UV stabilizer as each concentration to 3 kinds of epoxy resin, which are most frequently used for artifacts joining and restoration process, and aging effects were investigated through Color change, SEM, contact angle, FTIR analysis during UV aging experiments. Last, usage suitability was checked when UV stabilizer was added through Universal Tensile strength tester. In result, it is impossible to prevent decomposition of chemical structure in spite of adding UV stabilizer but in the case of epoxy A and R, it is believed that photo aging such as yellowing or crack can be minimized without giving a big influence to adhesive strength of epoxy resin through adding less than 0.1% of UVA. It is expected that above will solve photo aging problem of epoxy resin used for joining and restoration of artifacts and will extend its life as joining and restoration materials.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Journal of the Korean Applied Science and Technology
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• v.31 no.3
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• pp.486-491
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• 2014

We have been fabricated Thin-walled carbon nanotubes (TWNTs)/amine epoxy additives composite using Eco-friendly solvent system such as supercritical process and dry mixed process. TWNTs/amine epoxy additives composite has used as a curing agent for urethane based bisphenol A type epoxy resin. The thermo-mechanical property of the epoxy resin cured by TWNTs/amine epoxy additives composite is characterized by dynamic mechanical analysis(DMA) and dispersability of the nanotubes in the epoxy matrix is also confirmed by scanning electron microscope(SEM). As a results, the epoxy resin cured by TWNTs/amine epoxy additives composite with supercritical process shows enhanced dispersability of the TWNTs in the matrix and thermo-mechanical property when compare to dry mixed process.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.144.2-144.2
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• 2010

Bipolar plate는 고분자 전해질 연료전지(PEMFC)에서 핵심 부품 중의 하나이고, 전해질 막이나 촉매 등에 비해서는 상대적으로 쉽게 접근할 수 있기 때문에 많은 연구가 수행되고 있다. Bipolar plate를 제조하는 기술은 크게 금속을 프레스 가공하는 방법, graphite 판을 직접 밀링하는 방법 및 고분자/카본계의 press molding 법 등 3가지로 분류되며, 본 연구에서는 3번째 방법에 의해서 bipolar plate를 대량 생산하는 방법에 대해 연구하였다. 고분자 매트릭스는 에폭시계 수지를 사용하였고, 카본계 재료는 graphite 분말과 carbon nanotube를 사용하였다. 이들 재료들을 일정한 비율로 혼합한 후 differential scanning calorimetry(DSC)를 사용하여 열분석 하였고, 그 결과를 Kissinger equation에 대입하여 경화반응 속도론을 연구하였다. 또한, 경화된 에폭시/탄소 복합재료의 전기전도도, 유리전이온도, 표면에너지 특성 등을 분석하였다.

• Applied Chemistry for Engineering
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• v.1 no.2
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• pp.124-132
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• 1990

In order to improve the mechanical properties and fracture toughness of HPT 1071/DDS system, poly(aryl etherimide) (PEI) was incorporated in the resin system. In HPT 1071/DDS system, mechanical properties of cured epoxy resins were not strongly dependent on the concentration of DDS curing agent strongly. In the case of HPT 1071/DDS/PEI system, the fracture toughness and flexural properties of epoxy resins increased with increasing the concentration of PEI. SEM micrographs of cured epoxy resin indicated that the phase separation occured at the low concentration of PEI in this system. In addition, investigation of the relationship between mechanical properties and the morphology of modified epoxy resin was undertaken in HPT 1071/DDS/PEI system.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.05a
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• pp.279-282
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• 2012

This study attempted to the effect on the physical performance of silane coupling agent on solventless epoxy-based concrete surface finishing material for parking floor. Tests were carried out in accordance with KS F 4041 and KS F 4937. The results of compressive strength, flexural compressive are 95.6N/㎟, 25.4N/㎟ and after wheel moving load testing, average abrasive depth is 0.96mm, these results satisfied the quality standard of KS F 4041, KS F 4937. As conclusion, this study confirmed that the silane coupling agent greatly effected on the physical performance of solventless epoxy resin.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.168-173
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• 2010

Flame retardant halogen containing compounds have been replaced as environmentally safe material which does not contain hazardous materials generating toxic gas. Self-extinguishing epoxy resin compositions have been studied in order to produce eco-friendly epoxy molding compound, which is used as insulating materials in semiconductor. We developed self-extinguishing epoxy resin compositions which do not contain halogen compounds with new epoxy resin (E3). The new epoxy molding compound (EMC-1) showed high flame resistance (UL-V0) and high thermal resistance ($451.9^{\circ}C$ at 5 wt% loss) enough to use as eco-friendly material.

• Journal of ILASS-Korea
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• v.12 no.3
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• pp.138-145
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• 2007

In the present work, the breakup mechanism of highly viscous epoxy paints discharged from a fan spray nozzle was examined experimentally. The paints tested were non-Newtonian fluids, composed of epoxy resin, solid particles and other additives. The paint spray discharged from the nozzle was visualized and recorded using a digital camera with back illumination. Due to presence of the solid particles, perforation of liquid sheet was observed in most cases, even at low-Reynolds number conditions (Re < 15,000) where the aerodynamic-wave breakup mode is used to be dominant for pure liquids. However, with the increase of the particle concentration, the sheet became longer and the thickness at breakup became thinner to some extent. This is because, with higher concentration of solid particles, the stabilizing effect by the viscosity increase predominates over the destabilizing effect by perforation.