• Food Science and Preservation
• /
• v.15 no.4
• /
• pp.556-561
• /
• 2008

This study was carried out to identify the cause of benzo(a)pyrene[B(a)P] production during the manufacture of sesame oil and perilla oil, and to minimize such B(a)P synthesis. The distribution of B(a)P in sesame seed and perilla seed differed with seed-growing district, the range was $0.06{\sim}0.31{\mu}g/kg$ in domestic seed and $0.12{\sim}0.47{\mu}g/kg$ in imported seed. B(a)P contents after roasting at $220^{\circ}C$ for 20 min in sesame seed and perilla seed were $1.87{\sim}2.47{\mu}g/kg$ and $2.12{\sim}2.43{\mu}g/kg$, respectively, and levels in oils obtained from the roasted seeds were $3.68{\mu}g/kg$ and $4.64{\mu}g/kg$, respectively. These data refer to seeds subjected to codsed roasting. With open roasting, the levels were $0.63{\mu}g/kg$ and $0.56{\mu}g/kg$, respectively. Closed roasting resulted in absorption of B(a)P, with consequent high levels in oils. We introduced forced ventilation during closed roasting. We tested various methods to remove B(a)P from sesame oil and perilla oil. Neither centrifugation nor filtering with diatomite and diatomiteactive carbon removed B(a)P. A filtering method using active carbon was effective. But this method adversely affected the color and flavor of sesame oil and perilla oil.

• Korean Chemical Engineering Research
• /
• v.55 no.6
• /
• pp.816-821
• /
• 2017

An integrated slow mixing/sedimentation and net fit fiber filtration system has been developed to reduce the high concentrations of suspended solid (SS) and total phosphorus (T-P) in the reject water from sewage/wastewater. A filtration device used in this experiment consists of coagulation, in-line mixing, air injection, slow mixing/sedimentation, and filtration processes. The performance test using this device was carried out with six operational modes for reject water from sewage treatment plant. Experimental conditions used were 16.7, 33.3, 41.7 and 50.0 ton/day of flow rate and 2~4 of Al/P molar ratio. By injection of coagulant in each operational mode, the high removal efficiencies of SS and T-P were obtained, but continuous operation time was decreased to 7.8~11.4 min in most modes. However, when the Mode 5 of the developed filtration device was applied, the continuous operation time was maintained up to 88.2 min. Also, it was found that the continuous operation time in the Mode 5 using the developed system was increased from 8 to 11.3 times longer than those in other modes. Backwashing flow rate was also very low at 5.4% of total filtered water. Therefore, it can be concluded that the Mode 5 of the developed filtration system was the most efficient treatment method for the removal of high concentrations of SS and T-P.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.98-104
• /
• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.177-180
• /
• 2003

초 박형 실리콘 칩을 이용하여 실리콘 칩들을 포함한 모듈 전체가 굽힘이 자유로운 유연 패키징 기술을 구현하였으며 bending test와 FEA를 통해 초 박형 실리콘 칩의 기계적 특성을 살펴보았다. 초 박형 실리콘칩$(t<30{\mu}m)$은 표면손상의 가능성을 배제하기 위해 화학적 thinning 방법을 이용하여 제작되었으며 열압착 방식에 의해 $Kapton^{(R)}$에 바로 실장 되었다. 실리콘칩과 $Kapton^{(R)}$ 기판간의 단차가 적기 때문에 전기도금 방식으로 전기적 결선을 이룰 수 있었다. 이러한 방식의 패키징은 이러한 공정은 flip chip 공정에 비해 공정 간단하고 wire 본딩과 달리 표면 단차 적다. 따라서 연성회로 기관을 비롯한 인쇄회로기판의 표면뿐만 아니라 기판 자체에 삽임이 가능하여 패키징 밀도 증가를 기대할 수 있으며 실질적인 실장 가능면적을 극대화 할 수 있다.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.19 no.3
• /
• pp.407-413
• /
• 2010

This paper reports on the research which analyzes acoustic signals acquired in progressive compressing, hole blanking, and burr compacting process. An acoustic sensor was set on the bed of hydraulic press. Acoustic signal is generated from progressive stamping process. First the signal acquired from the unit process; compressing, blanking or compacting, is studied by Fourier Transform and Short Time Fourier Transform. The blanking process emitted ultrasonic signal with more than 20kHz, but the compressing and compacting processes emitted acoustic signals with lower than 10kHz. The combined signals periodically acquired right after the tool grinding were then analyzed. 70-80kHz signals appeared in time-frequency domain, but not in the frequency domain, the magnitude of which was related to the tool wear. Short Time Fourier Transform made up for the Fourier Transform in analyzing the emitted signal for stamping process in the ultrasonic domain.

• Journal of Life Science
• /
• v.19 no.4
• /
• pp.486-491
• /
• 2009

This study was conducted to investigate microbial distribution in the processing steps and to estimate quality index and shelf life of packaged Tofu (soybean curd). Sanitation and safety of Tofu were analysed in aspects of total viable counts (TVCs) and coliforms. Organoleptic deterioration was observed from some packaged Tofu when their TVCs were over $10^6\;CFU/g$. The controlled simply packaged Tofu and sterilized Tofu with TVCs of under $10^5\;CFU/g$ were 32.0% and 86.9% of the total samples, respectively. Also, the controlled simply packaged Tofu and sterilized Tofu with negative coliforms were 12.0% and 83.7% of the total samples, respectively. TVCs and coliforms increased in some processing steps, which include washing and soaking of raw soybeans, and formation and 1st cooling of packaged Tofu. Increases of TVCs and coliforms in the washing and soaking step were due to contamination from the soaking tank and airborne bacteria, whereas increases of TVCs and coliforms in the grinding step were due to contaminations from the grinder, line and reserving tank. TVCs and coliforms increased in the formation and 1st cooling step of packaged Tofu due to contaminations from filter wools, trays, employee's hands, cooling water, formed products and filter wools.

• Composites Research
• /
• v.18 no.4
• /
• pp.35-43
• /
• 2005

In resin transfer molding(RTM), race-track effects and non-uniform fiber volume fraction may cause undesirable resin flow patterns and thus result in dry spots, which affect the mechanical properties of the finished parts. In this study, a real time RTM control strategy to reduce these unfavorable effects is proposed. This control rule is accomplished by means of the permeability mapping and pressure regulation. Through numerical simulations, the validity of the proposed scheme is demonstrated.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.4
• /
• pp.61-66
• /
• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Proceedings of the Korean Institute of Resources Recycling Conference
• /
• 2005.10a
• /
• pp.97-106
• /
• 2005

현재 우리나라에서만 연간 약 26만들이 발생되고 있는 농업용 폐비닐은 재생원료로 재활용되어지면 국내외에서 그 용도가 매우 많으나 멀칭용으로 사용되었던 폐비닐은 그 오염도가 워낙 심하여 쉽게 재활용할 수 없는 처지이다. 즉 공급과 수요는 많으나 재생기술의 한계가 병목으로 작용하고 있는 현실이다. 따라서 간단하고 경제적인 방법으로 재활용할 수 있는 습식 및 건식 재생기술의 개발이 계속되어 요구되어 왔다. 강제 세척, 회전분리, 열풍 건조 및 압착성형을 이용한 새로운 간이습식공정을 통하여 멀칭용 농업용 폐비닐을 순도 95% 이상의 탄화 및 열화가 적은 압착 펠렛을 경제적으로 제조할 수 있었다. 이들의 재생 수지는 인장강도 $168.6{\pm}3.9kgf/cm^2$, 파단신을 315.8%, 인장탄성을 $2,551.8{\pm}50.1kgf/cm^2$, 굴곡강도와 굴곡탄성을 $166.7{\pm}7.4kgf/cm^2,\;5,716.2{\pm}242.2kgf/cm^2$ 그리고 충격강도는 $49.2kgf\;cm/cm$을 각각 보여 연질수지로써 기능하기 위한 충분한 성능을 보유하고 있음을 알 수 있었다. 또한 이들의 응용분야 확대를 위하여 fly ash 및 탄산칼슘을 배합하여 이들의 물성변화를 살폈다.

• Proceedings of the KWS Conference
• /
• 2010.05a
• /
• pp.81-81
• /
• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.