• Title/Summary/Keyword: 압착고

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A study on waveforms with press conditions of Harness terminal (단자(Terminal) 압착조건에 따른 파형의 고찰)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04b
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    • pp.172-175
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    • 2000
  • The crimping connection is a permanent connection that maintains mechanical and electrical property for a long time by crimping two conductors. In this paper, we have done a basic study to decide normal or abnormal condition depending on crimping. Using PZT piezo-sensor, we have analyzed crimping waveforms according to the crimping height. And hence the normal or abnormal condition of crimping connections in real time could be decided by comparison of crimping waveforms in the cases of normal crimping, over crimping, under crimping and core omitting.

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A study and analysis of waveforms with press conditions of terminal (단자(Terminal) 압착 조건에 따른 파형의 고찰 및 분석)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.05b
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    • pp.65-69
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    • 2000
  • The crimping connection is a permanent connection that maintains mechanical and electrical property for a long time by crimping two conductors. In this paper, we have done a basic study to make a decision the normal or abnormal condition depending on crimping. By using PZT piezo-sensor, we have compared and analyzed crimping waveforms of abnormal conditions(core ommiting, cover biting) at the normal crimping height. And hence the normal or abnormal condition of crimping connections in real time could be determined by comparison of crimping waveforms in the cases of normal crimping, core omitting and cover biting.

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고온압착 건조 처리시 표면처리를 통한 고강도 라이너지 개발

  • 최병수;윤혜정;류정용;신종호;송봉근
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2000.11a
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    • pp.63-63
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    • 2000
  • 저급의 고지 원료를 두께 방향으로 고온 압착을 가하여 건조함으로써 전반적인 종이 물성 을 향상시키는 콘디벨트 건조 방식은 70년대 중반부터 80년대에 이르는 10여년에 걸친 개발 과정을 거쳤으며 90년대에 들어서 핀랜드의 Inkeroinen에 위치한 V alemt- Tarnpella의 연구 소에 최초의 파일로트 설비가 설치되었으며 그 후 1996년에는 핀랜드 ENSO사의 P Pank밟oski 판지공장에 설치됨으로써 세계 최초의 상업생산설비를 이루게 되었다. 기존의 실린더 건조 기술과 비교할 때 콘디벨트 건조방식은 건조속도를 약 5-15배 향상시킬 수 있 으며, 건조 에너지 절감에 큰 효과가 있을 뿐만 아니라 기존의 실린더 건조시 종이가 폭방 향으로 수축되 어 인장 stiffness와 압축 강도 동의 종이 물성 이 저 하되 는 반면 습윤상태 의 섬유를 120도씨이상에서 가열에 의해 리그닌을 연화시킴과 동시에 섬유의 유연성을 증가시켜 준다. 그리고 높은 압력을 가해줌으로써 섬유간의 결합 면적을 증가시키고 건조시 종이의 폭방향의 수축을 감소시켜 인장강도, 내부결합강도, 밀도, 표면평활성, 투기저항성 등 종이의 물성을 대폭 향상시켜주는 혁신적인 제지기술로 인정받고 있으며 국내의 경우 현재 1998년 부터 상업생산을 이루어짐으로써 그 공헌도는 매우 크다고 할 수 있다. 골판지의 주원료가 되는 국산 골판지 고지 (Korean old corrugated container, K KOCC)의 거듭된 재생처리로 인하여 미세분의 함량이 전체 지료의 절반 이상에 달할 뿐만 아니라, 섬유가 각질화와 단섬유화로 인하여 고온압착 건조처리 만으로는 골판지 고지로 생 산된 원지의 강도를 버진펄프로 생산된 원지가 가지는 강도에 준하는 강도로 향상시키는데 한계점을 가지게 된다. 유럽의 제지선진국들은 골판지 원지의 강도를 향상시키는 방편으로 표변에 전분 사이즈 프레스 처리를 도입하였으며 본 연구에서는 고온 압착 건조 처리 설비를 활용한 전분 표면처리의 가능성을 검토하고 골판지 원지의 강도를 향상시키기 위한 표면처리조건을 탐색하였다.

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A variation of tensile force with the terminal height (단자(Terminal) 압착고에 따른 인장력 변화에 대한 고찰)

  • Shin, Young-Lok;Yang, Yun-Suk;Kim, Chul-Han;SaGong, Geon
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1690-1692
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    • 2000
  • The principle of crimping connection is to produce a compressive connection force between terminal and cores(wire conductor). Compressive connection force is produced by pushing each other on that stress(crimping force) of barrel by restored elastic strain after plastic deformation and the expansion force of cores' elastic stress. And resistance and tension force between terminal and cores are determined according to the condition of compressive connection force. In this study, we've found out that the adaptive height which has maximum tensile force by measuring a tensile force with a height of terminal.

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A study on the Thermal Filter Press for the Reduction of Pigment Sludge (안료 슬러지 감량화(減量化)를 위한 열필터프레스 기술(技術)에 관한 연구(硏究))

  • Lee, Jung-Eun;Lee, Jae-Keun
    • Resources Recycling
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    • v.18 no.3
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    • pp.55-61
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    • 2009
  • Dewatering process to remove water from pigment sludge was important in the diverse aspects of the improvement of product quality, curtailment of the drying cost and the transportation. It was difficult to dewater pigment particles with the mechanical forces because the size was fine under $5{\mu}m$. Thermal filter press dewatering equipment composed of squeezing plate and a fixed heating plate was developed to improve the dewaterability of pigment the sludge as supplying the heat from the fixed heating plate to the cake. Several tests that estimate the dewaterability for pigment sludge as with or without squeezing process and the difference of dewatering time was conducted with this equipment. Dewaterability of thermal dewatering under squeezing process was increased about 20% compared with non squeezing process. Under squeezing process, thermal dewatering tests changing dewatering time with 70 and 80 minute were conducted respectively. The water content of cake was more reduced at dewatering time of 80 minute compared with 70 minute, and dewatering velocity was also decreased, which caused the productivity of thermal filter press to drop. It was observed that clogging of filter cloth didn't almost occur because the liquid was discharged from cake layer easily. In this research, it was resulted that the squeezing process and long dewatering time were effective to improve the dewaterability of pigment sludge. So, this thermal filter press equipment was useful for dewatering the fine particle sludge like pigment.

일본의 고에너지 속도가공 기술과 연구동향

  • 근안수명
    • Journal of the KSME
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    • v.31 no.4
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    • pp.380-388
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    • 1991
  • 고에너지 속도 가공법 중에서 주요한 것을 발췌하여 그 개요와 금후의 전개에 대하여 기술하 였다. 폭발압착과 같이 실제로 활용되고 있는 기술로부터, 폭약 또는 전자기력에 의한 분말압축 성형과 같은 개발도상의 기술까지 고에너지 속도가공법의 범주에 속하는 기술분야는 광범위하다. 관용의 가공법에 비하면 역사도 짧고, 실용화에 있어서 해결하여야 할 문제도 많이 남아있다. 현재 실용화를 위한 연구도 착실히 성과를 얻고 있으며, 고에너지 속도 가공법의 앞날은 밝다고 할 수 있다. 고에너지 속도가공의 진보와 발전을 위하여는 가공기술에 관한 연구와 함께, 재료가 고속변형을 받을 때의 거동과 특성에 관한 연구를 함께 진행할 필요가 있다. 여기서는 후자의 연구에 관하여 언급하지 않았으나, 고속재료 시험법과 그 평가법, 소성도 전파 해석, 계측법 등 많은 연구 성과가 매년 보고되고 있다.

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Properties of High Power Flip Chip LED Package with Bonding Materials (접합 소재에 따른 고출력 플립칩 LED 패키지 특성 연구)

  • Lee, Tae-Young;Kim, Mi-Song;Ko, Eun-Soo;Choi, Jong-Hyun;Jang, Myoung-Gi;Kim, Mok-Soon;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.1
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    • pp.1-6
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    • 2014
  • Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

고농도 Out Gas 정량 분석법 개발

  • Kim, Min-Ju;Kim, Jong-Yun;Jeong, Gi-Ho;Park, Chang-Sik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.13-13
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    • 2009
  • 본 연구는 MLCC 구성성분의 증발/비등에 의한 저분자물질의 제거가 bar 수축에 미치는 영향도를 평가하기 위해, 압착 bar에서 발생하는 고농도의 out gas를 정량하기 위한 최적 system을 구축하고자 하였다. gas 포집에 범용적으로 사용하는 Purge & Trap sampler 대신 Heating block를 사용하여 gas를 발생시키고 동시에 solvent에 용해시킴으로써 고농도의 시료가 희석될 수 있는 전처리 장치를 디자인하였다. 그 결과 고농도 gas 주입에 의한 장비오염과 peak saturation 문제가 해결되었고, gas phase의 시료를 liquid phase로 상전이 시켜 autosampler를 이용한 정확한 량의 시료 주입이 가능하였다. System의 Gage Linearity와 Bias는 각각 1.7%와 1.3%로 개선이 필요없는 수준의 정확도를 가졌다.

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Probabilistic Calibration of Computer Model and Application to Reliability Analysis of Elasto-Plastic Insertion Problem (컴퓨터모델의 확률적 보정 및 탄소성 압착문제의 신뢰도분석 응용)

  • Yoo, Min Young;Choi, Joo Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.9
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    • pp.1133-1140
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    • 2013
  • A computer model is a useful tool that provides solution via physical modeling instead of expensive testing. In reality, however, it often does not agree with the experimental data owing to simplifying assumption and unknown or uncertain input parameters. In this study, a Bayesian approach is proposed to calibrate the computer model in a probabilistic manner using the measured data. The elasto-plastic analysis of a pyrotechnically actuated device (PAD) is employed to demonstrate this approach, which is a component that delivers high power in remote environments by the combustion of a self-contained energy source. A simple mathematical model that quickly evaluates the performance is developed. Unknown input parameters are calibrated conditional on the experimental data using the Markov Chain Monte Carlo algorithm, which is a modern computational statistics method. Finally, the results are applied to determine the reliability of the PAD.

Effect of Thermal Pressing Temperature on the Mechanical and Material Properties of Electro-spun Polyacrylonitrile Nano-fibrous Separator (열압착 온도가 전기방사 Polyacrylonitrile 분리막의 기계적 강도 및 물성치에 미치는 영향)

  • Kim, Minchoel;Ko, Tae Jo;Arifeen, Waqas Ul;Dong, Ting
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.4
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    • pp.109-116
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    • 2019
  • The mechanical deformation of a battery separator causes internal short-circuiting of the cathode - anode, which directly affects the explosion/ignition of batteries. To increase the mechanical properties of the separator fabricated by electro-spinning, use of a thermal pressing method is inevitable. Therefore, this research aims to maximize the mechanical strength of a porous separator by finding the proper thermal press temperatures given to Electro-spun Polyacrylonitrile (PAN) nanofibers. The different thermal press temperatures $25^{\circ}C$, $50^{\circ}C$, $75^{\circ}C$, and $100^{\circ}C$ were applied to the electro-spun fiber at 30 MPa pressure for one hour. The higher the temperature, the higher the resultant tensile strength; however, a higher temperature also lowered the strain and porosity. Thus, the membrane thermal pressed at $50^{\circ}C$ showed the best mechanical properties and the second highest porosity. Using the data, $50^{\circ}C$ was judged as the best thermal pressing temperature in terms of performance.