• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.861-864
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• 1997

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.3
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• pp.28-32
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• 2002

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, therefore it is important to investigate the machining quality of $\mu$ BGA. This paper deals with machining characteristics of the $\mu$ BGA singulation. The relationships between the singulation face and machining quality of the $\mu$ BGA singulation are investigated. It is confirmed that machining quality improves as the singulation force decreases.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.171-174
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• 1997

The great development of semiconductor industry demands the high efficiency and performance of related device, but the pick and place system of semiconductor packaging device can load a few units until nowdays. Although the system can load a lot of units, it can work multiple sort operation. The defect like that causes a low efficiency. Therefore, this paper represents the development of pick and place system which can work multiple sort operation.