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A Study on Machining Characteristics of the Ultraprecision Singualtion of Chip Size Package(CSP)  

김성철 (부산대학교 정밀기계공학과 대학원)
이은상 (인하대학교 기계공학부)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.11, no.3, 2002 , pp. 28-32 More about this Journal
Abstract
Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, therefore it is important to investigate the machining quality of $\mu$ BGA. This paper deals with machining characteristics of the $\mu$ BGA singulation. The relationships between the singulation face and machining quality of the $\mu$ BGA singulation are investigated. It is confirmed that machining quality improves as the singulation force decreases.
Keywords
Singulation; CSingulaction Force; CSP(Chip size package);
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