Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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A Study on Machining Characteristics of the Ultraprecision Singualtion of Chip Size Package(CSP)

CSP의 초정밀 싱귤레이션 가공특성에 관한 연구

  • 김성철 (부산대학교 정밀기계공학과 대학원) ;
  • 이은상 (인하대학교 기계공학부)
  • Published : 2002.06.01
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Abstract

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, therefore it is important to investigate the machining quality of $\mu$ BGA. This paper deals with machining characteristics of the $\mu$ BGA singulation. The relationships between the singulation face and machining quality of the $\mu$ BGA singulation are investigated. It is confirmed that machining quality improves as the singulation force decreases.

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References

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